AMD XC6VLX240T-1FFG1156C
- Part No.:
- XC6VLX240T-1FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-1FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VLX240T-1FFG1156C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 240,960 logic cells, 15.36 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It operates at -1 speed grade, features 1156-pin Flip-Chip BGA (FFG) packaging, and targets high-bandwidth wired infrastructure applications including 10G Ethernet line cards and wireless baseband processing.
For engineers reviewing the XC6VLX240T-1FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and data rate, DSP slice density, block RAM capacity, and PCIe endpoint compliance for system-level integration.
Technical Context
The XC6VLX240T-1FFG1156C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 18x25 DSP48E1 slices, and 36-Kb block RAMs. It integrates 24 RocketIO GTP transceivers supporting 600 Mb/s to 6.6 Gb/s line rates with built-in 8B/10B encoding and elastic buffers.
It supports PCI Express Base Specification v2.0 as an endpoint with integrated hard IP, includes dual 36-bit wide DDR3 memory controllers up to 800 MHz, and delivers deterministic timing closure via ISE Design Suite 14.7 with device-specific place-and-route algorithms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,960 - total available LUT-based programmable resources for custom digital logic implementation |
| Transceivers | 24 × GTP - supports 600 Mb/s to 6.6 Gb/s serial links with embedded clock/data recovery |
| DSP Slices | 768 × DSP48E1 - enables high-throughput arithmetic operations for filtering, FFT, and modulation |
| Block RAM | 14,544 Kb - distributed across 576 × 36-Kb RAMB36E1 blocks for on-chip data buffering |
| PCIe Interface | Gen2 x8 Endpoint - hard IP compliant with PCI-SIG specification v2.0 for host communication |
| I/O Pins | 600 - user-configurable single-ended or differential I/Os with support for LVDS, SSTL, HSTL |
| Speed Grade | -1 - guarantees timing performance at maximum operating frequency under specified voltage/temperature conditions |
Pinout & Package
XC6VLX240T-1FFG1156C uses a 1156-ball flip-chip fine-pitch BGA (FFG) package with 35×35 array, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.0 V ±3% supply for FPGA logic fabric and CLBs |
| VCCAUX | Auxiliary Power Supply | 2.5 V supply for configuration, clocking, and transceiver reference circuits |
| VCCO | I/O Power Supply | Programmable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface support |
| MRCC/MRCC_N | Multi-Gigabit Transceiver Reference Clock Input | Differential input pair for GTP transceiver PLL reference clock (100–700 MHz) |
| PCIE_CLK_P/N | PCIe Reference Clock Input | Dedicated differential input for PCIe Gen2 clock (100 MHz) |
| CONFIG_IO[0:3] | Configuration Mode Selection | Defines boot source (JTAG, Master BPI, Slave SelectMAP) during power-up |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Reduces external interface complexity and eliminates need for discrete bridge ICs in host-connected systems |
| 24 GTP Transceivers | Enables multi-lane serial protocols (XAUI, CPRI, SRIO) without external retimers or serializers |
| Dual DDR3 Memory Controller | Supports up to 800 MHz operation with 64-bit data width per controller for high-bandwidth memory subsystems |
| 768 DSP48E1 Slices | Delivers 1.2 TMAC/s peak computational throughput for real-time signal processing workloads |
| Partial Reconfiguration Support | Allows dynamic logic module swapping in-system without full device reset or service interruption |
Applications
| 10G Ethernet Line Card | Wireless LTE Baseband Unit |
|---|---|
Use Scenario: Aggregating and switching 10GbE traffic in carrier-grade edge routers with packet classification and QoS enforcement. IC Role / Device Role / Timing Role: Primary programmable fabric handling MAC-layer processing, SERDES interfacing, and traffic management logic. Use Value: 24 GTP transceivers directly terminate four 10GBASE-R PHY lanes; PCIe Gen2 x8 connects to network processor for control plane offload. | Use Scenario: Real-time channel coding, MIMO precoding, and OFDM modulation/demodulation in LTE eNodeB remote radio heads. IC Role / Device Role / Timing Role: Baseband signal processor executing Layer 1 functions with deterministic latency via dedicated DSP slices and block RAM. Use Value: 768 DSP48E1 slices enable concurrent execution of Turbo decoder and FFT engines; DDR3 controllers buffer IQ samples at 1.6 GB/s aggregate bandwidth. |
| Medical Imaging Data Acquisition | Test & Measurement Instrumentation |
Use Scenario: High-speed digitization and preprocessing of ultrasound echo data before transfer to host PC via PCIe. IC Role / Device Role / Timing Role: Real-time front-end processor synchronizing ADC sampling, applying beamforming coefficients, and packing data into PCIe TLPs. Use Value: Deterministic timing closure ensures sub-10 ns jitter on ADC sampling clocks; PCIe Gen2 x8 provides 4 GB/s sustained payload throughput. | Use Scenario: Multi-channel oscilloscope with simultaneous 1 GS/s sampling across 8 channels and real-time FFT analysis. IC Role / Device Role / Timing Role: Time-critical acquisition engine managing ADC control, trigger logic, and spectral computation pipeline. Use Value: 600 user I/Os route parallel ADC bus and trigger signals; 14,544 Kb block RAM stores waveform segments for post-processing without DRAM latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX365T-1FFG1156C | 365,120 logic cells, 36 GTP transceivers, higher DSP and BRAM resources | Required for larger algorithm footprints or additional protocol lanes beyond XC6VLX240T capacity | Select when design exceeds 240K LC utilization or requires >24 transceiver lanes |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, 20nm process, 32 GTY transceivers up to 16.3 Gb/s, no native PCIe Gen2 endpoint | Targets next-generation designs needing higher serial bandwidth but requiring external PCIe root complex or soft IP | Choose for migration path requiring higher speed interfaces and lower power, accepting PCIe integration trade-off |
Compared with XC6VLX240T-1FFG1156C, the XC6VLX365T offers greater resource headroom within identical package and speed grade, while the XCKU060 delivers superior transceiver performance and density at 20nm but shifts PCIe implementation responsibility to external components or soft logic.
Availability
XC6VLX240T-1FFG1156C is available at Aetrix Electronics and suitable for 10G Ethernet infrastructure, wireless baseband processing, medical imaging systems, and test equipment requiring stable component supply across extended production lifecycles.
Supply support for XC6VLX240T-1FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio for data center, communications, and embedded markets.
The Virtex-6 family was designed for high-performance wired and wireless infrastructure, emphasizing transceiver bandwidth, DSP throughput, and PCIe integration for protocol acceleration and real-time signal processing.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6VLX240T-1FFG1156C?
The XC6VLX240T-1FFG1156C supports DDR3 memory interfaces up to 800 MHz data rate (1600 MT/s) using its dual integrated memory controllers. Each controller drives a 64-bit wide interface with programmable timing parameters aligned to JEDEC DDR3 specifications. This capability is verified in Xilinx UG388 and implemented in ISE Design Suite 14.7 targeting the -1 speed grade.
Does XC6VLX240T-1FFG1156C include a hard PCIe Gen2 endpoint block?
Yes, XC6VLX240T-1FFG1156C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI-SIG Base Specification v2.0. It handles link training, transaction layer packet (TLP) generation, and configuration space access without soft logic overhead. This feature is documented in Xilinx DS152 and validated in PCIe compliance test reports for the Virtex-6 LX240T device.
What transceiver protocols are natively supported by the GTP transceivers in XC6VLX240T-1FFG1156C?
The 24 GTP transceivers in XC6VLX240T-1FFG1156C natively support XAUI, CPRI, Serial RapidIO, and 10GBASE-R through built-in 8B/10B encoding, comma detection, and elastic buffers. Protocol-specific configuration is handled via ISE primitives and transceiver wizard settings. These capabilities are confirmed in Xilinx UG371 and verified in application notes XAPP870 and XAPP892.
What is the core voltage requirement for XC6VLX240T-1FFG1156C?
XC6VLX240T-1FFG1156C requires a 1.0 V ±3% core supply (VCCINT) delivered to all internal logic fabric and CLBs. This voltage must be regulated with ≤±10 mV ripple under dynamic load conditions. The specification is defined in Xilinx DS152 and enforced by on-die voltage monitoring circuitry that triggers configuration abort if out-of-tolerance.
Is partial reconfiguration supported on XC6VLX240T-1FFG1156C?
Yes, XC6VLX240T-1FFG1156C supports partial reconfiguration through ISE Design Suite 14.7 tools and associated bitstream generation flow. This allows dynamic replacement of logic modules without resetting the entire device or interrupting active I/O or transceiver links. Implementation guidelines and constraints are detailed in Xilinx UG702 and validated in reference designs such as the PR Demo for Virtex-6.
XC6VLX240T-1FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX240T-1FFG1156C FAQ
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Please submit a Request for Quotation (RFQ) for XC6VLX240T-1FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC6VLX240T-1FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-1FFG1156C is usually 5 days.
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6.How does Aetrix verify that XC6VLX240T-1FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-1FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-1FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-1FFG1156C?
All XC6VLX240T-1FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-1FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-1FFG1156C part is unused and in its original packaging.
Return procedure for XC6VLX240T-1FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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