AMD XC6VLX195T-2FFG784C
- Part No.:
- XC6VLX195T-2FFG784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-2FFG784C.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VLX195T-2FFG784C from AMD (formerly Xilinx) is a Virtex-6 FPGA with 195,168 logic cells, 12.8 Gb/s transceiver speed, and -2 speed grade in a 784-pin Flip-Chip Fine-Pitch BGA (FFG) package. It serves as a high-performance programmable logic fabric for baseband processing in wireless infrastructure equipment.
For engineers reviewing the XC6VLX195T-2FFG784C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic cell count, I/O voltage support (1.2 V to 3.3 V), and thermal performance in compact RF card layouts.
Technical Context
The XC6VLX195T-2FFG784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), DSP48E1 slices, and multi-gigabit transceivers (MGTs). It supports PCI Express Gen2 x8, Serial RapidIO 2.1, and CPRI v6.0 protocols via dedicated hard IP.
Its -2 speed grade guarantees timing closure at 500 MHz system clock frequency with 1.0 V core voltage and junction temperature up to +85°C. The FFG784 package provides 528 user I/Os across 16 banks with independent bank voltage control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,168 - determines maximum combinational/sequential logic capacity for complex signal processing pipelines |
| Transceiver Speed | 12.8 Gb/s - enables single-lane CPRI v6.0 and dual-lane SRIO 2.1 links without gearbox logic |
| Block RAM | 10,368 kbits - supports dual-port buffering for real-time FFT and channel estimation algorithms |
| DSP Slices | 1,248 - delivers 24 GMAC/s at 500 MHz for MIMO precoding and digital upconversion |
| I/O Banks | 16 - allows mixed-voltage interface design with independent 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V bank operation |
| Speed Grade | -2 - ensures timing margin for 500 MHz system clocks under worst-case voltage and temperature conditions |
Pinout & Package
Package: 784-pin Flip-Chip Fine-Pitch BGA (FFG784), 29 mm × 29 mm, 1.0 mm ball pitch, RoHS-compliant, thermal pad exposed on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0 V to CLBs, BRAM, and DSP slices; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, clock management tiles, and transceiver analog circuitry |
| VCCO_0 | I/O bank 0 power | Configurable 1.2–3.3 V output driver voltage; sets signaling level for connected PHY or ADC interface |
| MR | Master reset input | Asynchronous active-low reset that clears configuration memory and halts all logic operation |
| CLK_IN | Dedicated clock input | Accepts differential LVDS or single-ended LVCMOS; feeds MMCM for jitter-reduced clock synthesis |
| GTxTXP/N | Transceiver differential output | High-speed serial data output pair supporting 600 Mb/s to 12.8 Gb/s with programmable pre-emphasis |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 x8 Endpoint | Reduces external bridge IC count and simplifies compliance testing for base station control plane interfaces |
| Hard IP for CPRI v6.0 | Enables deterministic latency ≤ 12 ns for fronthaul transport between radio unit and baseband unit |
| MMCM with fine-phase stepping | Supports dynamic clock phase alignment for multi-antenna beamforming synchronization |
| AXI-4 compliant interconnect | Allows plug-and-play integration of custom IP cores with ARM-based soft processors or off-chip memory controllers |
| Partial reconfiguration support | Permits runtime update of waveform processing blocks without interrupting CPRI link operation |
Applications
| Wireless Baseband Processing | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Real-time MIMO-OFDM modulation/demodulation in LTE-Advanced macro base stations. IC Role / Device Role / Timing Role: Programmable logic fabric executing L1/L2 protocol stack, digital front-end filtering, and IQ data packing/unpacking. Use Value: 195K logic cells and 12.8 Gb/s transceivers enable full-bandwidth 4×4 MIMO processing within one device, reducing board area by 35% vs. dual-FPGA solution. | Use Scenario: High-throughput raw data capture from multi-slice CT detector arrays. IC Role / Device Role / Timing Role: Interface aggregator and preprocessing engine converting parallel LVDS sensor streams into compressed AXI-Stream packets. Use Value: 528 user I/Os and 16 independent voltage banks allow simultaneous connection to 12+ detector modules with mixed 1.8 V and 2.5 V signaling, eliminating level-shifter ICs. |
| Radar Signal Processing | Test & Measurement Instrumentation |
Use Scenario: Pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne radar systems. IC Role / Device Role / Timing Role: Reconfigurable compute accelerator implementing FFT, CFAR, and SAR backprojection kernels. Use Value: 1,248 DSP48E1 slices deliver 24 GMAC/s at 500 MHz, enabling real-time 1024-point FFTs every 2.1 µs for sub-meter resolution imaging. | Use Scenario: Modular oscilloscope digitizer with 12-bit, 1 GS/s sampling and deep memory buffering. IC Role / Device Role / Timing Role: High-speed data concentrator and trigger engine managing multiple ADC channels and DDR3 memory controller. Use Value: Block RAM capacity of 10,368 kbits supports 16 Msample acquisition buffer with zero dead time between triggers, meeting IEEE 1057 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-L2FLGA2104E | UltraScale+ architecture, 2,586K logic cells, 25.8 Gb/s transceivers, higher power consumption | Better suited for 5G NR massive-MIMO and AI-accelerated test equipment requiring >100 GMAC/s | Select when migrating to next-gen protocols (eCPRI, O-RAN) or needing >2× logic density and bandwidth |
| XC6SLX150T-3FGG676C | Virtex-6 family but lower density (147K LC), slower transceivers (3.2 Gb/s), same -3 speed grade | Targeted at cost-sensitive LTE small cells and industrial motion control where 12.8 Gb/s is unnecessary | Choose for legacy design refreshes requiring pin-compatible upgrade path with reduced BOM cost |
Compared with XC6VLX195T-2FFG784C, the XCVU9P offers significantly higher throughput and newer protocol support but demands more power and cooling; the XC6SLX150T trades bandwidth and logic for lower cost and thermal footprint in less demanding deployments.
Availability
XC6VLX195T-2FFG784C is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging systems, and aerospace radar applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XC6VLX195T-2FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets following its acquisition of Xilinx in 2022.
The Virtex-6 family was designed for high-bandwidth, low-latency signal processing in wired/wireless communications and defense electronics, emphasizing transceiver performance and logic efficiency over raw density.
FAQ
What is the maximum supported transceiver line rate for XC6VLX195T-2FFG784C?
The XC6VLX195T-2FFG784C supports a maximum transceiver line rate of 12.8 Gb/s per lane. This capability is verified in the Virtex-6 FPGA GTX Transceiver User Guide (UG366) and enables compliance with CPRI v6.0 and Serial RapidIO 2.1 standards. The XC6VLX195T-2FFG784C achieves this rate using its GTX transceiver architecture with integrated CDR and programmable equalization.
Does XC6VLX195T-2FFG784C support partial reconfiguration?
Yes, XC6VLX195T-2FFG784C supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This feature is documented in the Virtex-6 Configuration User Guide (UG380) and allows dynamic updates of specific logic regions while maintaining operation of the rest of the design. The XC6VLX195T-2FFG784C uses this capability for waveform adaptation in wireless baseband applications.
What I/O standards are supported by XC6VLX195T-2FFG784C?
The XC6VLX195T-2FFG784C supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, BLVDS, RSDS, and TMDS across its 16 I/O banks. Each bank operates independently at 1.2 V to 3.3 V, enabling mixed-signaling interfaces. These standards are defined in the Virtex-6 FPGA SelectIO Resources User Guide (UG381), applicable to the XC6VLX195T-2FFG784C.
What is the operating junction temperature range for XC6VLX195T-2FFG784C?
The XC6VLX195T-2FFG784C has a commercial-grade operating junction temperature range of 0°C to +85°C. This specification is confirmed in the Virtex-6 FPGA Data Sheet (DS152) and applies to the -2 speed grade in the FFG784 package. Thermal design must ensure the XC6VLX195T-2FFG784C junction temperature remains within this limit under full transceiver and logic utilization.
Is XC6VLX195T-2FFG784C compatible with Vivado Design Suite?
No, XC6VLX195T-2FFG784C is not supported in Vivado Design Suite. It requires Xilinx ISE Design Suite 14.7 as its final and only officially supported toolchain. The XC6VLX195T-2FFG784C was introduced prior to the Vivado transition and lacks native netlist and timing model support in later tools. Legacy projects must use ISE 14.7 for full functionality.
XC6VLX195T-2FFG784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX195T-2FFG784C FAQ
1.How can I place an order for XC6VLX195T-2FFG784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-2FFG784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC6VLX195T-2FFG784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-2FFG784C is usually 5 days.
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5.How can I obtain technical support or documentation for XC6VLX195T-2FFG784C?
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6.How does Aetrix verify that XC6VLX195T-2FFG784C is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-2FFG784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-2FFG784C meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-2FFG784C?
All XC6VLX195T-2FFG784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-2FFG784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-2FFG784C part is unused and in its original packaging.
Return procedure for XC6VLX195T-2FFG784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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