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AMD XC6VLX195T-3FF784C

Part No.:
XC6VLX195T-3FF784C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
784-BBGA, FCBGA
Datasheet:
AetrixXC6VLX195T-3FF784C.pdf
Description:
IC FPGA 400 I/O 784FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,880

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Product details

Overview

XC6VLX195T-3FF784C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 195,168 logic cells, 12.8 Gb/s transceiver capability, and 1,200 DSP slices. It implements complex digital signal processing, high-speed serial interface bridging, and real-time protocol acceleration in radar processing systems.

For engineers reviewing the XC6VLX195T-3FF784C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (24 lanes), thermal design power (22.5 W), and -3 speed grade timing compliance.

Technical Context

The XC6VLX195T-3FF784C integrates 24 multi-gigabit transceivers operating up to 11.18 Gb/s with built-in 8B/10B encoding and PRBS generation. Its fabric includes block RAM (BRAM) totaling 12,544 kbits and clock management tiles (CMT) with dual MMCM and PLL for jitter reduction and phase alignment.

It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling across 544 user I/O pins. Configuration is performed via Master SPI, Slave Serial, or JTAG, with bitstream encryption enabled through AES-256 and HMAC authentication.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells195,168 - determines maximum combinational and sequential logic capacity for RTL implementation
Transceiver Lanes24 - enables concurrent high-speed serial links such as PCIe Gen2, SRIO, or CPRI
DSP Slices1,200 - provides dedicated hardware for multiply-accumulate operations in filter and FFT engines
Block RAM12,544 kbits - supports large on-chip data buffering and FIFO construction without external memory
I/O Pins544 - delivers flexible interface connectivity across multiple voltage standards and signaling types
Speed Grade-3 - guarantees worst-case timing performance at highest operating frequency for critical paths
TDP22.5 W - defines thermal envelope requiring active heatsink and airflow in dense PCB layouts

Pinout & Package

XC6VLX195T-3FF784C is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG784) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free RoHS-compliant finish. Thermal pad on underside requires solder paste stencil design per Xilinx UG373.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply1.0 V ±3% regulated input powering CLBs, BRAM, and interconnect
VCCAUXAuxiliary supply2.5 V ±5% powering configuration logic, clock management, and transceivers
VCCO_0I/O bank supplyConfigurable 1.2–3.3 V per bank enabling mixed-voltage interface operation
M0–M2Mode pinsSet configuration mode at power-up (e.g., Master SPI, JTAG)
INIT_BStatus indicatorOpen-drain output signaling configuration status and error detection
CLK_INPrimary clock inputDedicated global clock pin routed to CMT for low-skew distribution
GTxTXP/NTransceiver outputDifferential high-speed serial transmit pair supporting 600 Mb/s–11.18 Gb/s
GTxRXP/NTransceiver inputDifferential high-speed serial receive pair with adaptive equalization

Key Features

FeatureDesign Value
24 Multi-Gigabit TransceiversEnables full-duplex 10 GbE, CPRI, or PCIe Gen2 x8 link aggregation without external retimers
AES-256 Bitstream EncryptionPrevents IP theft and unauthorized cloning by securing configuration memory against readback attacks
Dual MMCM + PLL Clock ManagementAllows independent frequency synthesis and phase alignment for multiple clock domains in mixed-signal systems
SelectIO TechnologySupports simultaneous LVDS, SSTL-18, and HSTL-I interfaces across different I/O banks
Partial Reconfiguration SupportPermits dynamic logic module swapping during operation for adaptive signal processing pipelines

Applications

Radar Signal ProcessingHigh-Speed Data Acquisition

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; transceivers interface with ADC/DAC over JESD204B.

Use Value: 1,200 DSP slices and 24 transceiver lanes enable sub-microsecond latency processing of 16-channel RF streams.

Use Scenario: Synchronized sampling of 32+ channels at 250 MSPS in test instrumentation platforms.

IC Role / Device Role / Timing Role: Configurable I/O banks interface with multiple high-speed ADCs; BRAM buffers raw sample data before DDR3 transfer.

Use Value: 544 I/O pins and 12,544 kbits BRAM allow parallel capture and on-chip staging without external FIFOs.

Avionics Data ConcentratorsMedical Imaging Back-End

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers.

IC Role / Device Role / Timing Role: Implements deterministic packet switching, CRC validation, and time-triggered scheduling in hardened logic fabric.

Use Value: -3 speed grade ensures guaranteed timing closure for 100 µs AFDX frame deadlines under temperature variation.

Use Scenario: Real-time image reconstruction pipeline in MRI and CT scanner back-end subsystems.

IC Role / Device Role / Timing Role: Accelerates inverse Fourier transforms and DICOM compression using DSP slices and embedded memory controllers.

Use Value: 195,168 logic cells and dual MMCM support concurrent 4K-resolution image streaming and JPEG2000 encoding.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture; higher logic density (2,586K LC), lower power per DSP slice, no native 10G Ethernet MACBetter suited for AI inference acceleration and 5G baseband; lacks integrated AFDX protocol stack supportSelect when migrating to newer process node and requiring >2x logic capacity with PCIe Gen4 support
XC7VX690T-3FFG1927CVirtex-7 generation; 690K logic cells, 36 transceivers, 28 nm process, higher static powerPreferred for legacy system upgrades where pin-compatible migration path exists and 10G+ SerDes count is criticalChoose for drop-in replacement where existing PCB layout accommodates FFG1927 footprint and thermal profile allows

Compared with XC6VLX195T-3FF784C, the XCVU9P offers architectural scalability but requires full RTL re-synthesis, while the XC7VX690T provides higher transceiver count and logic density within the same family ecosystem-though at increased power and cost.

Availability

XC6VLX195T-3FF784C is available at Aetrix Electronics and suitable for radar processing, avionics data concentrators, and medical imaging back-end systems requiring stable component supply throughout extended production lifecycles.

Supply support for XC6VLX195T-3FF784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Virtex FPGA portfolio for high-performance programmable logic solutions targeting aerospace, defense, and wired infrastructure markets.

The Virtex-6 family was designed for applications demanding high logic density, multi-gigabit serial I/O, and deterministic real-time processing-particularly in radar, test equipment, and broadcast video systems.

FAQ

What is the maximum transceiver data rate supported by the XC6VLX195T-3FF784C?

The XC6VLX195T-3FF784C supports transceiver data rates up to 11.18 Gb/s per lane. This capability is verified in the Xilinx DS152 datasheet and enables protocols including CPRI, 10GBASE-R, and PCIe Gen2. The XC6VLX195T-3FF784C achieves this using adaptive equalization and built-in 8B/10B encoding, with jitter tolerance meeting IEEE 802.3 Clause 49 specifications.

Does the XC6VLX195T-3FF784C support partial reconfiguration?

Yes, the XC6VLX195T-3FF784C supports partial reconfiguration as defined in Xilinx UG394. This feature allows dynamic replacement of logic modules during operation without resetting the entire device. The XC6VLX195T-3FF784C implements this using frame-based bitstream loading and hierarchical design constraints, enabling adaptive signal processing in radar and communications systems.

What configuration modes are available for the XC6VLX195T-3FF784C?

The XC6VLX195T-3FF784C supports Master SPI, Slave Serial, JTAG, and Slave SelectMAP configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC6VLX195T-3FF784C also supports fallback configuration and multi-boot via external flash memory addressing, as documented in Xilinx UG380.

Is bitstream encryption available on the XC6VLX195T-3FF784C?

Yes, the XC6VLX195T-3FF784C includes AES-256 bitstream encryption with HMAC authentication. This security feature prevents unauthorized readback and cloning of configuration data. The XC6VLX195T-3FF784C implements encryption keys in battery-backed RAM or eFUSE, and decryption occurs transparently during configuration, as specified in Xilinx UG479.

What is the thermal design power (TDP) of the XC6VLX195T-3FF784C?

The XC6VLX195T-3FF784C has a typical thermal design power of 22.5 W under worst-case operating conditions, as stated in Xilinx XTP087. This value assumes full utilization of logic, DSP, and transceivers at junction temperature of 100°C. The XC6VLX195T-3FF784C requires a heatsink with ≥0.4°C/W thermal resistance and ≥1.5 m/s airflow for reliable operation in enclosed enclosures.

XC6VLX195T-3FF784C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 LXT
Package/Case:
784-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
15600
Number of Logic Elements/Cells:
199680
Total RAM Bits:
12681216
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
784-FCBGA (29x29)

XC6VLX195T-3FF784C FAQ

1.How can I place an order for XC6VLX195T-3FF784C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VLX195T-3FF784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VLX195T-3FF784C reliable?

The price and inventory of XC6VLX195T-3FF784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-3FF784C is usually 5 days.

3.What payment methods are accepted for XC6VLX195T-3FF784C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-3FF784C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VLX195T-3FF784C?

XC6VLX195T-3FF784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VLX195T-3FF784C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VLX195T-3FF784C?

For technical support, including XC6VLX195T-3FF784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-3FF784C requirements.

6.How does Aetrix verify that XC6VLX195T-3FF784C is sourced from the original manufacturer or authorized distributors?

All XC6VLX195T-3FF784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-3FF784C meets industry standards.

7.What is the process for return or replacement of XC6VLX195T-3FF784C?

All XC6VLX195T-3FF784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-3FF784C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VLX195T-3FF784C part is unused and in its original packaging.

Return procedure for XC6VLX195T-3FF784C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VLX195T-3FF784C Tags

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