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AMD XC6VLX195T-3FFG1156C
- Part No.:
- XC6VLX195T-3FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-3FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,865
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Product details
Overview
XC6VLX195T-3FFG1156C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 195,168 logic cells, 12.8 Gb/s transceiver capability, and 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) packaging. It targets high-speed serial interface implementation in wired communications infrastructure and radar signal processing systems.
For engineers reviewing the XC6VLX195T-3FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, block RAM capacity, and thermal performance under sustained 3.0 ns CLB propagation delay operation.
Technical Context
The XC6VLX195T-3FFG1156C implements a 40 nm CMOS architecture with integrated multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. Its configurable logic blocks (CLBs) deliver 3.0 ns propagation delay at -3 speed grade, and it includes 1,248 DSP48E1 slices for high-throughput arithmetic operations.
It supports differential I/O standards up to LVDS 1.8 V and includes dedicated clock management tiles with PLLs and MMCMs for low-jitter clock synthesis. The device operates across commercial temperature range (0°C to 85°C) and requires dual-supply voltage rails: 1.0 V core and 2.5 V/3.3 V I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,168 - determines maximum combinational and sequential logic capacity for system-on-chip integration |
| Transceiver Line Rate | 12.8 Gb/s - enables single-lane PCIe Gen2 x4 or dual-lane SATA 3.0 interfaces without external retimers |
| DSP Slices | 1,248 × DSP48E1 - supports parallel multiply-accumulate operations for real-time FIR filtering and FFT computation |
| Block RAM | 14,544 kbits - provides on-die memory for buffering packet payloads or coefficient storage in communication stacks |
| Speed Grade | -3 - guarantees timing closure at 3.0 ns CLB propagation delay under worst-case commercial conditions |
| I/O Standards | LVDS, SSTL, HSTL, TMDS - allows direct interfacing with DDR3 memory, video serializers, and high-speed ADC/DACs |
| Operating Temp | 0°C to +85°C - validated for deployment in indoor telecom equipment and industrial control cabinets |
Pinout & Package
XC6VLX195T-3FFG1156C is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power FPGA applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0 V to CLBs, interconnect, and configuration logic; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | Provides 1.8 V or 2.5 V to configuration circuitry, JTAG, and transceiver reference clocks |
| VCCO | I/O bank power | Bank-specific 1.2–3.3 V supply enabling mixed-voltage I/O operation across 24 selectable banks |
| MRCC / SRCC | Multi-/Single-ended clock input | Dedicated differential clock pins with internal termination and phase alignment to MMCM/PLL |
| GTX_CLK | Transceiver reference clock | Accepts 100–650 MHz differential input to drive GTX transceivers with <1 ps jitter accumulation |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTX Transceivers | 24 lanes supporting 600 Mb/s–12.8 Gb/s with built-in 8B/10B encoding and elastic buffers |
| Advanced Clock Management | Dual MMCM + 6 PLLs per device enable independent clock domain generation for multi-rate subsystems |
| Partial Reconfiguration Support | Enables dynamic logic swapping without full device reset-critical for adaptive radio and protocol gateway applications |
| PCIe Endpoint Hard IP | Integrated Gen2 x8 endpoint block reduces RTL integration effort and ensures compliance with PCIe 2.1 electrical specs |
| System Monitor | On-chip analog-to-digital converter monitors die temperature and supply voltages with ±5°C accuracy |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time channel estimation and MIMO precoding in LTE-A and 5G NR base stations. IC Role / Device Role / Timing Role: Configurable digital signal processor implementing adaptive filter pipelines and protocol stack offload. Use Value: 1,248 DSP48E1 slices enable concurrent execution of 32×32 matrix inversion and 1024-point FFT within sub-100 µs latency. | Use Scenario: High-fidelity pattern generation and error detection in automated semiconductor test systems. IC Role / Device Role / Timing Role: Programmable logic fabric synchronizing multi-channel AWG and digitizer modules with sub-nanosecond skew control. Use Value: 12.8 Gb/s GTX transceivers support deterministic 10 GbE backplane links between instrument modules without external SerDes. |
| Radar Signal Processing | Avionics Data Concentrators |
Use Scenario: Pulse-Doppler processing and CFAR detection in airborne synthetic aperture radar (SAR) platforms. IC Role / Device Role / Timing Role: Time-critical beamforming engine executing real-time STAP algorithms using distributed block RAM and DSP resources. Use Value: 14,544 kbits of block RAM provide sufficient on-chip storage for 16-channel IQ sample buffering at 200 MSPS with zero external DRAM access. | Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Deterministic packet routing and timestamping unit with hardware-accelerated CRC and header parsing. Use Value: Dual MMCMs generate precisely aligned 10 MHz AFDX and 1 MHz 1553B clocks from a single 100 MHz reference, eliminating external clock synthesizers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | 16 nm UltraScale+ architecture; higher logic density (2,586K LUTs); 25.8 Gb/s GTY transceivers | Targets next-generation 5G massive MIMO and AI inference acceleration where power efficiency and bandwidth exceed Virtex-6 requirements | Select when migrating from legacy Virtex-6 designs requiring >2× logic capacity and Gen3/Gen4 PCIe support |
| XC7VX690T-2FFG1927I | 28 nm 7-series architecture; 690K logic cells; 13.1 Gb/s GTH transceivers; -2 speed grade | Suitable for cost-optimized upgrades retaining similar I/O count and thermal envelope while adding partial reconfiguration and AXI interconnect | Prefer for brownfield deployments needing backward-compatible PCB layout with improved DSP efficiency per watt |
Compared with XC6VLX195T-3FFG1156C, the XCVU9P offers superior bandwidth and density but requires new PCB design and toolchain migration, whereas the XC7VX690T delivers incremental performance uplift with minimal board-level changes and continued Vivado tool support.
Availability
XC6VLX195T-3FFG1156C is available at Aetrix Electronics and suitable for wireless infrastructure, defense radar, high-speed test instrumentation, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX195T-3FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, ACAPs, and software-defined platforms for data center, AI, and embedded markets.
The Virtex-6 family was originally designed by Xilinx for high-performance serial connectivity and compute-intensive applications in wired communications, aerospace, and test equipment-prioritizing transceiver bandwidth, DSP throughput, and configurability over power efficiency.
FAQ
What is the maximum supported transceiver line rate for XC6VLX195T-3FFG1156C?
The XC6VLX195T-3FFG1156C supports a maximum transceiver line rate of 12.8 Gb/s per GTX lane. This specification is guaranteed across the commercial temperature range and enables compliance with PCIe Gen2, SATA 3.0, and SRIO Gen2 standards. The device contains 24 GTX transceivers, each independently configurable for different protocols and data rates within this limit.
Does XC6VLX195T-3FFG1156C support partial reconfiguration?
Yes, XC6VLX195T-3FFG1156C supports partial reconfiguration through its configuration port interface and hierarchical design flow in ISE Design Suite. This capability allows dynamic swapping of logic modules-such as protocol engines or filter coefficients-without resetting the entire device, which is essential for adaptive radio and real-time signal processing applications.
What I/O standards are supported by XC6VLX195T-3FFG1156C?
XC6VLX195T-3FFG1156C supports LVDS, SSTL-18/25, HSTL-I/II, and TMDS I/O standards across its 24 configurable I/O banks. Each bank operates at user-selectable VCCO voltages from 1.2 V to 3.3 V, enabling direct interfacing with DDR3 memory controllers, video serializers, and high-speed ADC/DAC devices without level-shifting components.
What is the purpose of the MRCC and SRCC pins on XC6VLX195T-3FFG1156C?
The MRCC (Multi-Region Clock Capable) and SRCC (Single-Region Clock Capable) pins on XC6VLX195T-3FFG1156C are dedicated differential clock inputs routed to global clock networks. MRCC pins connect to multiple clock regions and support phase alignment via MMCMs, while SRCC pins serve individual regions-both provide low-skew, low-jitter clock distribution critical for high-speed synchronous design.
Is XC6VLX195T-3FFG1156C qualified for automotive applications?
No, XC6VLX195T-3FFG1156C is specified only for commercial temperature range (0°C to +85°C) and is not AEC-Q100 qualified. It is intended for indoor telecom, industrial control, and avionics applications-not automotive under-hood environments. For automotive-grade alternatives, consider AMD/Xilinx Automotive-certified families such as Zynq-7000 or Versal ACAP devices.
XC6VLX195T-3FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX195T-3FFG1156C FAQ
1.How can I place an order for XC6VLX195T-3FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-3FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX195T-3FFG1156C reliable?
The price and inventory of XC6VLX195T-3FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-3FFG1156C is usually 5 days.
3.What payment methods are accepted for XC6VLX195T-3FFG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-3FFG1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX195T-3FFG1156C?
XC6VLX195T-3FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX195T-3FFG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX195T-3FFG1156C?
For technical support, including XC6VLX195T-3FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-3FFG1156C requirements.
6.How does Aetrix verify that XC6VLX195T-3FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-3FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-3FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-3FFG1156C?
All XC6VLX195T-3FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-3FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-3FFG1156C part is unused and in its original packaging.
Return procedure for XC6VLX195T-3FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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