AMD XC6VLX195T-L1FFG784I

Overview

XC6VLX195T-L1FFG784I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 195,120 logic cells, 12.8 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It operates at -1 speed grade with industrial temperature range (-40°C to +100°C) and uses a 784-pin Flip-Chip Fine-Pitch BGA (FFG) package. This device serves as a reconfigurable system-on-chip for high-bandwidth digital signal processing in radar and medical imaging systems.

For engineers reviewing the XC6VLX195T-L1FFG784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, embedded memory depth, and PCIe endpoint compliance for real-time data acquisition platforms.

Technical Context

The XC6VLX195T-L1FFG784I implements a 40 nm CMOS architecture with dual-register 6-input LUTs, dedicated DSP48E1 slices delivering 25 GMAC/s peak performance, and block RAM organized in 36 Kb primitives. It supports differential I/O standards including LVDS, SSTL, and HSTL across 16 I/O banks.

Its clocking subsystem includes 24 mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs), enabling precise jitter filtering and multi-phase clock generation. The device integrates 8 PCIe Gen2 x8 endpoints with hard IP, supporting both root complex and endpoint configurations without external bridge logic.

Key Specifications

Pinout & Package

XC6VLX195T-L1FFG784I is housed in a 784-pin Flip-Chip Fine-Pitch BGA (FFG) package with 27 × 27 mm body size, 1.0 mm ball pitch, and thermal lid for industrial thermal management.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX195T-L1FFG784I, the XC6VLX240T-L1FFG1156I offers greater logic density and I/O scalability but requires PCB redesign, while the XCKU060-2FFVA1156I delivers superior computational efficiency at the cost of increased design complexity for PCIe integration.

Availability

XC6VLX195T-L1FFG784I is available at Aetrix Electronics and suitable for radar signal processing, medical ultrasound imaging, and high-speed data acquisition requiring stable component supply over extended industrial lifecycles.

Supply support for XC6VLX195T-L1FFG784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms based on FPGA, ACAP, and software-defined hardware architectures.

The Virtex-6 family was designed for high-throughput, low-latency reconfigurable computing in defense, aerospace, and medical imaging systems where protocol integration and signal processing bandwidth are critical.

FAQ

What is the maximum supported transceiver data rate for XC6VLX195T-L1FFG784I?

The XC6VLX195T-L1FFG784I supports a maximum transceiver line rate of 12.8 Gb/s. This specification is validated across all transceiver quads in the device and enables compliance with CPRI, Serial RapidIO Gen2, and 10GBASE-KR protocols. The XC6VLX195T-L1FFG784I achieves this rate using dedicated CDR circuitry and adaptive equalization, with guaranteed operation at industrial temperature range.

Does XC6VLX195T-L1FFG784I include hard IP for PCIe Gen2?

Yes, XC6VLX195T-L1FFG784I integrates hard PCIe Gen2 x8 endpoint IP compliant with PCI Express Base Specification v2.0. It supports link training, power management states (L0–L2), and Advanced Error Reporting without consuming programmable logic resources. The XC6VLX195T-L1FFG784I does not support root complex mode in hardware; endpoint functionality is fixed and verified in silicon.

What I/O standards are supported by XC6VLX195T-L1FFG784I?

XC6VLX195T-L1FFG784I supports 21 I/O standards across its 16 banks, including LVDS_25, SSTL18_I, HSTL_I, DIFF_HSTL_I_18, and TMDS_33. Each bank operates independently at voltages from 1.2 V to 3.3 V. The XC6VLX195T-L1FFG784I does not support DDR4 or MIPI D-PHY standards, which were introduced in later families.

What is the block RAM capacity of XC6VLX195T-L1FFG784I?

The XC6VLX195T-L1FFG784I provides 14,544 Kb of total block RAM, implemented as 400 × 36 Kb RAMB36E1 primitives. Each block supports true dual-port operation with independent read and write clocks, and can be configured as 36 Kb single-port, 18 Kb dual-port, or 72 Kb simple dual-port. This capacity is fixed and cannot be expanded via distributed RAM.

Is XC6VLX195T-L1FFG784I qualified for industrial temperature operation?

Yes, XC6VLX195T-L1FFG784I is rated for industrial temperature range (-40°C to +100°C) and carries the 'I' suffix indicating industrial qualification. It meets JEDEC JESD22-A104 reliability testing requirements, including 1000-cycle temperature cycling and 1000-hour unbiased HAST. The XC6VLX195T-L1FFG784I requires proper thermal management per Xilinx UG372 guidelines to maintain timing integrity at maximum junction temperature.