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AMD XC6VLX240T-1FF784C
- Part No.:
- XC6VLX240T-1FF784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-1FF784C.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,746
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Product details
Overview
XC6VLX240T-1FF784C from AMD (formerly Xilinx) is a high-performance 40 nm FPGA featuring 240,960 logic cells, 15,360 DSP48E1 slices, and 12.8 Gb/s transceiver capability in a 784-pin Flip-Chip Fine-Pitch BGA package. It targets high-bandwidth wired communications infrastructure and radar signal processing systems requiring deterministic low-latency data path control.
For engineers reviewing the XC6VLX240T-1FF784C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage support (1.2 V to 3.3 V), transceiver compliance with PCIe Gen2 and SRIO 2.1, and configuration via Master SelectMAP or JTAG.
Technical Context
The XC6VLX240T-1FF784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM) up to 14,544 kbits, and integrated 6.6 Gb/s multi-gigabit transceivers supporting protocols including CPRI, OBSAI, and Ethernet 10GBase-R. Its clock management tile includes six mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs) for precise jitter filtering and frequency synthesis.
Configuration is supported through serial (SPI flash), parallel (Master SelectMAP), or JTAG interfaces, with bitstream encryption and HMAC authentication available for secure boot. The device operates at -1 speed grade (1.0 ns CLB propagation delay) and supports industrial temperature range (-40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,960 - determines maximum combinational/sequential logic capacity for complex state machines and datapaths |
| DSP Slices | 15,360 DSP48E1 - enables high-throughput fixed-point arithmetic for FIR filters, FFT engines, and beamforming |
| Transceiver Speed | 12.8 Gb/s - supports 10G Ethernet, CPRI Option 3, and SRIO 2.1 line rates without external retimers |
| Block RAM | 14,544 kbits - provides on-chip memory for buffering, FIFOs, and coefficient storage in real-time signal chains |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, differential signaling - enables direct interfacing with ADCs, DACs, FPGAs, and ASICs |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB delay for critical paths in high-frequency control loops |
| Operating Temp | -40°C to +100°C - qualified for deployment in outdoor base stations and avionics enclosures without derating |
Pinout & Package
XC6VLX240T-1FF784C is housed in a 29×29 mm, 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FF784) package with 1.0 mm ball pitch and thermal lid. The package supports standard reflow profiles and provides dedicated power/ground ball arrays per I/O bank and transceiver bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master SelectMAP mode; must be stable before INIT_B assertion |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating configuration memory readiness and CRC pass/fail status |
| DONE | Configuration Completion Output | Open-drain signal pulled high when bitstream loading and startup sequence complete successfully |
| M0–M2 | Mode Selection Inputs | Set configuration interface mode (JTAG, Slave Serial, Master SelectMAP, etc.) at power-on reset |
| GTX_CLK0_M2C | Transceiver Reference Clock Input | Primary differential reference clock input for Bank 112 GTX transceivers; requires AC-coupled 100 Ω termination |
| VCCO_13 | I/O Bank Power Supply | Provides output buffer voltage for Bank 13; must match connected interface standard (e.g., 1.8 V for SSTL18) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4/x8 lanes with full link training and error reporting-reduces soft-core resource usage and latency |
| Secure Boot with AES-256 | On-chip decryption engine and HMAC authentication ensure bitstream integrity and prevent unauthorized configuration |
| Multi-Gigabit Transceivers | 64 GTX transceivers with programmable equalization, pre-emphasis, and receiver decision feedback equalization (DFE) |
| High-Density Block RAM | 14,544 kbits distributed across 48 BRAM primitives-supports dual-port synchronous access for ping-pong buffering |
| Advanced Clock Management | Six MMCMs with sub-picosecond phase shift resolution and <150 fs RMS jitter-enables clean clock domain crossing for ADC/DAC interfaces |
Applications
| Wireless Baseband Processing | Radar Signal Processing |
|---|---|
Use Scenario: Real-time digital predistortion (DPD) and uplink/downlink MIMO processing in LTE-A and 5G NR macro base stations. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling symbol-level modulation, channel estimation, and adaptive filtering. Use Value: 15,360 DSP48E1 slices enable concurrent execution of 4× 4x4 MIMO DPD kernels at 122.88 MHz sampling rate. | Use Scenario: Pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne surveillance platforms. IC Role / Device Role / Timing Role: High-throughput signal correlator and FFT accelerator synchronized to system timing reference. Use Value: 12.8 Gb/s transceivers directly interface with 12-bit, 2.6 GSPS ADCs via JESD204B subclass 1 links. |
| Avionics Data Concentrators | Industrial Test Equipment |
Use Scenario: ARINC 664 (AFDX) end-system switching and deterministic time-triggered Ethernet bridging in flight control networks. IC Role / Device Role / Timing Role: Deterministic packet classifier and scheduler enforcing sub-microsecond latency bounds. Use Value: -1 speed grade ensures worst-case path timing closure at 200 MHz for AFDX frame parsing and timestamping logic. | Use Scenario: High-speed digital pattern generation and response analysis in automated test equipment (ATE) for SoC validation. IC Role / Device Role / Timing Role: Reconfigurable stimulus generator with precise edge placement and deep pattern memory. Use Value: 14,544 kbits of block RAM stores >1 million 32-bit vectors for extended functional test sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | 16 nm process, 464K logic cells, 24.3 Gb/s transceivers, no native PCIe Gen2 hard IP | Better power efficiency and higher transceiver bandwidth; lacks integrated PCIe endpoint block | Select when migrating to UltraScale architecture with emphasis on SerDes bandwidth over protocol offload |
| XC7VX485T-2FFG1761I | 28 nm process, 485,760 logic cells, 13.1 Gb/s transceivers, PCIe Gen3 x8 hard IP | Higher logic density and Gen3 support; larger package (1761-pin) increases PCB layer count and routing complexity | Select when needing PCIe Gen3 endpoint and >2× logic resources, accepting larger footprint and thermal envelope |
Compared with XC6VLX240T-1FF784C, the XCKU060 offers superior transceiver speed and lower static power but requires soft PCIe implementation, while the XC7VX485T delivers higher logic capacity and Gen3 support at the cost of increased board area and thermal management overhead.
Availability
XC6VLX240T-1FF784C is available at Aetrix Electronics and suitable for wireless infrastructure, radar systems, and avionics requiring stable component supply across long production lifecycles.
Supply support for XC6VLX240T-1FF784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-6 family, including XC6VLX240T-1FF784C, was engineered for high-performance signal processing and high-bandwidth interconnect applications in wired and wireless infrastructure equipment.
FAQ
What is the maximum supported transceiver data rate for XC6VLX240T-1FF784C?
The XC6VLX240T-1FF784C supports a maximum transceiver line rate of 12.8 Gb/s per GTX channel. This enables compliance with 10GBASE-R Ethernet, CPRI Option 3, and SRIO 2.1 standards. All 64 GTX transceivers in the XC6VLX240T-1FF784C operate within this specification under industrial temperature conditions and -1 speed grade timing constraints.
Does XC6VLX240T-1FF784C include hard IP for PCI Express?
Yes, XC6VLX240T-1FF784C integrates a hard PCIe Gen2 Endpoint block supporting x1, x2, x4, and x8 configurations. It handles physical layer initialization, link training, and transaction layer packet processing without consuming programmable logic resources. This capability is documented in UG371 and verified in production designs using XC6VLX240T-1FF784C.
What configuration modes are supported by XC6VLX240T-1FF784C?
XC6VLX240T-1FF784C supports Master SelectMAP, Slave SelectMAP, JTAG, and Slave Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. Configuration data can be loaded from SPI flash, parallel PROM, or external processor via the SelectMAP interface. The XC6VLX240T-1FF784C also supports fallback and multi-boot via external flash partitioning.
What is the operating temperature range for XC6VLX240T-1FF784C?
The XC6VLX240T-1FF784C is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating applies to the C-grade device variant and is validated per Xilinx DS152 specification. Thermal design must maintain junction temperature within this range under full logic and transceiver utilization, especially in compact enclosures typical of XC6VLX240T-1FF784C deployments.
How many block RAM resources does XC6VLX240T-1FF784C provide?
XC6VLX240T-1FF784C provides 14,544 kbits of total block RAM, implemented across 48 individual BRAM primitives. Each BRAM supports true dual-port synchronous read/write operations with independent clocks, enabling efficient ping-pong buffering and coefficient storage in signal processing pipelines. This capacity is fixed and confirmed in the XC6VLX240T-1FF784C data sheet (DS152 v2.5).
XC6VLX240T-1FF784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX240T-1FF784C FAQ
1.How can I place an order for XC6VLX240T-1FF784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-1FF784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-1FF784C reliable?
The price and inventory of XC6VLX240T-1FF784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-1FF784C is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-1FF784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-1FF784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-1FF784C?
XC6VLX240T-1FF784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-1FF784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-1FF784C?
For technical support, including XC6VLX240T-1FF784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-1FF784C requirements.
6.How does Aetrix verify that XC6VLX240T-1FF784C is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-1FF784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-1FF784C meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-1FF784C?
All XC6VLX240T-1FF784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-1FF784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-1FF784C part is unused and in its original packaging.
Return procedure for XC6VLX240T-1FF784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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