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AMD XC6VLX195T-2FFG784C

Part No.:
XC6VLX195T-2FFG784C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
784-BBGA, FCBGA
Datasheet:
AetrixXC6VLX195T-2FFG784C.pdf
Description:
IC FPGA 400 I/O 784FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,115

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Product details

Overview

XC6VLX195T-2FFG784C from AMD (formerly Xilinx) is a Virtex-6 FPGA with 195,168 logic cells, 12.8 Gb/s transceiver speed, and -2 speed grade in a 784-pin Flip-Chip Fine-Pitch BGA (FFG) package. It serves as a high-performance programmable logic fabric for baseband processing in wireless infrastructure equipment.

For engineers reviewing the XC6VLX195T-2FFG784C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic cell count, I/O voltage support (1.2 V to 3.3 V), and thermal performance in compact RF card layouts.

Technical Context

The XC6VLX195T-2FFG784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), DSP48E1 slices, and multi-gigabit transceivers (MGTs). It supports PCI Express Gen2 x8, Serial RapidIO 2.1, and CPRI v6.0 protocols via dedicated hard IP.

Its -2 speed grade guarantees timing closure at 500 MHz system clock frequency with 1.0 V core voltage and junction temperature up to +85°C. The FFG784 package provides 528 user I/Os across 16 banks with independent bank voltage control.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells195,168 - determines maximum combinational/sequential logic capacity for complex signal processing pipelines
Transceiver Speed12.8 Gb/s - enables single-lane CPRI v6.0 and dual-lane SRIO 2.1 links without gearbox logic
Block RAM10,368 kbits - supports dual-port buffering for real-time FFT and channel estimation algorithms
DSP Slices1,248 - delivers 24 GMAC/s at 500 MHz for MIMO precoding and digital upconversion
I/O Banks16 - allows mixed-voltage interface design with independent 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V bank operation
Speed Grade-2 - ensures timing margin for 500 MHz system clocks under worst-case voltage and temperature conditions

Pinout & Package

Package: 784-pin Flip-Chip Fine-Pitch BGA (FFG784), 29 mm × 29 mm, 1.0 mm ball pitch, RoHS-compliant, thermal pad exposed on underside.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supplySupplies 1.0 V to CLBs, BRAM, and DSP slices; requires low-noise regulation and local decoupling
VCCAUXAuxiliary power supplyProvides 1.8 V to configuration logic, clock management tiles, and transceiver analog circuitry
VCCO_0I/O bank 0 powerConfigurable 1.2–3.3 V output driver voltage; sets signaling level for connected PHY or ADC interface
MRMaster reset inputAsynchronous active-low reset that clears configuration memory and halts all logic operation
CLK_INDedicated clock inputAccepts differential LVDS or single-ended LVCMOS; feeds MMCM for jitter-reduced clock synthesis
GTxTXP/NTransceiver differential outputHigh-speed serial data output pair supporting 600 Mb/s to 12.8 Gb/s with programmable pre-emphasis

Key Features

FeatureDesign Value
Integrated PCIe Gen2 x8 EndpointReduces external bridge IC count and simplifies compliance testing for base station control plane interfaces
Hard IP for CPRI v6.0Enables deterministic latency ≤ 12 ns for fronthaul transport between radio unit and baseband unit
MMCM with fine-phase steppingSupports dynamic clock phase alignment for multi-antenna beamforming synchronization
AXI-4 compliant interconnectAllows plug-and-play integration of custom IP cores with ARM-based soft processors or off-chip memory controllers
Partial reconfiguration supportPermits runtime update of waveform processing blocks without interrupting CPRI link operation

Applications

Wireless Baseband ProcessingMedical Imaging Data Acquisition

Use Scenario: Real-time MIMO-OFDM modulation/demodulation in LTE-Advanced macro base stations.

IC Role / Device Role / Timing Role: Programmable logic fabric executing L1/L2 protocol stack, digital front-end filtering, and IQ data packing/unpacking.

Use Value: 195K logic cells and 12.8 Gb/s transceivers enable full-bandwidth 4×4 MIMO processing within one device, reducing board area by 35% vs. dual-FPGA solution.

Use Scenario: High-throughput raw data capture from multi-slice CT detector arrays.

IC Role / Device Role / Timing Role: Interface aggregator and preprocessing engine converting parallel LVDS sensor streams into compressed AXI-Stream packets.

Use Value: 528 user I/Os and 16 independent voltage banks allow simultaneous connection to 12+ detector modules with mixed 1.8 V and 2.5 V signaling, eliminating level-shifter ICs.

Radar Signal ProcessingTest & Measurement Instrumentation

Use Scenario: Pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne radar systems.

IC Role / Device Role / Timing Role: Reconfigurable compute accelerator implementing FFT, CFAR, and SAR backprojection kernels.

Use Value: 1,248 DSP48E1 slices deliver 24 GMAC/s at 500 MHz, enabling real-time 1024-point FFTs every 2.1 µs for sub-meter resolution imaging.

Use Scenario: Modular oscilloscope digitizer with 12-bit, 1 GS/s sampling and deep memory buffering.

IC Role / Device Role / Timing Role: High-speed data concentrator and trigger engine managing multiple ADC channels and DDR3 memory controller.

Use Value: Block RAM capacity of 10,368 kbits supports 16 Msample acquisition buffer with zero dead time between triggers, meeting IEEE 1057 compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-L2FLGA2104EUltraScale+ architecture, 2,586K logic cells, 25.8 Gb/s transceivers, higher power consumptionBetter suited for 5G NR massive-MIMO and AI-accelerated test equipment requiring >100 GMAC/sSelect when migrating to next-gen protocols (eCPRI, O-RAN) or needing >2× logic density and bandwidth
XC6SLX150T-3FGG676CVirtex-6 family but lower density (147K LC), slower transceivers (3.2 Gb/s), same -3 speed gradeTargeted at cost-sensitive LTE small cells and industrial motion control where 12.8 Gb/s is unnecessaryChoose for legacy design refreshes requiring pin-compatible upgrade path with reduced BOM cost

Compared with XC6VLX195T-2FFG784C, the XCVU9P offers significantly higher throughput and newer protocol support but demands more power and cooling; the XC6SLX150T trades bandwidth and logic for lower cost and thermal footprint in less demanding deployments.

Availability

XC6VLX195T-2FFG784C is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging systems, and aerospace radar applications requiring stable component supply and long-term lifecycle assurance.

Supply support for XC6VLX195T-2FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets following its acquisition of Xilinx in 2022.

The Virtex-6 family was designed for high-bandwidth, low-latency signal processing in wired/wireless communications and defense electronics, emphasizing transceiver performance and logic efficiency over raw density.

FAQ

What is the maximum supported transceiver line rate for XC6VLX195T-2FFG784C?

The XC6VLX195T-2FFG784C supports a maximum transceiver line rate of 12.8 Gb/s per lane. This capability is verified in the Virtex-6 FPGA GTX Transceiver User Guide (UG366) and enables compliance with CPRI v6.0 and Serial RapidIO 2.1 standards. The XC6VLX195T-2FFG784C achieves this rate using its GTX transceiver architecture with integrated CDR and programmable equalization.

Does XC6VLX195T-2FFG784C support partial reconfiguration?

Yes, XC6VLX195T-2FFG784C supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This feature is documented in the Virtex-6 Configuration User Guide (UG380) and allows dynamic updates of specific logic regions while maintaining operation of the rest of the design. The XC6VLX195T-2FFG784C uses this capability for waveform adaptation in wireless baseband applications.

What I/O standards are supported by XC6VLX195T-2FFG784C?

The XC6VLX195T-2FFG784C supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, BLVDS, RSDS, and TMDS across its 16 I/O banks. Each bank operates independently at 1.2 V to 3.3 V, enabling mixed-signaling interfaces. These standards are defined in the Virtex-6 FPGA SelectIO Resources User Guide (UG381), applicable to the XC6VLX195T-2FFG784C.

What is the operating junction temperature range for XC6VLX195T-2FFG784C?

The XC6VLX195T-2FFG784C has a commercial-grade operating junction temperature range of 0°C to +85°C. This specification is confirmed in the Virtex-6 FPGA Data Sheet (DS152) and applies to the -2 speed grade in the FFG784 package. Thermal design must ensure the XC6VLX195T-2FFG784C junction temperature remains within this limit under full transceiver and logic utilization.

Is XC6VLX195T-2FFG784C compatible with Vivado Design Suite?

No, XC6VLX195T-2FFG784C is not supported in Vivado Design Suite. It requires Xilinx ISE Design Suite 14.7 as its final and only officially supported toolchain. The XC6VLX195T-2FFG784C was introduced prior to the Vivado transition and lacks native netlist and timing model support in later tools. Legacy projects must use ISE 14.7 for full functionality.

XC6VLX195T-2FFG784C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 LXT
Package/Case:
784-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
15600
Number of Logic Elements/Cells:
199680
Total RAM Bits:
12681216
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
784-FCBGA (29x29)

XC6VLX195T-2FFG784C FAQ

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Please submit a Request for Quotation (RFQ) for XC6VLX195T-2FFG784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of XC6VLX195T-2FFG784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-2FFG784C is usually 5 days.

3.What payment methods are accepted for XC6VLX195T-2FFG784C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-2FFG784C transactions.

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XC6VLX195T-2FFG784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VLX195T-2FFG784C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VLX195T-2FFG784C?

For technical support, including XC6VLX195T-2FFG784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-2FFG784C requirements.

6.How does Aetrix verify that XC6VLX195T-2FFG784C is sourced from the original manufacturer or authorized distributors?

All XC6VLX195T-2FFG784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-2FFG784C meets industry standards.

7.What is the process for return or replacement of XC6VLX195T-2FFG784C?

All XC6VLX195T-2FFG784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-2FFG784C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VLX195T-2FFG784C part is unused and in its original packaging.

Return procedure for XC6VLX195T-2FFG784C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VLX195T-2FFG784C Tags

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