AMD XC6VLX195T-2FFG1156C
- Part No.:
- XC6VLX195T-2FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-2FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VLX195T-2FFG1156C from AMD (formerly Xilinx) is a high-performance 40 nm FPGA featuring 195,120 logic cells, 12.8 Gb/s transceiver capability, and integrated PCIe® Gen2 x8 endpoint support. It operates at -2 speed grade with 1.2 V core voltage and targets high-bandwidth data processing in wired communications infrastructure.
For engineers reviewing the XC6VLX195T-2FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, embedded Block RAM capacity, and PCIe endpoint compliance for protocol-aware system integration.
Technical Context
This Virtex-6 LXT device implements a segmented architecture with configurable logic blocks (CLBs), 18×25 DSP48E1 slices, and dual-register 6-input LUTs. It supports SelectIO™ standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gb/s per pin.
The XC6VLX195T-2FFG1156C integrates 12 MGT transceivers with built-in 8B/10B encoding, PRBS generation/checking, and clock correction logic. Its configuration interface supports Master SPI, Slave Serial, and JTAG modes with AES bitstream encryption support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,120 - determines maximum combinational/sequential logic density for custom datapath implementation |
| Block RAM | 10,340 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM |
| Transceivers | 12 × 6.6 Gb/s - enables multi-lane serial protocols like PCIe Gen2, SATA, or CPRI |
| I/O Pins | 600 - supports high-pin-count parallel interfaces or dense peripheral connectivity |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core supply with specified maximum operating frequency |
| Configuration Mode | Master SPI / JTAG - allows standalone boot from flash or debug programming via standard tools |
Pinout & Package
XC6VLX195T-2FFG1156C is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI, BPI, or JTAG) during power-up initialization |
| CCLK | Configuration Clock | Drives internal configuration shift register; sourced externally or generated internally |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device readiness |
| INIT_B | Configuration Initialization | Active-low signal indicating configuration memory readiness and error reset capability |
| VRP/VRN | Reference Voltage Inputs | Provide analog reference for differential I/O standards such as LVDS and RSDS |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Endpoint Hard IP | Integrated endpoint block supporting x1/x2/x4/x8 lane widths with full link training and power management |
| DSP48E1 Slices | 18×25-bit multiplier-accumulator units enabling high-throughput filtering and FFT computation |
| AES Bitstream Encryption | On-chip decryption engine protecting intellectual property against unauthorized readback or cloning |
| SelectIO Technology | Support for 21 I/O standards including SSTL-18, HSTL-I, and LVCMOS33 with programmable slew rate and drive strength |
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset, reducing system downtime in mission-critical applications |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in LTE-Advanced and 5G NR base stations. IC Role / Device Role / Timing Role: Programmable baseband processor implementing PHY-layer algorithms with deterministic latency. Use Value: 12 transceivers enable direct fronthaul interface to remote radio units at 6.6 Gb/s, eliminating external SerDes. | Use Scenario: High-precision signal generation and analysis in automated test systems for semiconductor validation. IC Role / Device Role / Timing Role: Reconfigurable pattern generator and response analyzer synchronized to sub-nanosecond clocks. Use Value: 195K logic cells support concurrent multi-channel waveform synthesis and real-time error detection logic. |
| Medical Imaging Backend | Defense Radar Signal Processing |
Use Scenario: Raw sensor data aggregation and preprocessing from CT/MRI detector arrays before GPU-based reconstruction. IC Role / Device Role / Timing Role: High-bandwidth data concentrator with DMA-controlled memory mapping and scatter-gather buffering. Use Value: 10,340 kbits of Block RAM provides zero-latency frame buffering across 16+ parallel ADC channels. | Use Scenario: Pulse-Doppler processing and beamforming in active electronically scanned array (AESA) radar subsystems. IC Role / Device Role / Timing Role: Deterministic digital signal processor executing matched filtering and CFAR detection in hardware. Use Value: DSP48E1 slices deliver >200 GMAC/s throughput for real-time range-Doppler map generation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based protocol processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-2FFG1156C | 240,000 logic cells, same package and speed grade, higher DSP slice count (24 vs. 18) | Better suited for compute-intensive radar imaging where additional CLBs and DSP resources reduce pipeline stalls | Select when algorithm complexity exceeds XC6VLX195T-2FFG1156C resource utilization by >15% |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, 20 nm process, 324,000 logic cells, no native PCIe Gen2 endpoint (requires soft IP) | Offers higher bandwidth I/O and lower static power but requires revalidation of PCIe stack and timing closure | Choose for new designs targeting longer lifecycle and lower power, not drop-in replacement |
Compared with XC6VLX195T-2FFG1156C, the XC6VLX240T-2FFG1156C delivers scalable logic density within identical thermal and PCB constraints, while the XCKU060-2FFVA1156I shifts design effort toward IP porting and power optimization rather than pin-level compatibility.
Availability
XC6VLX195T-2FFG1156C is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging backend, and defense radar signal processing requiring stable component supply across extended production cycles.
Supply support for XC6VLX195T-2FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and aerospace/defense markets following its acquisition of Xilinx in 2022.
The Virtex-6 family was designed for high-performance serial connectivity and signal processing in wired communications, military avionics, and scientific instrumentation where deterministic timing and protocol offload are critical.
FAQ
What is the maximum supported transceiver data rate for XC6VLX195T-2FFG1156C?
The XC6VLX195T-2FFG1156C supports a maximum transceiver line rate of 6.6 Gb/s per channel. This enables native compliance with PCIe Gen2, SATA II, and CPRI Option 3. The actual achievable rate depends on board layout quality, reference clock jitter, and termination matching - all verified in the XC6VLX195T-2FFG1156C IBIS model and transceiver wizard simulation reports.
Does XC6VLX195T-2FFG1156C include hard IP for PCIe Gen2?
Yes, XC6VLX195T-2FFG1156C integrates a dedicated PCIe Gen2 endpoint hard IP block supporting x1, x2, x4, and x8 configurations. This eliminates the need for soft-core PCIe implementations, reduces logic utilization, and guarantees timing closure per PCI-SIG specifications - a key differentiator of the XC6VLX195T-2FFG1156C within the Virtex-6 LXT series.
What configuration modes does XC6VLX195T-2FFG1156C support?
XC6VLX195T-2FFG1156C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC6VLX195T-2FFG1156C also supports fallback configuration and multi-boot via external flash addressing, enabling field-upgradable firmware without hardware modification.
Is XC6VLX195T-2FFG1156C compatible with Vivado Design Suite?
No - XC6VLX195T-2FFG1156C is supported exclusively by Xilinx ISE Design Suite 14.7 and earlier versions. Vivado does not support Virtex-6 devices. Users must use ISE for synthesis, place-and-route, and bitstream generation; the XC6VLX195T-2FFG1156C cannot be targeted in Vivado projects.
What is the operating temperature range for XC6VLX195T-2FFG1156C?
The XC6VLX195T-2FFG1156C is rated for commercial temperature range (0°C to +85°C ambient), indicated by the 'C' suffix in the part number. It is not qualified for industrial (-40°C to +100°C) or extended temperature operation. Thermal design must ensure junction temperature remains below 100°C under worst-case power dissipation conditions specified in the XC6VLX195T-2FFG1156C datasheet.
XC6VLX195T-2FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX195T-2FFG1156C FAQ
1.How can I place an order for XC6VLX195T-2FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-2FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC6VLX195T-2FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-2FFG1156C is usually 5 days.
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5.How can I obtain technical support or documentation for XC6VLX195T-2FFG1156C?
For technical support, including XC6VLX195T-2FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-2FFG1156C requirements.
6.How does Aetrix verify that XC6VLX195T-2FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-2FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-2FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-2FFG1156C?
All XC6VLX195T-2FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-2FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-2FFG1156C part is unused and in its original packaging.
Return procedure for XC6VLX195T-2FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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