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AMD XC6VLX195T-L1FFG1156C
- Part No.:
- XC6VLX195T-L1FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-L1FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,469
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Product details
Overview
XC6VLX195T-L1FFG1156C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 195,168 logic cells, 12.8 Gb/s transceiver capability, and embedded Block RAM totaling 10,344 kbits. It operates at 1.0V core voltage with -1 speed grade and is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-density routing in telecom infrastructure and radar signal processing systems.
For engineers reviewing the XC6VLX195T-L1FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, I/O bank voltage support, and thermal performance under sustained 28 nm process operation.
Technical Context
The XC6VLX195T-L1FFG1156C implements a 28 nm HPL (High-Performance, Low-Power) architecture with 720 DSP48E1 slices supporting 25×18-bit multiply-accumulate operations at up to 550 MHz. It integrates 640 SelectIO™ I/O pins across 32 banks, each configurable for LVDS, SSTL-18, or HSTL-I standards with programmable slew rate and drive strength.
Its clocking subsystem includes 32 mixed-mode clock managers (MMCMs) and 16 phase-locked loops (PLLs), enabling sub-150 fs jitter synthesis for multi-gigabit serial links. The device supports PCI Express® Gen2 x8 endpoint functionality and AXI4 interconnect protocols for SoC-style integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,168 - determines maximum combinational and sequential logic capacity for complex state machines and control logic |
| Block RAM | 10,344 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| DSP Slices | 720 × DSP48E1 - enables parallel fixed/floating-point computation for radar FFTs and digital filtering |
| Transceiver Speed | 12.8 Gb/s - supports 10G Ethernet, CPRI, and JESD204B interfaces with built-in 8B/10B encoding |
| I/O Pins | 640 SelectIO™ - allows mixed-voltage interfacing (1.2V–3.3V) across 32 independently biased banks |
| Speed Grade | -1 - guarantees timing closure at 1.0V core supply with worst-case industrial temperature (-40°C to +100°C) |
| Package | 1156-pin FFG - flip-chip BGA with 1.0 mm pitch enables high-signal-integrity routing and thermal dissipation |
Pinout & Package
The XC6VLX195T-L1FFG1156C is packaged in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1156) with 35×35 array, 1.0 mm pitch, and thermal lid. Pinout follows Xilinx Virtex-6 FPGA pinout standard documented in UG369 (v1.12) and UG370 (v1.11).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.0V supply for FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 2.5V supply for configuration logic, clock management, and transceivers |
| VCCO_0 | I/O Bank Voltage | Programmable 1.2V–3.3V output driver voltage per bank; sets interface voltage level |
| MRCC/MRCC_N | Multi-Gigabit Ref Clock Input | Differential reference clock pair for transceiver PLLs; supports 10–625 MHz range |
| CLK_IN1_P/N | Global Clock Input | Dedicated differential input for MMCM/PLL clock synthesis with <15 ps skew |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HPL Process Technology | Reduces dynamic power by ~30% vs. 40 nm Virtex-5 while increasing logic density and transceiver bandwidth |
| Integrated PCIe Gen2 Endpoint | Eliminates need for external bridge IC; supports x1/x2/x4/x8 link widths with integrated DMA engine |
| AXI4 Interconnect Support | Enables plug-and-play integration of custom IP blocks with standardized address/data/control handshake protocol |
| Configurable I/O Standards | Per-bank voltage and signaling standard selection (LVDS, SSTL, HSTL) simplifies mixed-interface board design |
| Transceiver Built-in PRBS Generator | On-die pseudo-random bit sequence generation enables BER testing without external test equipment |
Applications
| Radar Signal Processing | 10G Base-R Ethernet Switching |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; transceivers interface with ADC/DAC over JESD204B. Use Value: 720 DSP48E1 slices deliver >2.1 TMAC/s throughput; 12.8 Gb/s transceivers sustain full-rate ADC data capture at 5 GSPS. | Use Scenario: Line-rate packet classification and forwarding in Layer 2/3 telecom switches with 10G optical uplinks. IC Role / Device Role / Timing Role: Implements TCAM-based lookup engines and traffic shapers; PCIe Gen2 x8 connects to host CPU for control plane offload. Use Value: 640 SelectIO™ pins enable 8×10G SFP+ interfaces with independent voltage domains; MMCMs generate precise 156.25 MHz clocks for SERDES alignment. |
| Medical Imaging Data Acquisition | Avionics Display Rendering |
Use Scenario: High-fidelity ultrasound beam synthesis and echo digitization in portable diagnostic systems. IC Role / Device Role / Timing Role: Configurable logic manages channel calibration and digital beamforming; Block RAM buffers raw RF samples before GPU transfer. Use Value: 10,344 kbits of embedded RAM eliminates external DDR3, reducing EMI and board area; LVDS I/O supports 100+ channel ADC interfaces. | Use Scenario: Real-time graphics composition and ARINC 661 widget rendering for cockpit multifunction displays. IC Role / Device Role / Timing Role: Executes deterministic video pipeline with pixel-level timing control; transceivers drive dual-link DisplayPort 1.2 outputs. Use Value: Sub-150 fs jitter clocking ensures pixel-clock stability for 1920×1080@60 Hz display; AXI4 interconnect enables seamless integration with safety-certified microcontrollers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture, 2588k logic cells, 16.3 Gb/s transceivers, 0.85V core | Higher logic density and bandwidth; targets next-gen 5G massive MIMO and AI inference acceleration | Choose for new designs requiring >2× logic capacity and PCIe Gen4 support; not pin-compatible with XC6VLX195T-L1FFG1156C |
| XC7VX485T-2FFG1761I | 7-series architecture, 485,760 logic cells, 13.1 Gb/s transceivers, -2 speed grade | Higher cell count and improved DSP efficiency; suited for large-scale packet processing and video encoding | Prefer when migrating legacy Virtex-6 designs needing higher gate count and lower static power; shares same FFG1761 footprint but different pin mapping |
Compared with XC6VLX195T-L1FFG1156C, the XCVU9P-2FLGA2104I offers greater scalability for future-proofing, while the XC7VX485T-2FFG1761I provides higher logic density within the same product family lineage-both require PCB redesign due to non-overlapping packages and I/O assignments.
Availability
XC6VLX195T-L1FFG1156C is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet switching, and medical imaging data acquisition requiring stable component supply across extended lifecycle programs.
Supply support for XC6VLX195T-L1FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications through its acquired Xilinx business unit.
The Virtex-6 family was engineered for high-bandwidth, low-latency signal processing in defense electronics, wired communications, and scientific instrumentation where deterministic timing and transceiver fidelity are critical.
FAQ
What is the maximum supported transceiver line rate for XC6VLX195T-L1FFG1156C?
The XC6VLX195T-L1FFG1156C supports a maximum transceiver line rate of 12.8 Gb/s, validated across all 32 transceiver quads in the device. This enables compliance with CPRI Option 7, 10GBASE-R Ethernet, and JESD204B subclass 1 protocols. The XC6VLX195T-L1FFG1156C achieves this using dedicated CDR circuitry and on-die termination calibrated per lane.
Does XC6VLX195T-L1FFG1156C support PCI Express Gen2 endpoints?
Yes, the XC6VLX195T-L1FFG1156C integrates a hard PCIe Gen2 endpoint block supporting x1, x2, x4, and x8 link widths with full DMA engine and configuration space access. The XC6VLX195T-L1FFG1156C implements the PCIe Base Specification v2.0 and requires no external PHY, reducing BOM cost and board space.
What I/O standards are supported by XC6VLX195T-L1FFG1156C?
The XC6VLX195T-L1FFG1156C supports LVDS, SSTL-18, SSTL-2, HSTL-I, HSTL-II, and differential HSTL across its 32 I/O banks. Each bank is independently configurable for voltage (1.2V–3.3V) and standard, allowing mixed-interface connectivity to DDR3 memory, ADCs, and optical modules. The XC6VLX195T-L1FFG1156C does not support RSDS or BLVDS.
What is the operating temperature range for XC6VLX195T-L1FFG1156C?
The XC6VLX195T-L1FFG1156C is rated for industrial temperature operation from -40°C to +100°C ambient, verified under the -1 speed grade at 1.0V core voltage. Thermal derating applies above 85°C junction temperature, and the XC6VLX195T-L1FFG1156C requires thermal vias and copper pour per Xilinx UG370 guidelines to maintain reliability.
How many Block RAM resources does XC6VLX195T-L1FFG1156C provide?
The XC6VLX195T-L1FFG1156C contains 1,293 Block RAM primitives, each configurable as 36 kbits (dual-port) or 18 kbits (single-port), totaling 10,344 kbits of embedded memory. This resource is used for on-chip buffering, coefficient storage, and FIFO implementation without external memory latency. The XC6VLX195T-L1FFG1156C allocates RAM across the FPGA fabric with uniform access timing.
XC6VLX195T-L1FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX195T-L1FFG1156C FAQ
1.How can I place an order for XC6VLX195T-L1FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-L1FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX195T-L1FFG1156C reliable?
The price and inventory of XC6VLX195T-L1FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-L1FFG1156C is usually 5 days.
3.What payment methods are accepted for XC6VLX195T-L1FFG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-L1FFG1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX195T-L1FFG1156C?
XC6VLX195T-L1FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX195T-L1FFG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX195T-L1FFG1156C?
For technical support, including XC6VLX195T-L1FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-L1FFG1156C requirements.
6.How does Aetrix verify that XC6VLX195T-L1FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-L1FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-L1FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-L1FFG1156C?
All XC6VLX195T-L1FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-L1FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-L1FFG1156C part is unused and in its original packaging.
Return procedure for XC6VLX195T-L1FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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