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AMD XC6VLX195T-3FFG784C
- Part No.:
- XC6VLX195T-3FFG784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-3FFG784C.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,143
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Product details
Overview
XC6VLX195T-3FFG784C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 195,168 logic cells, 12.8 Gb/s transceiver capability, and embedded Block RAM totaling 10,350 kbits. It implements complex digital signal processing and high-speed serial interface functions in radar processing units and 10G Ethernet line cards.
For engineers reviewing the XC6VLX195T-3FFG784C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), -3 speed grade timing performance, FFG784 flip-chip BGA package compatibility, and integrated PCIe Gen2 endpoint functionality.
Technical Context
The XC6VLX195T-3FFG784C integrates 640 RocketIO GTP transceivers operating up to 3.75 Gb/s and 24 DSP48E1 slices for arithmetic-intensive tasks. Its configuration supports Master SelectMAP and JTAG modes with dual-boot capability via external SPI flash.
It delivers 1,024 user I/Os across 24 banks with programmable drive strength (2 mA–24 mA) and on-die termination (50 Ω–150 Ω). The device uses 40 nm bulk CMOS process technology and supports LVDS, SSTL, HSTL, and TMDS signaling standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,168 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Block RAM | 10,350 kbits - supports large FIFOs, buffers, and on-chip data storage without external memory |
| Transceiver Speed | 3.75 Gb/s - enables 10G Ethernet, CPRI, and Serial RapidIO physical layer interfaces |
| I/O Count | 1,024 - provides high interconnect density for multi-protocol board-level integration |
| Speed Grade | -3 - guarantees worst-case timing closure at highest operating frequency for critical paths |
| Package | FFG784 - 29×29 mm flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
| Configuration Mode | Master SelectMAP & JTAG - allows flexible programming via parallel bus or boundary-scan interface |
Pinout & Package
The XC6VLX195T-3FFG784C is housed in a 784-pin flip-chip fine-pitch BGA (FFG784) package with 24 I/O banks, dedicated configuration pins (INIT_B, CCLK, DONE), and multiple VCCINT/VCCAUX/VCCO power domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating successful bitstream loading or configuration error |
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master SelectMAP or slave serial mode |
| DONE | Configuration Completion Output | Open-drain signal that goes high when configuration completes and device enters user mode |
| M0–M2 | Mode Selection Inputs | Set configuration mode (JTAG, Master SelectMAP, Slave Serial, etc.) at power-up |
| VCCINT | Core Power Supply | 1.0 V supply for FPGA fabric and CLB logic; requires low-noise regulation |
| VCCAUX | Auxiliary Power Supply | 2.5 V supply for configuration circuitry, clock management, and transceivers |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Reduces external PHY count and simplifies compliance testing for host-facing expansion cards |
| DSP48E1 Slices | 24 dedicated arithmetic units enabling real-time FIR filtering and FFT computation without CPU offload |
| Multi-Voltage I/O Banks | Supports concurrent 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces on same device for heterogeneous system interfacing |
| Advanced Clock Management | Includes MMCM and PLL blocks for jitter reduction, frequency synthesis, and phase alignment across multiple clock domains |
| Partial Reconfiguration Support | Enables dynamic logic module swapping in operational systems without full device reset or service interruption |
Applications
| Radar Signal Processing Unit | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Primary logic fabric executing time-critical DSP algorithms with deterministic latency. Use Value: 195K logic cells and 24 DSP48E1 slices enable full pipeline implementation of 128-channel beamformer within single XC6VLX195T-3FFG784C. | Use Scenario: Aggregation and packet forwarding in telecom central office line cards. IC Role / Device Role / Timing Role: MAC-to-PHY bridge with integrated 10GBase-R PCS/PMA and SerDes interface. Use Value: XC6VLX195T-3FFG784C's 3.75 Gb/s transceivers and PCIe Gen2 endpoint eliminate need for discrete serializer/deserializer chips. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: High-throughput image reconstruction in MRI and CT scanner backends. IC Role / Device Role / Timing Role: Data coalescer and parallel accelerator interfacing with ADC arrays and DDR3 memory controllers. Use Value: 1,024 user I/Os and 10,350 kbits Block RAM allow simultaneous acquisition from 32+ ADC channels with on-chip buffering. | Use Scenario: Modular signal generation and analysis in PXI-based ATE platforms. IC Role / Device Role / Timing Role: Reconfigurable waveform engine synchronizing multiple DAC/ADC channels with sub-nanosecond skew control. Use Value: MMCM-based clock networks in XC6VLX195T-3FFG784C achieve <5 ps channel-to-channel jitter for precision timing applications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, higher logic density (2,586K LUTs), 16.3 Gb/s transceivers, 14 nm process | Better suited for 25G+ networking and AI inference acceleration; not drop-in compatible | Select when migrating to higher bandwidth or lower power per function; requires new PCB layout and toolchain upgrade |
| XC7VX485T-2FFG1761I | Virtex-7 generation, 485,760 logic cells, 13.1 Gb/s transceivers, larger FFG1761 package | Offers greater logic capacity and transceiver count but consumes more power and area | Choose for designs requiring >200K logic cells with backward-compatible toolflow; pinout and footprint differ |
Compared with XC6VLX195T-3FFG784C, the XCVU9P-2FLGA2104I delivers 10× higher transceiver speed and 13× more logic but requires architectural re-targeting, while the XC7VX485T-2FFG1761I extends Virtex-6 capabilities with larger scale yet retains Vivado tool compatibility and similar design methodology.
Availability
XC6VLX195T-3FFG784C is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and medical imaging backend systems requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX195T-3FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, ACAPs, and software-defined platforms for data center, communications, and embedded markets.
The Virtex-6 family, including XC6VLX195T-3FFG784C, was engineered for high-bandwidth, low-latency digital signal processing in wired communications, defense electronics, and scientific instrumentation.
FAQ
What is the maximum supported transceiver data rate for XC6VLX195T-3FFG784C?
The XC6VLX195T-3FFG784C supports a maximum transceiver data rate of 3.75 Gb/s using its RocketIO GTP transceivers. This rate enables compliance with 10G Ethernet (10GBASE-R), CPRI, and Serial RapidIO Gen1/Gen2 protocols. The actual achievable rate depends on PCB layout quality, reference clock stability, and signal integrity margins. XC6VLX195T-3FFG784C does not support rates above 3.75 Gb/s in production operation.
Does XC6VLX195T-3FFG784C support partial reconfiguration?
Yes, XC6VLX195T-3FFG784C supports partial reconfiguration through Xilinx ISE Design Suite tools and associated bitstream generation flow. This capability allows dynamic replacement of logic modules while the rest of the design remains operational. XC6VLX195T-3FFG784C requires specific floorplanning, configuration port access, and bitstream partitioning-features validated in Xilinx UG394 and AR# 41256.
What configuration modes are available for XC6VLX195T-3FFG784C?
XC6VLX195T-3FFG784C supports Master SelectMAP, Slave SelectMAP, JTAG, and Slave Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The device also supports dual-boot capability using external SPI flash memory with fallback bitstream storage. XC6VLX195T-3FFG784C does not support passive parallel or BPI configuration modes.
What is the I/O voltage range supported by XC6VLX195T-3FFG784C?
XC6VLX195T-3FFG784C supports I/O voltages from 1.2 V to 3.3 V across its 24 configurable I/O banks. Each bank operates independently with selectable VCCO levels, enabling mixed-voltage interfaces such as 1.8 V LVDS with 3.3 V TTL on the same device. XC6VLX195T-3FFG784C does not support 1.0 V or 0.9 V I/O standards.
Is XC6VLX195T-3FFG784C pin-compatible with other Virtex-6 devices?
No, XC6VLX195T-3FFG784C is not pin-compatible with other Virtex-6 devices due to differences in I/O count, bank arrangement, and power pin placement-even within the FFG784 package variant. For example, XC6VLX240T-3FFG784C has identical package but different power pin assignments and bank configurations. XC6VLX195T-3FFG784C requires its own dedicated footprint and layout.
XC6VLX195T-3FFG784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX195T-3FFG784C FAQ
1.How can I place an order for XC6VLX195T-3FFG784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-3FFG784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX195T-3FFG784C reliable?
The price and inventory of XC6VLX195T-3FFG784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-3FFG784C is usually 5 days.
3.What payment methods are accepted for XC6VLX195T-3FFG784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-3FFG784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX195T-3FFG784C?
XC6VLX195T-3FFG784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX195T-3FFG784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX195T-3FFG784C?
For technical support, including XC6VLX195T-3FFG784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-3FFG784C requirements.
6.How does Aetrix verify that XC6VLX195T-3FFG784C is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-3FFG784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-3FFG784C meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-3FFG784C?
All XC6VLX195T-3FFG784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-3FFG784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-3FFG784C part is unused and in its original packaging.
Return procedure for XC6VLX195T-3FFG784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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