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AMD XC6VLX195T-2FFG784I
- Part No.:
- XC6VLX195T-2FFG784I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-2FFG784I.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,996
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Product details
Overview
XC6VLX195T-2FFG784I from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA featuring 195,168 logic cells, 12.8 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and is used in high-bandwidth wired communications infrastructure.
For engineers reviewing the XC6VLX195T-2FFG784I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O voltage flexibility (1.2V–3.3V), block RAM depth, DSP48E1 slice count, and thermal performance under sustained routing congestion.
Technical Context
The XC6VLX195T-2FFG784I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 18×25 multipliers in DSP48E1 slices, and 36-Kb block RAMs with true dual-port capability. It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gb/s per pin.
Its transceivers comply with PCIe Gen2, SATA, and CPRI protocols, and the device includes dedicated clock management tiles with MMCM and PLL for jitter reduction. Configuration occurs via serial PROM or JTAG, supporting bitstream encryption and fallback modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,168 - determines maximum combinational/sequential logic capacity for complex control and datapath functions |
| Block RAM | 10,340 Kb - enables large on-chip buffering for packet processing, video frame storage, or FIFO implementation |
| DSP Slices | 768 DSP48E1 - supports parallel multiply-accumulate operations at up to 550 MHz for signal processing pipelines |
| Transceiver Speed | 12.8 Gb/s - enables single-lane CPRI v6.0 or dual-lane 10GBASE-R Ethernet PHY implementation |
| I/O Standards | LVDS, SSTL-18/25, HSTL-I/II - allows direct interface to DDR2/DDR3 memory, ADCs, DACs, and SERDES peripherals |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core supply with worst-case industrial temperature derating |
Pinout & Package
XC6VLX195T-2FFG784I is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35x35 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant construction. Thermal pad on underside requires solder paste stencil aperture for optimal heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% supply for CLB, RAM, and DSP logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, clock management, and transceiver reference circuitry |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3 V output driver supply per bank; sets compatible interface voltage levels |
| MRCC/MRCC_N | Multi-Gigabit Transceiver RefClk | Differential reference clock input for transceiver PLL; must meet phase noise <1.5 ps RMS (12 kHz–20 MHz) |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP eliminates need for external bridge IC and reduces latency in host-facing acceleration cards |
| Transceiver Power Management | Per-channel power-down and dynamic rate switching reduce active power by up to 40% during low-traffic intervals |
| Bitstream Encryption | AES-256 decryption with HMAC authentication prevents unauthorized configuration and intellectual property theft |
| Partial Reconfiguration Support | Enables runtime module swapping without system reset-critical for adaptive radio and real-time protocol stacks |
| Advanced Clocking | MMCM with fine-phase shift and spread-spectrum modulation supports jitter-sensitive SerDes and high-speed memory interfaces |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital predistortion (DPD) and MIMO signal conditioning in LTE-A and 5G NR macro base stations. IC Role / Device Role / Timing Role: Programmable baseband processor implementing adaptive filtering, FFT/IFFT, and channel estimation pipelines. Use Value: 768 DSP48E1 slices enable concurrent execution of 4× 2048-point FFTs at 200 MHz, meeting 3GPP subframe timing constraints. | Use Scenario: High-resolution waveform generation and analysis in automated test equipment for semiconductor validation. IC Role / Device Role / Timing Role: Real-time pattern generator and error detector with deterministic latency and sub-nanosecond timing alignment. Use Value: 12.8 Gb/s transceivers drive 100 GbE test ports while block RAMs store multi-gigasample capture buffers with zero CPU intervention. |
| Avionics Data Concentrators | Industrial Imaging Systems |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control data networks. IC Role / Device Role / Timing Role: Deterministic network switch with time-triggered scheduling and hardware-based traffic shaping. Use Value: -2 speed grade ensures guaranteed timing closure across full temperature range, critical for DO-254 certification evidence. | Use Scenario: Multi-sensor fusion and real-time image stitching in medical endoscopy and machine vision inspection systems. IC Role / Device Role / Timing Role: Pixel-level pipeline accelerator with synchronized camera sensor interfaces and DDR3 memory controller. Use Value: SelectIO support for LVDS and Sub-LVDS enables direct connection to 12-bit, 120-MHz CMOS image sensors without level-shifting components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | 16 nm process, 2.5× higher logic density, 33.6 Gb/s transceivers, no native PCIe Gen2 endpoint hard IP | Targets next-gen 400G optical transport and AI inference acceleration where bandwidth exceeds Virtex-6 limits | Choose XC6VLX195T-2FFG784I when PCIe Gen2 endpoint integration, mature toolchain (ISE 14.7), and long-term availability are required |
| XC7K325T-2FFG901I | 28 nm process, lower logic count (326,080 LUTs), 12.5 Gb/s transceivers, PCIe Gen3 x8 endpoint, reduced block RAM (17.1 Mb) | Suitable for cost-optimized mid-range applications requiring Gen3 compatibility but less DSP and memory bandwidth | Choose XC6VLX195T-2FFG784I when legacy 40nm radiation tolerance, higher block RAM, or existing ISE-based design reuse is mandatory |
Compared with XCVU9P-2FLGA2104I and XC7K325T-2FFG901I, the XC6VLX195T-2FFG784I delivers proven industrial temperature reliability, hardened PCIe Gen2 endpoint logic, and mature qualification for avionics and telecom infrastructure-without requiring migration to Vivado or new PCB layout.
Availability
XC6VLX195T-2FFG784I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX195T-2FFG784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Virtex product line as its flagship high-performance FPGA family for compute-intensive and protocol-critical applications.
The Virtex-6 family was designed specifically for wired communications infrastructure, military/aerospace systems, and high-end instrumentation requiring deterministic timing, high transceiver bandwidth, and long-term manufacturing stability.
FAQ
What is the maximum supported transceiver line rate for XC6VLX195T-2FFG784I?
The XC6VLX195T-2FFG784I supports a maximum transceiver line rate of 12.8 Gb/s per lane. This enables compliance with CPRI v6.0, 10GBASE-R Ethernet, and SATA III protocols. The transceiver architecture includes built-in clock data recovery (CDR), elastic buffers, and PRBS pattern generators for physical layer validation. All transceiver banks operate within the -40°C to +100°C industrial temperature range without derating.
Does XC6VLX195T-2FFG784I include a hard PCIe Gen2 endpoint block?
Yes, the XC6VLX195T-2FFG784I integrates a dedicated hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. It supports both root complex and endpoint configurations, provides AXI4-Stream and AXI4-Lite interfaces, and includes MSI/MSI-X interrupt handling. This eliminates the need for soft IP or external bridge chips in acceleration card designs using the XC6VLX195T-2FFG784I.
What configuration modes does XC6VLX195T-2FFG784I support?
The XC6VLX195T-2FFG784I supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. Configuration can be initiated from SPI flash, BPI flash, or external microcontroller via parallel bus. Bitstream encryption and HMAC authentication are enabled through the eFUSE-based key storage. The XC6VLX195T-2FFG784I also supports fallback configuration and multi-boot with dual-image storage in external flash.
Is XC6VLX195T-2FFG784I qualified for industrial temperature operation?
Yes, the XC6VLX195T-2FFG784I is rated for industrial temperature operation from -40°C to +100°C. This rating applies to all logic, I/O, and transceiver functionality under specified voltage and loading conditions. Thermal performance data-including junction-to-case resistance (θJC = 0.35°C/W) and recommended heatsink requirements-is documented in the Virtex-6 Packaging and Pinout Product Specification (UG371).
What development tools are required for XC6VLX195T-2FFG784I?
The XC6VLX195T-2FFG784I requires Xilinx ISE Design Suite 14.7 as the official synthesis, implementation, and programming toolchain. It is not supported in Vivado. ISE 14.7 provides full timing analysis, place-and-route optimization, and bitstream generation for the Virtex-6 architecture. Device-specific simulation models and IBIS files for the XC6VLX195T-2FFG784I are included in the ISE installation and available separately from AMD's support portal.
XC6VLX195T-2FFG784I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX195T-2FFG784I FAQ
1.How can I place an order for XC6VLX195T-2FFG784I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-2FFG784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX195T-2FFG784I reliable?
The price and inventory of XC6VLX195T-2FFG784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-2FFG784I is usually 5 days.
3.What payment methods are accepted for XC6VLX195T-2FFG784I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-2FFG784I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX195T-2FFG784I?
XC6VLX195T-2FFG784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX195T-2FFG784I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX195T-2FFG784I?
For technical support, including XC6VLX195T-2FFG784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-2FFG784I requirements.
6.How does Aetrix verify that XC6VLX195T-2FFG784I is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-2FFG784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-2FFG784I meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-2FFG784I?
All XC6VLX195T-2FFG784I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-2FFG784I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-2FFG784I part is unused and in its original packaging.
Return procedure for XC6VLX195T-2FFG784I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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