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AMD XC6VLX240T-1FF1156I
- Part No.:
- XC6VLX240T-1FF1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-1FF1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,026
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Product details
Overview
XC6VLX240T-1FF1156I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 240,960 logic cells, 15,360 DSP48E1 slices, and 12.8 Gb/s transceiver capability in a 1156-pin Flip-Chip Fine-Pitch BGA package. It targets high-speed serial interface implementation in radar signal processing systems.
For engineers reviewing the XC6VLX240T-1FF1156I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O bank voltage support, configuration mode options, and thermal performance under sustained 2.5W dynamic power.
Technical Context
The XC6VLX240T-1FF1156I implements a 40 nm CMOS architecture with integrated PCIe Gen2 x8 endpoint blocks, dual 10/100/1000 Ethernet MACs, and hardened RocketIO GTP transceivers supporting 600 Mb/s to 3.75 Gb/s operation. It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling across 24 I/O banks.
Configuration occurs via Master SPI, Slave Serial, or JTAG modes using on-chip startup circuitry. The device includes internal voltage regulation for VCCINT (1.0V), VCCAUX (2.5V), and VCCO (1.2–3.3V per bank), with thermal monitoring via on-die diode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,960 - determines maximum combinational and sequential logic capacity for complex state machines and data path design |
| DSP Slices | 15,360 - enables parallel execution of multiply-accumulate operations for real-time FIR filtering and FFT computation |
| Transceiver Speed | 600 Mb/s to 3.75 Gb/s - supports multi-gigabit serial links including CPRI, SRIO, and Gigabit Ethernet physical layer |
| I/O Banks | 24 - allows independent voltage assignment per bank for mixed-voltage system interfacing (e.g., 1.8V FPGA core to 3.3V legacy peripherals) |
| Configuration Mode | Master SPI / Slave Serial / JTAG - provides flexibility in boot source selection and field reprogrammability without external processor dependency |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded applications with active thermal management |
Pinout & Package
XC6VLX240T-1FF1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FF1156) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal-enhanced construction for high-power-density operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SPI mode; requires stable 50 MHz clock for reliable bitstream loading |
| DONE | Configuration Status Output | Open-drain signal indicating completion of configuration and readiness for user logic execution |
| INIT_B | Configuration Initialization | Active-low input that resets configuration controller and clears internal configuration memory upon deassertion |
| M0–M2 | Mode Selection Inputs | Three-pin encoding selects among six supported configuration modes including Slave Parallel and Boundary Scan |
| GTX_CLK0_M2C_P/N | Differential Transceiver Reference Clock | Provides low-jitter reference for GTP transceivers; must be routed as controlled-impedance differential pair |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 Endpoint | Reduces integration effort for host-facing interfaces by eliminating need for soft IP stack synthesis and timing closure |
| Integrated Ethernet MACs | Enables direct connection to PHY devices without external glue logic or microcontroller co-processing |
| Multi-Voltage I/O Banks | Supports concurrent interface to DDR3 (1.5V), QSPI Flash (3.3V), and analog front-end ADCs (1.8V) within single device |
| On-Die Thermal Diode | Allows real-time junction temperature monitoring via external ADC, critical for thermal throttling in sealed enclosures |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems operating at X-band frequencies. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical digital down-conversion and CFAR detection algorithms with deterministic latency under 200 ns. Use Value: 15,360 DSP48E1 slices enable simultaneous processing of 64 receive channels at 125 MSPS sample rate. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner backends requiring >2 Gbps data ingestion from ADC arrays. IC Role / Device Role / Timing Role: Acts as high-speed data concentrator and preprocessing engine between 32-channel ADC modules and PCI Express host interface. Use Value: 12.8 Gb/s transceiver bandwidth sustains full-rate streaming from eight 250 MSPS ADCs without frame buffering bottlenecks. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B protocol bridging in flight control data networks with deterministic latency requirements. IC Role / Device Role / Timing Role: Implements multiple protocol engines and time-triggered scheduling logic in hardware for sub-microsecond jitter control. Use Value: Dual hardened Ethernet MACs and 24 I/O banks allow concurrent AFDX, 1553B, and discrete I/O handling without external bridge ICs. | Use Scenario: Automated test equipment capturing high-fidelity waveforms from RF and microwave sources at 5 GS/s sampling rates. IC Role / Device Role / Timing Role: Serves as real-time pattern generator and acquisition controller with precise trigger synchronization across 16 analog channels. Use Value: 240,960 logic cells support custom state machines for multi-stage triggering, deep memory buffering, and on-the-fly FFT analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX130T-1FF1156I | 130,000 logic cells, 8,640 DSP slices, same FF1156 package and transceiver spec | Lower gate count limits complex algorithm partitioning in multi-channel radar systems | Select when application logic fits within reduced resource budget and cost sensitivity outweighs scalability needs |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, 443,200 logic cells, 2,688 DSP slices, 16.3 Gb/s transceivers | Requires PCB redesign due to different pinout, power delivery, and configuration interface | Choose for next-generation designs needing higher throughput and lower power per DSP operation, accepting migration effort |
Compared with XC6VLX240T-1FF1156I, the XC6VLX130T-1FF1156I offers identical packaging and I/O compatibility but reduced computational headroom, while the XCKU060-2FFVA1156I delivers significantly higher density and bandwidth at the cost of non-interchangeable layout and power architecture.
Availability
XC6VLX240T-1FF1156I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and high-speed test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX240T-1FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family for high-performance computing and adaptive compute platforms.
The Virtex-6 family was designed for applications demanding high logic density, multi-gigabit serial connectivity, and deterministic real-time processing in aerospace, defense, and instrumentation systems.
FAQ
What is the maximum transceiver line rate supported by XC6VLX240T-1FF1156I?
The XC6VLX240T-1FF1156I supports transceiver line rates from 600 Mb/s up to 3.75 Gb/s using its RocketIO GTP transceivers. This range accommodates protocols such as CPRI, Serial RapidIO, and Gigabit Ethernet. The actual achievable rate depends on board layout quality, reference clock stability, and signal integrity margins. XC6VLX240T-1FF1156I does not support 10GbE or higher line rates native to later FPGA families.
Does XC6VLX240T-1FF1156I include built-in PCIe Gen2 support?
Yes, XC6VLX240T-1FF1156I integrates hardened PCIe Gen2 x8 endpoint blocks compliant with the PCI Express Base Specification 2.0. These blocks handle link training, transaction layer packet processing, and data link layer functions without consuming programmable logic resources. XC6VLX240T-1FF1156I does not support root complex functionality or PCIe Gen3.
What configuration modes are available for XC6VLX240T-1FF1156I?
XC6VLX240T-1FF1156I supports Master SPI, Slave Serial, Slave Parallel, JTAG, and Boundary Scan configuration modes. Mode selection is controlled by M0–M2 pins at power-up. XC6VLX240T-1FF1156I requires external configuration memory (e.g., SPI Flash) for Master SPI mode, while JTAG enables in-system programming and debugging without dedicated memory.
Can XC6VLX240T-1FF1156I operate in industrial temperature range?
Yes, the "I" suffix in XC6VLX240T-1FF1156I denotes industrial temperature grade (-40°C to +100°C). This rating is validated under specified power dissipation and airflow conditions. XC6VLX240T-1FF1156I includes an on-die thermal diode for real-time junction temperature monitoring to ensure safe operation within this range.
How many I/O banks does XC6VLX240T-1FF1156I have, and what voltage levels do they support?
XC6VLX240T-1FF1156I has 24 configurable I/O banks. Each bank supports independent VCCO voltages from 1.2V to 3.3V, enabling concurrent interface to multiple standards including LVCMOS, LVTTL, SSTL-15/18, HSTL-I/II, and differential standards like LVDS and TMDS. XC6VLX240T-1FF1156I does not support 5V-tolerant I/O.
XC6VLX240T-1FF1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX240T-1FF1156I FAQ
1.How can I place an order for XC6VLX240T-1FF1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-1FF1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-1FF1156I reliable?
The price and inventory of XC6VLX240T-1FF1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-1FF1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-1FF1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-1FF1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-1FF1156I?
XC6VLX240T-1FF1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-1FF1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-1FF1156I?
For technical support, including XC6VLX240T-1FF1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-1FF1156I requirements.
6.How does Aetrix verify that XC6VLX240T-1FF1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-1FF1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-1FF1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-1FF1156I?
All XC6VLX240T-1FF1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-1FF1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-1FF1156I part is unused and in its original packaging.
Return procedure for XC6VLX240T-1FF1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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