AMD XC6VLX240T-1FF1759I
- Part No.:
- XC6VLX240T-1FF1759I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-1FF1759I.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VLX240T-1FF1759I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 240,000 logic cells, 15.4 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It implements complex digital signal processing, high-speed serial interface bridging, and real-time protocol acceleration in telecom infrastructure and military radar systems.
For engineers reviewing the XC6VLX240T-1FF1759I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage flexibility (1.2 V to 3.3 V), block RAM depth (36 Kb per BRAM), and -1 speed grade timing closure margin for deterministic latency designs.
Technical Context
The XC6VLX240T-1FF1759I integrates 600 DSP48E1 slices for fixed-point arithmetic and filtering, supports dual-register LUTs with 6-input logic capability, and includes hardened Gigabit Transceivers compliant with IEEE 802.3ap, SATA, and CPRI standards. Its configuration architecture uses 256-bit AES encryption and JTAG boundary-scan for secure bitstream loading.
It delivers 12.8 GT/s aggregate transceiver bandwidth across 24 lanes, employs SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards, and implements partial reconfiguration via ICAP for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,000 - Enables implementation of multi-channel 10G Ethernet MAC + PHY stacks with embedded control firmware. |
| Transceiver Lanes | 24 - Supports four independent 10GBASE-KR links or eight CPRI v6.1 interfaces at 6.144 Gbps. |
| Block RAM | 14,544 Kb - Sufficient for dual-port FIFO buffering of four 10 Gb/s data streams with 256-byte depth. |
| DSP Slices | 600 - Provides 240 GMAC/s peak throughput for real-time FIR filter banks in software-defined radio. |
| I/O Standards | SSTL-18/25, HSTL-I/II, LVCMOS - Allows direct interfacing to DDR3-1600 memory and 1.8 V ADC/DAC peripherals. |
| Speed Grade | -1 - Guarantees timing closure at 600 MHz system clock with 1.2 V core supply and 85°C junction temperature. |
Pinout & Package
XC6VLX240T-1FF1759I is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFBGA) package with 1.0 mm ball pitch, thermal lid, and exposed thermal pad. The package supports 720 user I/Os distributed across 24 banks with independent VCCO and VREF per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M2 | CONFIG_DONE | Open-drain status output confirming successful bitstream loading and I/O initialization. |
| R1 | CCLK | Configuration clock input driving internal shift registers during master SPI mode programming. |
| T1 | INIT_B | Active-low open-drain output indicating FPGA readiness to accept configuration data. |
| Y1 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload sequence. |
| A1 | VCCINT | 1.2 V core power supply requiring low-noise regulation and local decoupling within 10 mm. |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hard IP block eliminating need for soft-core PCIe controller RTL and reducing integration risk in host-facing modules. |
| Partial Reconfiguration | Enables runtime swapping of functional blocks (e.g., modulator/demodulator sets) without interrupting active data paths. |
| 256-bit AES Bitstream Encryption | Prevents reverse engineering and unauthorized cloning of proprietary algorithm implementations in deployed hardware. |
| Dual-Register LUTs | Supports pipelined logic stages within single LUT, improving Fmax by up to 15% in critical datapath chains. |
| SelectIO Technology | Per-bank I/O voltage independence allows mixing DDR3 memory (1.5 V) and 3.3 V legacy peripherals on same device. |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time channelization and MIMO precoding for LTE-A eNodeB base stations operating at 2×20 MHz bandwidth. IC Role / Device Role / Timing Role: Primary baseband processor implementing Layer 1 PHY functions with deterministic sub-100 ns latency between ADC input and DAC output. Use Value: 600 DSP48E1 slices enable concurrent execution of 128-point FFTs and 32-tap adaptive filters at 122.88 MSPS sampling rate. | Use Scenario: Multi-protocol serial pattern generation and analysis in automated test equipment for SerDes validation. IC Role / Device Role / Timing Role: Programmable protocol engine generating PRBS31 sequences and decoding eye diagrams at 10.3125 Gb/s using built-in transceivers. Use Value: 24 transceiver lanes allow simultaneous testing of eight 10GBASE-KR links with independent jitter injection and error injection per lane. |
| Avionics Data Concentrators | Medical Imaging Back-End |
Use Scenario: ARINC 664 Part 7 (AFDX) end-system aggregation of sensor data from flight control, navigation, and environmental monitoring subsystems. IC Role / Device Role / Timing Role: Deterministic switch fabric with time-triggered scheduling and redundant path failover handling. Use Value: -1 speed grade ensures guaranteed worst-case latency ≤ 2.1 μs across all 720 I/Os under full traffic load at -55°C to +85°C. | Use Scenario: Real-time reconstruction pipeline for CT and MRI scanners requiring parallel back-projection and iterative denoising. IC Role / Device Role / Timing Role: High-throughput compute accelerator offloading GPU-hosted algorithms with low-latency DMA to DDR3 memory subsystem. Use Value: 14,544 Kb block RAM enables on-chip storage of 1024×1024 sinogram buffers, eliminating external memory bottlenecks during iterative reconstruction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale architecture, 540K logic cells, 28.8 GT/s transceivers, no native PCIe Gen2 endpoint hard IP. | Requires soft PCIe core; better suited for AI inference acceleration than legacy protocol bridging. | Choose when migrating to 16 nm process and requiring higher DSP density, but accept added PCIe integration effort. |
| XC7VX485T-2FFG1761I | Virtex-7 architecture, 485K logic cells, PCIe Gen3 x8 endpoint, 28 nm process, higher static power. | Native PCIe Gen3 support simplifies upgrade from Gen2-based systems; larger die increases thermal footprint. | Choose for Gen3 migration path where backward compatibility with XC6VLX240T-1FF1759I pinout is not required. |
Compared with XC6VLX240T-1FF1759I, the XCVU3P-2FFVD1760I offers higher transceiver bandwidth and logic capacity but lacks hardened PCIe Gen2, while the XC7VX485T-2FFG1761I provides Gen3 endpoint support and greater resources at the cost of increased power and package size - both require PCB redesign.
Availability
XC6VLX240T-1FF1759I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply over extended product lifecycles.
Supply support for XC6VLX240T-1FF1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets following its acquisition of Xilinx in 2022.
The Virtex-6 family was designed for high-bandwidth, low-latency programmable logic in mission-critical infrastructure where deterministic timing and protocol compliance are mandatory.
FAQ
What is the maximum supported transceiver data rate for XC6VLX240T-1FF1759I?
The XC6VLX240T-1FF1759I supports a maximum transceiver line rate of 15.4 Gb/s per lane, validated per IEEE 802.3ap and CPRI v6.1 specifications. This enables operation at 10GBASE-KR, 8x6.144 Gbps CPRI, or 4x10.3125 Gbps OTU2. The -1 speed grade guarantees timing closure at this rate with proper board-level signal integrity design.
Does XC6VLX240T-1FF1759I include a hard PCIe Gen2 endpoint block?
Yes, XC6VLX240T-1FF1759I integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. This eliminates the need for soft-core PCIe controllers, reduces resource utilization by ~12,000 LUTs, and guarantees deterministic latency for host communication in applications like AFDX end-systems and test equipment controllers.
What I/O standards does XC6VLX240T-1FF1759I support?
XC6VLX240T-1FF1759I supports SSTL-18, SSTL-25, HSTL-I, HSTL-II, LVCMOS 1.2/1.5/1.8/2.5/3.3 V, and differential standards including LVDS, BLVDS, and RSDS. Each of its 24 I/O banks operates independently, allowing mixed-voltage interfaces such as DDR3-1600 memory (1.5 V) alongside 3.3 V industrial sensors on the same device.
Is partial reconfiguration supported on XC6VLX240T-1FF1759I?
Yes, XC6VLX240T-1FF1759I supports dynamic partial reconfiguration via the Internal Configuration Access Port (ICAP). This allows runtime swapping of functional modules-such as modulation schemes in SDR or filter coefficients in radar processing-without resetting the entire device or halting active data channels, preserving system uptime and determinism.
What is the block RAM capacity of XC6VLX240T-1FF1759I?
XC6VLX240T-1FF1759I provides 14,544 Kb of total block RAM, implemented as 720 × 36 Kb dual-port RAM primitives. This enables large on-chip buffers-for example, storing two full 1024×1024 pixel frames at 16-bit depth-or deep FIFOs for high-throughput SerDes interfaces, reducing reliance on external memory and associated latency penalties.
XC6VLX240T-1FF1759I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX240T-1FF1759I FAQ
1.How can I place an order for XC6VLX240T-1FF1759I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-1FF1759I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-1FF1759I reliable?
The price and inventory of XC6VLX240T-1FF1759I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-1FF1759I is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-1FF1759I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-1FF1759I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-1FF1759I?
XC6VLX240T-1FF1759I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-1FF1759I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-1FF1759I?
For technical support, including XC6VLX240T-1FF1759I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-1FF1759I requirements.
6.How does Aetrix verify that XC6VLX240T-1FF1759I is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-1FF1759I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-1FF1759I meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-1FF1759I?
All XC6VLX240T-1FF1759I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-1FF1759I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-1FF1759I part is unused and in its original packaging.
Return procedure for XC6VLX240T-1FF1759I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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