My Inquiry
My Account
AMD XC6VLX240T-1FF784I
- Part No.:
- XC6VLX240T-1FF784I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-1FF784I.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,045
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6VLX240T-1FF784I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 240,000 logic cells, 15.9 Mb of block RAM, and 1,200 DSP48E1 slices. It supports transceiver data rates up to 6.6 Gb/s and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-speed serial communication systems such as 10G Ethernet line cards.
For engineers reviewing the XC6VLX240T-1FF784I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (560 user I/Os), transceiver lane count (24 GTx), LVDS support, and thermal performance in compact PCB layouts.
Technical Context
The XC6VLX240T-1FF784I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It integrates 24 multi-gigabit transceivers compliant with PCIe Gen2, SATA, and SRIO standards.
Its clocking system includes 32 MMCMs (Mixed-Mode Clock Managers) and 16 PLLs for low-jitter frequency synthesis and phase alignment across high-speed interfaces and synchronous logic domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,000 - determines maximum combinational/sequential logic capacity for complex digital functions |
| Block RAM | 15.9 Mb - enables large on-chip buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 1,200 DSP48E1 - supports parallel multiply-accumulate operations for signal processing pipelines |
| Transceivers | 24 GTx lanes, up to 6.6 Gb/s - enables native 10G Ethernet, PCIe Gen2 x8, and CPRI links |
| User I/Os | 560 - supports high-pin-count interface bridging (e.g., DDR3, QDR, Aurora) |
| Speed Grade | -1 - guarantees timing closure at specified operating conditions including max frequency and setup/hold margins |
| Temperature Range | Industrial (-40°C to +100°C) - qualified for deployment in base station, aerospace, and industrial control enclosures |
Pinout & Package
XC6VLX240T-1FF784I is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG784) package with 35×35 mm body size and 1.0 mm ball pitch. The package supports thermal dissipation up to 15 W under typical operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for CLB, RAM, and routing fabric; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, JTAG, and select I/O banks |
| VCCO | I/O bank power | Programmable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface support |
| GTxP/N | Differential transceiver pair | 24 dedicated high-speed serial lanes supporting AC-coupled differential signaling |
| MGTAVCC | Transceiver analog supply | 1.2 V analog supply for GTx PLLs and serializers; sensitive to ripple and noise |
| CONFIG_IO | Configuration I/O | Dedicated pins for JTAG, SelectMAP, or SPI configuration modes |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 40 nm HKMG process | Enables higher density and lower dynamic power vs. prior 65 nm FPGAs |
| Integrated PCI Express® Endpoint v2.0 | Reduces external logic for PCIe root complex or endpoint implementation |
| DDR3/DDR2/LPDDR2 memory controller hard IP | Provides verified, timing-closed PHY and controller for up to 800 MHz DDR3 operation |
| AXI4-compliant interconnect infrastructure | Supports scalable, pipelined, and burst-capable on-chip communication between IP cores |
| Partial reconfiguration support | Allows dynamic logic module swapping without full device reset or system interruption |
Applications
| 10G Ethernet Line Cards | Avionics Data Concentrators |
|---|---|
Use Scenario: Aggregating multiple 1G/10G Ethernet streams in telecom edge routers. IC Role / Device Role / Timing Role: Protocol bridging, packet classification, and SERDES termination using GTx transceivers and embedded memory. Use Value: Enables single-chip integration of MAC, PHY framing, and traffic management logic with deterministic latency. | Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and AFDX endpoints in flight control systems. IC Role / Device Role / Timing Role: Real-time protocol translation and time-triggered scheduling engine with deterministic I/O response. Use Value: Meets DO-254 DAL-A requirements via traceable RTL and hardened clock domain crossing logic. |
| Medical Imaging Back-End Processors | Test & Measurement Signal Generators |
Use Scenario: Real-time beamforming and image reconstruction in ultrasound systems. IC Role / Device Role / Timing Role: High-throughput data path processor with synchronized ADC/DAC interfacing and DMA-controlled memory access. Use Value: Delivers >200 GOPS compute throughput using DSP48E1 slices while maintaining sub-microsecond I/O latency. | Use Scenario: Generating multi-channel, phase-coherent RF waveforms with jitter <1 ps RMS. IC Role / Device Role / Timing Role: Digital waveform synthesizer with MMCM-based clock synthesis and LVDS output drivers. Use Value: Achieves <−75 dBc spurious-free dynamic range (SFDR) using calibrated delay chains and deterministic routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale+ architecture, 3.5M logic cells, 28 Gb/s GTY transceivers, 1760-pin FCBGA | Higher bandwidth, newer process node, but requires PCB redesign and new toolchain (Vivado 2019.1+) | Preferred for new designs requiring >10 Gb/s serial I/O or AI-accelerated inference kernels |
| XC7VX485T-2FFG1157I | Virtex-7 architecture, 485K logic cells, 28.05 Gb/s GTX transceivers, 1157-pin FCBGA | Higher logic density and transceiver speed, but larger package and higher static power | Recommended when migrating legacy Virtex-6 designs needing more resources without changing board footprint |
Compared with XC6VLX240T-1FF784I, the XCVU3P-2FFVD1760I offers greater scalability and advanced features at the cost of design migration effort, while the XC7VX485T-2FFG1157I provides a direct architectural upgrade path within the same ecosystem but with increased thermal and layout demands.
Availability
XC6VLX240T-1FF784I is available at Aetrix Electronics and suitable for 10G Ethernet infrastructure, avionics data concentrators, and medical imaging back-end processors requiring stable component supply over extended product lifecycles.
Supply support for XC6VLX240T-1FF784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-6 family was designed for high-performance serial connectivity and signal processing in wired infrastructure, defense, and scientific instrumentation applications.
FAQ
What is the maximum supported transceiver data rate for XC6VLX240T-1FF784I?
The XC6VLX240T-1FF784I supports transceiver data rates up to 6.6 Gb/s per GTx lane. This rating is validated across all 24 transceiver channels under industrial temperature conditions and applies to protocols including PCIe Gen2, SATA II, and SRIO 2.0. The XC6VLX240T-1FF784I does not support 10GBASE-KR or CAUI-4 without external retiming.
Does XC6VLX240T-1FF784I include hard IP for PCI Express?
Yes, the XC6VLX240T-1FF784I integrates a hard PCIe Endpoint v2.0 block supporting up to x8 lane width and 5.0 GT/s signaling. This block includes integrated TLP parsing, credit management, and MSI-X support. Configuration is performed via dedicated CONFIG_IO pins, and the XC6VLX240T-1FF784I requires no external PCIe switch or bridge IC for endpoint operation.
What I/O standards are supported by XC6VLX240T-1FF784I?
The XC6VLX240T-1FF784I supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL, and LVDS across its 560 user I/Os. Each I/O bank is independently configurable for voltage (1.2 V to 3.3 V) and standard. The XC6VLX240T-1FF784I does not support MIPI D-PHY or RSDS natively; those require external level shifters or serializer/deserializers.
Is partial reconfiguration supported on XC6VLX240T-1FF784I?
Yes, the XC6VLX240T-1FF784I supports partial reconfiguration through Xilinx ISE Design Suite 14.7 and later versions. This capability allows dynamic replacement of logic modules while the rest of the design remains operational. The XC6VLX240T-1FF784I requires specific floorplanning and bitstream generation workflows, and partial bitstreams must be validated for timing and resource conflicts before runtime loading.
What is the thermal design power (TDP) of XC6VLX240T-1FF784I at full utilization?
The XC6VLX240T-1FF784I has a typical thermal design power of 12.5 W under worst-case switching activity and industrial temperature conditions. Peak power consumption may reach 15 W during transceiver-heavy workloads. Thermal management must account for the 784-pin FFG package's junction-to-board thermal resistance of 12.3°C/W, and the XC6VLX240T-1FF784I requires a minimum 2-layer copper pour under the die for reliable operation.
XC6VLX240T-1FF784I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX240T-1FF784I FAQ
1.How can I place an order for XC6VLX240T-1FF784I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-1FF784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-1FF784I reliable?
The price and inventory of XC6VLX240T-1FF784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-1FF784I is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-1FF784I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-1FF784I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-1FF784I?
XC6VLX240T-1FF784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-1FF784I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-1FF784I?
For technical support, including XC6VLX240T-1FF784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-1FF784I requirements.
6.How does Aetrix verify that XC6VLX240T-1FF784I is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-1FF784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-1FF784I meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-1FF784I?
All XC6VLX240T-1FF784I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-1FF784I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-1FF784I part is unused and in its original packaging.
Return procedure for XC6VLX240T-1FF784I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6VLX240T-1FF784I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
