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AMD XC6VLX240T-1FFG1156I
- Part No.:
- XC6VLX240T-1FFG1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-1FFG1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,011
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Product details
Overview
XC6VLX240T-1FFG1156I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 240,000 logic cells, 15.36 Gb/s transceiver capability, and embedded Block RAM totaling 10,380 kbits. It operates at -1 speed grade with industrial temperature range (-40°C to +100°C) and is used in high-speed serial interface bridging and reconfigurable signal processing systems.
For engineers reviewing the XC6VLX240T-1FFG1156I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic cell density, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), thermal performance in FFG1156 package, and industrial-grade reliability.
Technical Context
The XC6VLX240T-1FFG1156I implements a 40 nm CMOS architecture with integrated multi-gigabit transceivers (MGTs), DSP48E1 slices for arithmetic-intensive tasks, and SelectIO technology supporting multiple I/O standards. It includes dedicated clock management tiles with DCM and PLL blocks for low-jitter clock synthesis and distribution.
This device belongs to the Virtex-6 LXT family, where "LX" denotes logic-optimized and "T" indicates inclusion of high-speed transceivers. Its configuration is performed via JTAG or master/slave SPI/BPI modes, and it supports partial reconfiguration for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,000 - determines maximum combinational and sequential logic capacity for complex digital functions |
| Block RAM | 10,380 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory access |
| Transceiver Speed | 15.36 Gb/s - enables PCIe Gen2, SATA II, and SRIO v2.0 physical layer compliance |
| I/O Standards | Supports LVCMOS, LVDS, SSTL, HSTL, Differential Signaling - allows direct interfacing with diverse memory and peripheral ICs |
| Speed Grade | -1 - specifies maximum operating frequency under industrial temperature conditions with defined timing margins |
| Operating Temp | -40°C to +100°C - qualifies for deployment in harsh-environment industrial and transportation systems |
| Configuration Mode | JTAG, Master/Slave SPI, BPI - enables flexible programming and field updates during system operation |
Pinout & Package
The XC6VLX240T-1FFG1156I is housed in a 1156-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG1156) package with 0.8 mm pitch, designed for high I/O count and thermal dissipation in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V supply for FPGA logic fabric; requires tight regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration circuitry, JTAG, and transceiver reference clocks |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface design |
| MR | Master Reset | Asynchronous global reset input that clears configuration and logic states |
| CCLK | Configuration clock | Input clock for slave serial configuration mode; sourced externally or internally |
| GTX_CLK | Transceiver reference clock | Differential input for MGT PLL; must meet jitter and slew rate specifications |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MGTs | Up to 24 transceivers supporting 600 Mb/s–15.36 Gb/s data rates with built-in 8B/10B encoding |
| DSP48E1 Slices | 768 dedicated arithmetic units with 25×18 multipliers and 48-bit accumulators for real-time filtering |
| SelectIO Technology | Programmable I/O with source-synchronous timing, internal termination, and programmable slew rate |
| Partial Reconfiguration | Enables dynamic logic module swapping while maintaining active functionality in other regions |
| Advanced Clock Management | DCM and PLL blocks per clock region provide phase alignment, frequency synthesis, and jitter reduction |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable digital front-end processor handling ADC interface, FFT computation, and serial data streaming. Use Value: 240K logic cells and 768 DSP48E1 slices enable parallelized FFT engines; 15.36 Gb/s transceivers support JESD204B-compliant sensor data ingestion. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers requiring synchronized sampling at >1 GS/s. IC Role / Device Role / Timing Role: Time-interleaved ADC controller and real-time data compression engine. Use Value: SelectIO banks support precise source-synchronous capture of parallel ADC outputs; Block RAM buffers absorb burst data before PCIe Gen2 upload. |
| Industrial Ethernet Switching | Avionics Data Concentration |
Use Scenario: Deterministic packet switching in PROFINET IRT and TSN-enabled factory automation controllers. IC Role / Device Role / Timing Role: Programmable MAC-layer accelerator and time-aware shaper for sub-microsecond latency control. Use Value: Embedded transceivers interface directly with PHYs; -1 speed grade ensures timing closure at 125 MHz line-rate clocking across industrial temperature range. | Use Scenario: ARINC 664 Part 7 (AFDX) end-system data concentrators in flight control subsystems. IC Role / Device Role / Timing Role: Redundant virtual link scheduler and CRC validation engine with deterministic latency budgeting. Use Value: Industrial temperature rating (-40°C to +100°C) and FFG1156 package thermal performance ensure reliability in uncontrolled avionics bays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2.5x higher logic density, 25.78 Gb/s transceivers, 0.85 V core voltage | Targets next-generation AFDX endpoints and 5G fronthaul where bandwidth and power efficiency are critical | Requires new PCB layout and toolchain migration; not pin-compatible with XC6VLX240T-1FFG1156I |
| XC7VX485T-2FFG1761I | 7-series architecture, 485K logic cells, 13.1 Gb/s transceivers, larger FFG1761 package | Suitable for cost-sensitive upgrades where transceiver count exceeds XC6VLX240T-1FFG1156I but 15.36 Gb/s is not required | Offers higher logic density but lower max transceiver speed; pinout and power delivery differ significantly |
Compared with XC6VLX240T-1FFG1156I, the XCVU9P-2FLGA2104I delivers higher throughput and lower power per function but demands full redesign, while the XC7VX485T-2FFG1761I extends logic capacity within legacy toolflow yet sacrifices peak serial bandwidth.
Availability
XC6VLX240T-1FFG1156I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and industrial Ethernet switching requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX240T-1FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and aerospace applications.
The Virtex-6 family was engineered for high-performance reconfigurable systems demanding multi-gigabit serial connectivity, deterministic timing, and industrial-grade reliability in mission-critical infrastructure.
FAQ
What is the maximum transceiver line rate supported by XC6VLX240T-1FFG1156I?
The XC6VLX240T-1FFG1156I supports a maximum transceiver line rate of 15.36 Gb/s. This enables compliance with protocols including PCIe Gen2, SATA II, and SRIO v2.0. The transceivers are part of the LXT family's integrated multi-gigabit transceiver (MGT) blocks and require proper reference clock jitter specification and board-level signal integrity design to achieve rated performance. XC6VLX240T-1FFG1156I does not support 25+ Gb/s protocols such as PCIe Gen3 or 100G Ethernet.
Does XC6VLX240T-1FFG1156I support partial reconfiguration?
Yes, XC6VLX240T-1FFG1156I supports partial reconfiguration through its configuration logic and bitstream architecture. This allows dynamic swapping of functional modules-such as different filter coefficients or protocol stacks-without resetting the entire device. Implementation requires Vivado Design Suite or ISE 14.7 with appropriate constraints and floorplanning. XC6VLX240T-1FFG1156I uses frame-based reconfiguration, and the feature is validated for industrial temperature operation.
What I/O voltage standards are supported by XC6VLX240T-1FFG1156I?
XC6VLX240T-1FFG1156I supports LVCMOS (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), LVDS, Mini-LVDS, RSDS, BLVDS, SSTL, HSTL, and differential signaling standards. Each I/O bank is independently configurable for voltage and standard, enabling mixed-interface designs. XC6VLX240T-1FFG1156I requires separate VCCO supplies per bank and adheres to strict voltage tolerance limits per standard-e.g., ±5% for LVCMOS, ±100 mV for LVDS common-mode range.
What is the operating temperature range for XC6VLX240T-1FFG1156I?
XC6VLX240T-1FFG1156I is rated for industrial temperature operation from -40°C to +100°C. This range applies to junction temperature under specified power dissipation and airflow conditions. The -1 speed grade guarantees timing closure across this full range when using recommended power supply tolerances and thermal management. XC6VLX240T-1FFG1156I is not qualified for extended military or automotive AEC-Q100 temperature grades.
How is XC6VLX240T-1FFG1156I configured after power-up?
XC6VLX240T-1FFG1156I supports multiple configuration modes: JTAG for debugging and programming, master SPI for autonomous boot from flash, and slave serial/parallel for host-controlled initialization. Configuration bitstream is loaded into SRAM-based fabric; no non-volatile storage is embedded. XC6VLX240T-1FFG1156I requires external configuration memory (e.g., SPI flash) unless programmed via JTAG during development. Bitstream encryption and HMAC authentication are available for secure configuration.
XC6VLX240T-1FFG1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX240T-1FFG1156I FAQ
1.How can I place an order for XC6VLX240T-1FFG1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-1FFG1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-1FFG1156I reliable?
The price and inventory of XC6VLX240T-1FFG1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-1FFG1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-1FFG1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-1FFG1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-1FFG1156I?
XC6VLX240T-1FFG1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-1FFG1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-1FFG1156I?
For technical support, including XC6VLX240T-1FFG1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-1FFG1156I requirements.
6.How does Aetrix verify that XC6VLX240T-1FFG1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-1FFG1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-1FFG1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-1FFG1156I?
All XC6VLX240T-1FFG1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-1FFG1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-1FFG1156I part is unused and in its original packaging.
Return procedure for XC6VLX240T-1FFG1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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