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AMD XC6VLX195T-2FFG1156I
- Part No.:
- XC6VLX195T-2FFG1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-2FFG1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,507
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Product details
Overview
XC6VLX195T-2FFG1156I from AMD (formerly Xilinx) is a high-performance 40 nm FPGA featuring 195,120 logic cells, 12.8 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and is used in high-bandwidth data acquisition and reconfigurable computing systems.
For engineers reviewing the XC6VLX195T-2FFG1156I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600 user I/Os), transceiver lane count (16 lanes), block RAM capacity (10,344 kbits), and thermal design power (17.5 W typical).
Technical Context
The XC6VLX195T-2FFG1156I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 18×25 DSP48E1 slices, and dual-port 36 kbit block RAMs. It supports multi-gigabit serial I/O up to 12.8 Gb/s per transceiver lane using dedicated clocking and equalization circuitry.
This device integrates hard IP for PCI Express Gen2 x8 endpoint, tri-mode Ethernet MACs, and embedded PowerPC 440 microprocessor cores. Configuration occurs via JTAG, Master SelectMAP, or serial PROM interfaces with AES bitstream encryption support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,120 - total programmable LUT/flip-flop pairs for custom digital logic implementation |
| User I/O Pins | 600 - banked, voltage-programmable I/Os supporting LVCMOS, SSTL, HSTL, and differential standards |
| Transceiver Lanes | 16 - each capable of 600 Mb/s to 12.8 Gb/s, enabling protocols like PCIe, SRIO, and CPRI |
| Block RAM | 10,344 kbits - distributed as 36-kbit dual-port RAM primitives for on-chip data buffering |
| DSP Slices | 720 - each with 25×18 multiplier, 48-bit accumulator, and pipeline registers for high-speed arithmetic |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC6VLX195T-2FFG1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant construction. The package supports thermal dissipation via exposed thermal pad and provides signal integrity optimized routing for high-speed serial I/O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, JTAG, and select I/O banks; shared across multiple banks |
| VCCO | I/O bank power | Programmable voltage (1.2–3.3 V) per I/O bank; defines signaling standard compatibility |
| MR | Master reset input | Active-low asynchronous reset that clears configuration memory and halts startup sequence |
| CCLK | Configuration clock | Input clock for Master SelectMAP configuration mode; frequency ≤ 100 MHz |
| GTX_CLK | Transceiver reference clock | Differential input driving PLLs for multi-gigabit transceivers; must meet jitter and slew rate specs |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint Hard IP | Reduces integration effort and verification time for host interface designs; no soft-core resource consumption |
| Integrated PowerPC 440 Cores | Enables embedded processing alongside programmable logic; supports Linux BSP and real-time OS execution |
| AES Bitstream Encryption | Protects intellectual property against reverse engineering and unauthorized configuration loading |
| Multi-Standard I/O Banks | Allows mixed-voltage interfaces on single device-e.g., 1.8 V LVDS with 3.3 V CMOS on adjacent banks |
| Dynamic Reconfiguration | Enables partial bitstream updates without full device reset-critical for fault-tolerant and adaptive systems |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and CFAR algorithms; GTX transceivers interface with ADC/DAC modules. Use Value: 16 transceiver lanes enable direct connection to 8-channel 1 GSPS ADCs; 720 DSP slices sustain >20 GOPS real-time computation. | Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Configurable logic accelerates back-projection and denoising kernels; PCIe Gen2 x8 provides 4 GB/s host memory access. Use Value: Block RAM capacity supports on-chip storage of 256×256 sinogram buffers; PowerPC core manages system control and data flow. |
| Industrial Machine Vision | Defense Communications |
Use Scenario: Sub-millisecond latency object detection and classification on factory-floor vision systems. IC Role / Device Role / Timing Role: Logic fabric runs convolutional neural network inference; LVDS I/O drives high-resolution camera sensors. Use Value: 600 user I/Os support simultaneous connection to four 12-bit 100-MHz CMOS image sensors and GigE PHYs. | Use Scenario: Secure, jam-resistant waveform generation and demodulation in tactical radios. IC Role / Device Role / Timing Role: FPGA implements channelized SDR baseband processing; AES encryption secures configuration and payload data. Use Value: Industrial temp rating ensures operation in uncontrolled vehicle-mounted enclosures; dynamic reconfiguration enables waveform agility. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-2FFG1156I | 240,000 logic cells, 12 additional transceiver lanes, higher TDP (21.5 W) | Required when >195K LCs or >16 GT lanes needed; same package footprint | Select if design scales beyond XC6VLX195T-2FFG1156I resources but retains identical board layout |
| XCKU060-2FFVA1156I | UltraScale architecture, 340K logic cells, 20 GTY transceivers up to 32.75 Gb/s, different pinout | Supports next-gen protocols (PCIe Gen3, 100G Ethernet); not pin-compatible | Choose for migration path requiring higher bandwidth and density; requires PCB redesign |
Compared with XC6VLX195T-2FFG1156I, the XC6VLX240T offers headroom within the same package, while the XCKU060 delivers architectural advancement at the cost of layout change-making the former ideal for incremental scaling and the latter for generational upgrades.
Availability
XC6VLX195T-2FFG1156I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and industrial machine vision systems requiring stable component supply across long production lifecycles.
Supply support for XC6VLX195T-2FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, ACAPs, and AI processors for data center, edge, and embedded markets.
The Virtex-6 family-including XC6VLX195T-2FFG1156I-was engineered for high-performance, serial connectivity-intensive applications such as wired communications, defense systems, and scientific instrumentation.
FAQ
What is the maximum supported transceiver data rate for XC6VLX195T-2FFG1156I?
The XC6VLX195T-2FFG1156I supports transceiver data rates from 600 Mb/s up to 12.8 Gb/s per lane. This range accommodates protocols including PCIe Gen2, Serial RapidIO, and CPRI. Performance is guaranteed under industrial temperature conditions and depends on proper reference clock jitter compliance and PCB interconnect design.
Does XC6VLX195T-2FFG1156I include hard IP for PCI Express?
Yes, XC6VLX195T-2FFG1156I integrates a hard PCIe Gen2 x8 endpoint block. This eliminates the need for soft-core implementations, reduces logic utilization, and ensures deterministic latency and compliance with PCIe specification requirements.
What configuration modes are supported by XC6VLX195T-2FFG1156I?
XC6VLX195T-2FFG1156I supports JTAG, Master SelectMAP, and Serial Peripheral Interface (SPI) PROM configuration modes. Master SelectMAP allows high-speed parallel configuration via external memory, while JTAG is used for debugging and boundary-scan testing during development.
Is XC6VLX195T-2FFG1156I qualified for industrial temperature operation?
Yes, XC6VLX195T-2FFG1156I is rated for industrial temperature range (-40°C to +100°C). This qualification applies to all speed grades marked with suffix 'I', including the -2FFG1156I variant, and is verified per Xilinx/AMD qualification standards.
How many block RAM primitives does XC6VLX195T-2FFG1156I provide?
XC6VLX195T-2FFG1156I provides 288 block RAM primitives, each configured as 36 kbits dual-port RAM. This totals 10,344 kbits of on-chip memory, usable for FIFOs, lookup tables, or frame buffers without consuming logic resources.
XC6VLX195T-2FFG1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX195T-2FFG1156I FAQ
1.How can I place an order for XC6VLX195T-2FFG1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-2FFG1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX195T-2FFG1156I reliable?
The price and inventory of XC6VLX195T-2FFG1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-2FFG1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX195T-2FFG1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-2FFG1156I transactions.
Note: Certain payment methods may incur a processing fee.
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XC6VLX195T-2FFG1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX195T-2FFG1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX195T-2FFG1156I?
For technical support, including XC6VLX195T-2FFG1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-2FFG1156I requirements.
6.How does Aetrix verify that XC6VLX195T-2FFG1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-2FFG1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-2FFG1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-2FFG1156I?
All XC6VLX195T-2FFG1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-2FFG1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-2FFG1156I part is unused and in its original packaging.
Return procedure for XC6VLX195T-2FFG1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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