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AMD XC6VLX195T-2FF1156I
- Part No.:
- XC6VLX195T-2FF1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-2FF1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,775
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Product details
Overview
XC6VLX195T-2FF1156I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 195,168 logic cells, 12.8 Gb/s transceiver capability, and -2 speed grade in a 1156-pin Flip-Chip Fine-Pitch BGA package. It serves as a high-performance programmable logic fabric for reconfigurable digital signal processing in radar baseband subsystems.
For engineers reviewing the XC6VLX195T-2FF1156I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic cell count, I/O voltage support (1.2 V to 3.3 V), and thermal performance in conduction-cooled enclosures.
Technical Context
The XC6VLX195T-2FF1156I implements a hierarchical CLB architecture with six-input LUTs and dual-register flip-flops per slice, supporting synchronous design flows. It integrates 360 DSP48E1 slices operating at up to 400 MHz and 24 RocketIO GTP transceivers with CDR lock range from 600 MHz to 6.6 Gb/s.
Configuration occurs via Master SelectMAP mode using external SPI flash or JTAG boundary-scan, with bitstream encryption enabled via AES-256. Power management includes dynamic power gating of unused I/O banks and partial reconfiguration support through ICAP interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,168 - total configurable logic resources for complex state machines and data-path logic |
| Transceivers | 24 × GTP - supports 600 Mb/s to 6.6 Gb/s serial links with embedded clock-data recovery |
| DSP Slices | 360 × DSP48E1 - enables 400 MHz multiply-accumulate operations for real-time filtering |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports mixed-voltage board interfaces from 1.2 V to 3.3 V |
| Speed Grade | -2 - guarantees timing closure at maximum specified frequencies under industrial temperature (-40°C to +100°C) |
| Package | FF1156 - 1156-pin Flip-Chip BGA with 1.0 mm pitch and 35 × 35 mm body size |
| Configuration | Master SelectMAP or JTAG - enables field-upgradable bitstreams and debug access |
Pinout & Package
XC6VLX195T-2FF1156I uses a 1156-pin Flip-Chip Fine-Pitch BGA (FF1156) package with 35 × 35 mm body, 1.0 mm ball pitch, and thermal lid for industrial-grade thermal dissipation. Pin functions are organized into I/O banks, configuration banks, dedicated clock inputs, and transceiver quads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration logic during Master SelectMAP mode; requires 50 MHz max frequency |
| DIN | Configuration Data Input | Serial bitstream input from SPI flash; latched on rising edge of CCLK |
| INIT_B | Configuration Status | Open-drain active-low signal indicating configuration memory readiness or error |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts load sequence |
| CLK0/CLK1/CLK2 | Dedicated Clock Inputs | Low-skew global clock routing inputs supporting differential signaling (LVDS, LVPECL) |
| GTXA0/GTXA1 | Transceiver Reference Clock | Provides reference clock to GTP transceiver quads; supports 100–625 MHz frequencies |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration | Enables runtime logic module swapping without full device reset, reducing system downtime in mission-critical systems |
| AES-256 Bitstream Encryption | Protects intellectual property by preventing unauthorized readback or cloning of configured logic |
| Dynamic Power Gating | Reduces static power by disabling unused I/O banks, critical for thermally constrained avionics enclosures |
| Embedded Block RAM | 14,544 kbits distributed across 720 × 36-kbit BRAM blocks for low-latency buffering and FIFO implementation |
| PCIe Gen2 Endpoint Support | Integrated hard IP enables x1/x2/x4 lane PCIe endpoint operation without external bridge logic |
Applications
| Radar Baseband Processing | Avionics Data Concentrator |
|---|---|
Use Scenario: Real-time pulse-Doppler signal conditioning and beamforming in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: Configurable digital front-end processor handling ADC sample ingestion, FIR filtering, and FFT acceleration. Use Value: 360 DSP48E1 slices deliver 144 GOPS peak compute for adaptive clutter suppression algorithms. | Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and Ethernet interfaces in flight control computers. IC Role / Device Role / Timing Role: Reconfigurable interface bridge with deterministic latency control and time-stamped packet routing. Use Value: 24 GTP transceivers enable simultaneous multi-protocol serialization with sub-10 ns jitter tolerance. |
| Medical Imaging Accelerator | Industrial Test Equipment Controller |
Use Scenario: High-speed image reconstruction pipeline in portable ultrasound systems using raw channel data from 128-element arrays. IC Role / Device Role / Timing Role: Real-time beamformer and back-end image processor executing parallel scan-conversion and harmonic enhancement. Use Value: 195K logic cells support concurrent execution of 32-channel delay-and-sum and GPU-offloaded post-processing kernels. | Use Scenario: Precision waveform generation and response analysis in automated semiconductor wafer probers. IC Role / Device Role / Timing Role: Deterministic pattern generator with nanosecond-level timing resolution and synchronized analog capture trigger. Use Value: FF1156 package thermal characteristics ensure stable timing margins over 100,000-cycle burn-in test sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 100+ GTY transceivers, higher power consumption | Targets next-generation 5G massive MIMO and AI inference acceleration where XC6VLX195T-2FF1156I lacks bandwidth | Select when >10 Gb/s serial throughput or >200K DSP slices required; not drop-in compatible |
| XC7VX485T-2FFG1157I | Virtex-7 family, 485K logic cells, 36 GTX transceivers, -2 speed grade, 1157-pin FCBGA | Offers higher density and improved transceiver jitter performance for upgraded radar subsystems requiring backward-compatible pinout | XC7VX485T-2FFG1157I provides path to higher capacity while retaining similar PCB layout constraints |
Compared with XC6VLX195T-2FF1156I, the XC7VX485T-2FFG1157I delivers 2.5× more logic and enhanced transceiver specs but requires board redesign due to different ball map; the XCVU9P-2FLGA2104I enables new architectures beyond Virtex-6 capabilities but increases power and cooling requirements significantly.
Availability
XC6VLX195T-2FF1156I is available at Aetrix Electronics and suitable for radar subsystems, avionics data concentrators, and medical imaging accelerators requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX195T-2FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and ACAPs for high-performance computing and embedded systems.
The Virtex-6 family was designed for demanding signal processing, high-speed connectivity, and reconfigurable computing applications in aerospace, defense, and medical equipment.
FAQ
What is the maximum supported transceiver line rate for XC6VLX195T-2FF1156I?
The XC6VLX195T-2FF1156I supports a maximum transceiver line rate of 6.6 Gb/s using its integrated RocketIO GTP transceivers. This specification applies across the full industrial temperature range (-40°C to +100°C) and is validated per the official Virtex-6 DC and Switching Characteristics datasheet (DS152). The XC6VLX195T-2FF1156I achieves this rate with built-in clock-data recovery and adaptive equalization.
Does XC6VLX195T-2FF1156I support partial reconfiguration?
Yes, XC6VLX195T-2FF1156I supports partial reconfiguration through its Internal Configuration Access Port (ICAP) interface. This allows dynamic swapping of logic modules without resetting the entire device, enabling runtime adaptation in systems such as radar waveform generators. The XC6VLX195T-2FF1156I implements this using frame-based bitstream loading and hardware-level isolation between reconfigurable partitions.
What configuration modes are supported by XC6VLX195T-2FF1156I?
XC6VLX195T-2FF1156I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Master SelectMAP is commonly used with external SPI flash for autonomous startup, while JTAG enables boundary-scan testing and in-system programming. The XC6VLX195T-2FF1156I requires proper bank voltage setup and INIT_B assertion timing per DS152 for reliable configuration.
What is the I/O voltage range supported by XC6VLX195T-2FF1156I?
XC6VLX195T-2FF1156I supports I/O voltages from 1.2 V to 3.3 V across its 14 configurable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces on a single device. The XC6VLX195T-2FF1156I requires dedicated VCCO supplies per bank and adheres to strict voltage sequencing per the Virtex-6 Packaging and Pinout Specification (UG371).
Is XC6VLX195T-2FF1156I qualified for industrial temperature operation?
Yes, XC6VLX195T-2FF1156I is rated for industrial temperature operation from -40°C to +100°C ambient. This rating is guaranteed under the -2 speed grade and applies to all core logic, I/O, and transceiver functionality. The XC6VLX195T-2FF1156I meets this specification with validated thermal performance in conduction-cooled mechanical environments per Xilinx documentation.
XC6VLX195T-2FF1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX195T-2FF1156I FAQ
1.How can I place an order for XC6VLX195T-2FF1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-2FF1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX195T-2FF1156I reliable?
The price and inventory of XC6VLX195T-2FF1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-2FF1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX195T-2FF1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-2FF1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX195T-2FF1156I?
XC6VLX195T-2FF1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX195T-2FF1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX195T-2FF1156I?
For technical support, including XC6VLX195T-2FF1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-2FF1156I requirements.
6.How does Aetrix verify that XC6VLX195T-2FF1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-2FF1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-2FF1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-2FF1156I?
All XC6VLX195T-2FF1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-2FF1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-2FF1156I part is unused and in its original packaging.
Return procedure for XC6VLX195T-2FF1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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