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AMD XC6VLX195T-L1FFG784C
- Part No.:
- XC6VLX195T-L1FFG784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-L1FFG784C.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,694
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Product details
Overview
XC6VLX195T-L1FFG784C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 195,120 logic cells, 12.8 Gb/s transceiver capability, and embedded Block RAM totaling 10,344 kbits. It operates at -1 speed grade with 1.0V core voltage and supports PCI Express Gen2 x8 endpoint functionality in industrial temperature range.
For engineers reviewing the XC6VLX195T-L1FFG784C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage flexibility (1.2V/1.5V/1.8V/2.5V/3.3V), DSP48E1 slice count (768), and support for DDR3 memory interfaces up to 800 MHz.
Technical Context
The XC6VLX195T-L1FFG784C implements a fully synchronous, SRAM-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated 64-bit AXI interconnect infrastructure. It includes 24 multi-gigabit transceivers supporting protocols including SATA, PCIe Gen2, and CPRI.
Its I/O structure supports SelectIO™ standards across 24 banks, with programmable slew rate, drive strength, and on-die termination. The device integrates dual 10-bit ADCs for system monitoring and supports partial reconfiguration for dynamic function swapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,120 - determines maximum combinational and sequential logic capacity for custom digital design implementation |
| Block RAM | 10,344 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory dependency |
| DSP Slices | 768 DSP48E1 - enables high-throughput fixed-point math operations for filtering, FFT, and modulation/demodulation |
| Transceivers | 24 × 6.6 Gb/s - supports up to 24 serial lanes for PCIe Gen2, SATA III, or CPRI links with built-in clock data recovery |
| I/O Pins | 448 user I/O - distributed across 24 banks with independent voltage support per bank for mixed-voltage interface integration |
| Speed Grade | -1 - guarantees timing closure at 1.0V core supply and industrial temperature range (–40°C to +100°C) |
| Memory Interface | DDR3 up to 800 MHz - enables direct connection to high-speed external memory with calibrated DQS feedback and write leveling |
Pinout & Package
XC6VLX195T-L1FFG784C is housed in a 784-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free / RoHS-compliant construction. Thermal performance is enhanced by an exposed thermal pad on the underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V regulated input powering CLBs, interconnect, and configuration logic; requires low-noise decoupling |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration circuitry, JTAG, and transceiver reference clocks |
| VCCO_0 | I/O bank power | Programmable voltage (1.2V–3.3V) for Bank 0 I/Os; sets signal swing and interface compatibility |
| MGTAVCC | Transceiver analog supply | 1.0V analog rail for multi-gigabit transceiver PLLs and serializers/deserializers |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness; pulled high during valid bitstream load |
| CCLK | Configuration clock | Input clock for master serial configuration mode; frequency ≤ 50 MHz for reliable bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime swapping of logic partitions without resetting the entire device, critical for adaptive radio and real-time protocol stacks |
| Dual 10-bit System Monitor ADC | Provides on-chip temperature and supply voltage measurement with ±5% accuracy, eliminating need for external monitoring ICs |
| AXI Interconnect Infrastructure | Integrated 64-bit AXI4-compliant crossbar supporting up to 16 masters and 16 slaves for scalable SoC-style subsystem integration |
| SelectIO™ Technology | Supports LVCMOS, SSTL, HSTL, and differential standards (LVDS, TMDS) with per-bank voltage control and programmable I/O delays |
| PCIe Gen2 Endpoint Hard IP | Dedicated block implementing full PHY + Data Link + Transaction layers for x1/x2/x4/x8 configurations with <100 μs link training |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems requiring deterministic latency and high throughput. IC Role / Device Role / Timing Role: Primary compute fabric handling parallel FFTs, CFAR detection, and SAR image reconstruction pipelines. Use Value: 768 DSP48E1 slices deliver >2.4 TMAC/s peak compute; transceivers interface directly to ADC/DAC FMC mezzanine cards at 5 Gb/s. | Use Scenario: High-resolution ultrasound image reconstruction and DICOM compression in portable diagnostic equipment. IC Role / Device Role / Timing Role: Central data path controller managing echo data flow from 128-channel ADCs to GPU-accelerated post-processing units. Use Value: 448 user I/Os support simultaneous LVDS ADC capture and PCIe Gen2 x8 host upload; DDR3 interface sustains 12.8 GB/s memory bandwidth. |
| Avionics Data Concentrator | Industrial Ethernet Gateway |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control subsystems with DO-254 compliance requirements. IC Role / Device Role / Timing Role: Deterministic protocol translation engine with time-triggered scheduling and hardware CRC offload. Use Value: -1 speed grade ensures timing closure under extended temperature cycling; dual ADC monitors internal junction temperature for safety-critical derating. | Use Scenario: Multi-protocol industrial gateway aggregating PROFINET, EtherNet/IP, and TSN traffic into unified OPC UA server. IC Role / Device Role / Timing Role: Real-time traffic scheduler and packet classifier using hardware-accelerated pattern matching and timestamping. Use Value: 24 transceivers enable concurrent 100BASE-TX and 1000BASE-X ports; AXI interconnect routes traffic between 8 Ethernet MACs and DDR3 buffer memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 16.3 Gb/s transceivers, 0.85V core, larger package (2104-ball) | Higher density and bandwidth; requires PCB redesign and new power delivery network | Choose for new designs needing >2× logic capacity and PCIe Gen3/Gen4 support |
| XC7VX485T-2FFG1157I | 7-series architecture, 485,760 logic cells, 13.1 Gb/s transceivers, -2 speed grade, 1157-ball FCBGA | Higher logic count but lower transceiver line rate; different I/O banking scheme and configuration interface | Consider when migrating legacy Virtex-6 designs with minimal changes to I/O constraints and timing budgets |
Compared with XC6VLX195T-L1FFG784C, the XCVU9P offers generational improvements in bandwidth and efficiency but demands full platform requalification, while the XC7VX485T provides higher logic density within the same architectural family yet lacks native PCIe Gen2 endpoint hard IP and requires updated board layout.
Availability
XC6VLX195T-L1FFG784C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and industrial Ethernet gateways requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX195T-L1FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets following its acquisition of Xilinx in 2022.
The Virtex-6 family was originally developed by Xilinx to address high-bandwidth, high-compute applications in aerospace, defense, and wired communications infrastructure where deterministic timing and mixed-signal integration are critical.
FAQ
What is the maximum supported DDR3 memory speed for XC6VLX195T-L1FFG784C?
The XC6VLX195T-L1FFG784C supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock), validated with 16-bit and 32-bit bus widths using DQS-based write leveling and read-leveling calibration. This capability is implemented via dedicated memory controller logic and I/O timing resources in Banks 33–36, and requires proper PCB layout adherence to Xilinx UG388 guidelines for signal integrity.
Does XC6VLX195T-L1FFG784C include built-in analog-to-digital conversion capability?
Yes, the XC6VLX195T-L1FFG784C integrates two independent 10-bit analog-to-digital converters (ADCs) as part of its System Monitor feature. These ADCs measure on-chip temperature and supply voltages (VCCINT, VCCAUX, VCCBRAM) with ±5% accuracy over temperature and process variation, enabling real-time health monitoring without external sensors.
What transceiver protocols are natively supported by XC6VLX195T-L1FFG784C?
The XC6VLX195T-L1FFG784C supports native physical layer implementation of PCIe Gen2 (x1/x2/x4/x8), SATA I/II/III, CPRI, and 10GBASE-R through its 24 MGT transceivers. Protocol stack support depends on soft IP or hardened blocks: PCIe Gen2 endpoint functionality is implemented in hard IP, while other protocols require licensing and integration of Xilinx LogiCORE IP.
Is XC6VLX195T-L1FFG784C compatible with Vivado Design Suite?
No, the XC6VLX195T-L1FFG784C is not supported in Vivado Design Suite. It requires Xilinx ISE Design Suite 14.7 as the final and only officially supported toolchain. Vivado does not include Virtex-6 device definition libraries or place-and-route engines for this architecture, and no migration path exists for existing ISE projects.
What is the operating temperature range specified for XC6VLX195T-L1FFG784C?
The XC6VLX195T-L1FFG784C is rated for industrial temperature operation from –40°C to +100°C ambient, corresponding to the "I" suffix in the full ordering part number. This range is guaranteed for all speed grades and I/O standards under specified voltage and loading conditions per Xilinx DS152 documentation.
XC6VLX195T-L1FFG784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX195T-L1FFG784C FAQ
1.How can I place an order for XC6VLX195T-L1FFG784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-L1FFG784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX195T-L1FFG784C reliable?
The price and inventory of XC6VLX195T-L1FFG784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-L1FFG784C is usually 5 days.
3.What payment methods are accepted for XC6VLX195T-L1FFG784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-L1FFG784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX195T-L1FFG784C?
XC6VLX195T-L1FFG784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX195T-L1FFG784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX195T-L1FFG784C?
For technical support, including XC6VLX195T-L1FFG784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-L1FFG784C requirements.
6.How does Aetrix verify that XC6VLX195T-L1FFG784C is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-L1FFG784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-L1FFG784C meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-L1FFG784C?
All XC6VLX195T-L1FFG784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-L1FFG784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-L1FFG784C part is unused and in its original packaging.
Return procedure for XC6VLX195T-L1FFG784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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