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AMD XC6VLX240T-1FFG1759C
- Part No.:
- XC6VLX240T-1FFG1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-1FFG1759C.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,479
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Product details
Overview
XC6VLX240T-1FFG1759C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 240,000 logic cells, 1,344 DSP48E1 slices, and 12.8 Gb/s transceiver capability. It features 1,759-ball Flip-Chip BGA (FFG) packaging, -1 speed grade, and operates at 0°C to 85°C junction temperature. It is used in high-speed serial interface bridging for 10G Ethernet and CPRI-based wireless infrastructure.
For engineers reviewing the XC6VLX240T-1FFG1759C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O bank voltage support, configuration mode options, and thermal performance under sustained 10G+ data throughput.
Technical Context
The XC6VLX240T-1FFG1759C implements a hierarchical FPGA architecture with Configurable Logic Blocks (CLBs), Block RAM (BRAM), and dedicated high-speed serial transceivers compliant with PCIe Gen2, SATA, and SRIO standards. It supports SelectIO™ standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gbps per pin.
Configuration is performed via Master SPI, Slave Parallel, or JTAG modes using internal or external configuration memory. The device integrates clock management tiles (CMTs) with dual DCMs and PLLs per CMT, enabling precise clock synthesis and phase alignment across multiple I/O banks and transceiver lanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,000 - determines maximum combinational and sequential logic capacity for protocol stack implementation |
| DSP Slices | 1,344 × DSP48E1 - enables parallel multiply-accumulate operations for real-time signal processing |
| Transceiver Speed | 12.8 Gb/s - supports single-lane 10GBASE-R and multi-lane CPRI Option 3/4 interfaces |
| I/O Pins | 720 user I/Os - distributed across 24 selectable I/O banks with independent VCCO and VREF control |
| Block RAM | 14,040 kbits - provides on-chip memory for packet buffering, FIFOs, and lookup tables |
| Speed Grade | -1 - guarantees timing closure at default operating conditions with 1.2V core voltage |
| Operating Temp | 0°C to +85°C - qualified for commercial-grade deployment in baseband units and network edge equipment |
Pinout & Package
XC6VLX240T-1FFG1759C uses a 1759-ball flip-chip BGA package (package code FFG1759) with 35×35 mm body size, 1.0 mm ball pitch, and standard RoHS-compliant lead-free finish. Thermal pad is exposed on underside for enhanced heat dissipation in high-power configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master SPI mode; must be stable before INIT_B deassertion |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration memory readiness or error state |
| DONE | Configuration Completion Output | Open-drain output that goes high when configuration bitstream loading and startup sequence complete |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock Input | Differential pair feeding GTX transceiver tile; requires 100 Ω termination and low-jitter source |
| VCCAUX | Auxiliary Supply | 1.8 V supply for configuration logic, transceiver analog circuitry, and I/O banks supporting 1.8 V standards |
| VCCINT | Core Supply | 1.2 V regulated supply powering CLBs, interconnect, and BRAM; requires tight regulation ±3% |
Key Features
| Feature | Design Value |
|---|---|
| High-Speed Serial Transceivers | 24 GTX transceivers supporting 600 Mb/s–12.8 Gb/s with built-in 8B/10B encoding and elastic buffers |
| SelectIO Technology | Supports 21 I/O standards including LVDS_25, SSTL15, HSTL_I, and differential swing up to 1.8 V |
| Advanced Clock Management | Dual DCM + PLL per CMT enables independent clock domain crossing, jitter filtering, and dynamic phase shifting |
| Partial Reconfiguration Support | Enables runtime logic module swapping without full device reset-critical for adaptive radio and protocol migration |
| PCIe Endpoint Logic | Integrated hard IP for PCIe Gen2 x8 endpoint operation-reduces soft-core resource usage and latency |
Applications
| Wireless Baseband Processing | 10G Ethernet Line Cards |
|---|---|
Use Scenario: Real-time digital pre-distortion (DPD) and crest factor reduction (CFR) in LTE-A and 5G NR macro base stations. IC Role / Device Role / Timing Role: Programmable logic fabric hosting DPD algorithms with deterministic latency and synchronized sampling clocks. Use Value: Enables >40% power amplifier efficiency improvement while maintaining ACLR < -50 dBc through hardware-accelerated signal conditioning. | Use Scenario: MAC-to-PHY bridging and packet classification in telecom aggregation switches. IC Role / Device Role / Timing Role: Protocol translation engine between 10GBASE-R MAC layer and SFP+ optical PHY interface. Use Value: Delivers sub-500 ns forwarding latency with full line-rate 10G throughput and IEEE 802.3ae compliance. |
| CPRI/Fronthaul Interface | Radar Signal Processing |
Use Scenario: Bidirectional fronthaul transport between BBU and RRH in centralized RAN architectures. IC Role / Device Role / Timing Role: Serial link aggregator handling up to 8 CPRI links (Option 3/4) with deterministic jitter compensation. Use Value: Maintains < 100 ps RMS jitter accumulation across 20 km fiber links, meeting CPRI timing Class A requirements. | Use Scenario: Pulse-Doppler processing and beamforming in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Real-time FFT engine and digital beamformer using pipelined DSP48E1 slices and block RAM-based delay lines. Use Value: Achieves 200+ simultaneous beam channels with < 1 μs latency per frame update at 100 MHz sample rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | 16nm UltraScale+ architecture; 475K logic cells; higher transceiver density (32 GTY @ 32.75 Gb/s); 1.8 V VCCINT | Targets next-gen 25G/100G interfaces and AI inference acceleration; not drop-in compatible | Choose for new designs requiring >20 Gb/s serial bandwidth or lower power per DSP operation |
| XC6VLX75T-1FFG484C | Same Virtex-6 family; 75K logic cells; 484-ball FFG package; no GTX transceivers (only GTP) | Suitable for mid-bandwidth control-plane logic and non-transceiver I/O expansion | Choose only if design fits within 75K LUTs and does not require >6.5 Gb/s serial links |
Compared with XC6VLX240T-1FFG1759C, the XCVU3P-2FFVD1760E delivers 2.5× more logic and 2.5× higher transceiver speed but requires PCB redesign and toolchain migration, while the XC6VLX75T-1FFG484C shares the same architecture but lacks transceiver capability and scale needed for 10G+ fronthaul.
Availability
XC6VLX240T-1FFG1759C is available at Aetrix Electronics and suitable for wireless infrastructure, high-speed networking, and defense radar applications requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX240T-1FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-6 family was designed for high-performance serial connectivity and signal processing in wired/wireless infrastructure, where deterministic latency, transceiver flexibility, and logic density are critical.
FAQ
What is the maximum supported transceiver line rate for XC6VLX240T-1FFG1759C?
The XC6VLX240T-1FFG1759C supports GTX transceivers rated up to 12.8 Gb/s per lane. This enables compliance with 10GBASE-R, CPRI Option 4, and SRIO Gen2 protocols. Actual achievable line rate depends on board layout quality, reference clock jitter (< 1 ps RMS), and signal integrity margins verified via IBIS-AMI simulation. The XC6VLX240T-1FFG1759C transceiver PMA and PCS blocks are factory-characterized to meet this specification under -1 speed grade conditions.
Does XC6VLX240T-1FFG1759C support partial reconfiguration?
Yes, XC6VLX240T-1FFG1759C supports partial reconfiguration through Xilinx ISE Design Suite 14.7 and Vivado HLx tools. This allows dynamic swapping of logic modules-such as modulation-specific DPD engines-without resetting the entire device. The XC6VLX240T-1FFG1759C configuration logic includes dedicated ICAP and FRAME_ECC interfaces to enable secure, error-corrected partial bitstream loading during runtime.
What I/O standards are supported by XC6VLX240T-1FFG1759C?
XC6VLX240T-1FFG1759C supports 21 SelectIO standards including LVDS_25, LVDS_33, SSTL15, SSTL18_I, HSTL_I, DIFF_HSTL_I, and TMDS. Each of its 24 I/O banks can be independently configured for different VCCO voltages (1.2 V to 3.3 V) and referenced standards. The XC6VLX240T-1FFG1759C also supports programmable slew rate and drive strength per pin group to optimize signal integrity in mixed-standard interfaces.
Is XC6VLX240T-1FFG1759C pin-compatible with other Virtex-6 devices?
No, XC6VLX240T-1FFG1759C is not pin-compatible with other Virtex-6 devices due to its unique 1759-ball FFG package and I/O bank allocation. While it shares the same architecture and configuration interface as smaller Virtex-6 variants, the XC6VLX240T-1FFG1759C requires a dedicated footprint. Migration to XC6VLX240T-1FFG1759C from XC6VLX75T-1FFG484C or XC6VLX130T-1FFG1156C necessitates full PCB redesign and thermal layout reassessment.
What configuration modes does XC6VLX240T-1FFG1759C support?
XC6VLX240T-1FFG1759C supports Master SPI, Slave Parallel, and JTAG configuration modes. Master SPI uses an external serial flash to boot autonomously; Slave Parallel allows host processor control over configuration data loading; JTAG is used for debugging and programming during development. All three modes are implemented in hardware and do not require external logic-the XC6VLX240T-1FFG1759C contains dedicated configuration logic for each interface.
XC6VLX240T-1FFG1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX240T-1FFG1759C FAQ
1.How can I place an order for XC6VLX240T-1FFG1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-1FFG1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-1FFG1759C reliable?
The price and inventory of XC6VLX240T-1FFG1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-1FFG1759C is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-1FFG1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-1FFG1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-1FFG1759C?
XC6VLX240T-1FFG1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-1FFG1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-1FFG1759C?
For technical support, including XC6VLX240T-1FFG1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-1FFG1759C requirements.
6.How does Aetrix verify that XC6VLX240T-1FFG1759C is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-1FFG1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-1FFG1759C meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-1FFG1759C?
All XC6VLX240T-1FFG1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-1FFG1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-1FFG1759C part is unused and in its original packaging.
Return procedure for XC6VLX240T-1FFG1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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