AMD XC6VLX240T-1FFG784C

Overview

XC6VLX240T-1FFG784C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 240,960 logic cells, 15,360 DSP48E1 slices, and 12.8 Gb/s transceiver capability in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It targets high-speed serial interface implementation in wired communications infrastructure.

For engineers reviewing the XC6VLX240T-1FFG784C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, embedded memory depth, I/O voltage support, and thermal performance under sustained routing density.

Technical Context

The XC6VLX240T-1FFG784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), and dedicated high-speed serial transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. Its clock management tiles integrate DCMs and PLLs for multi-domain clock synthesis and phase alignment.

It supports SelectIO standards up to 1.8 V and includes integrated PCI Express® Endpoint hard IP, enabling direct integration into host-facing data acquisition and packet processing systems without external bridge logic.

Key Specifications

Pinout & Package

XC6VLX240T-1FFG784C uses a 784-pin Flip-Chip Fine-Pitch BGA (FFG) package with thermal and power integrity optimized for high-speed signal integrity and thermal dissipation in industrial and telecom applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX240T-1FFG784C, the XC7VX485T offers 2× logic capacity and improved transceiver jitter performance but requires revised PCB layout and power delivery; the XCVU3P delivers 3× DSP throughput and native PCIe Gen3 support but mandates full toolchain and IP migration.

Availability

XC6VLX240T-1FFG784C is available at Aetrix Electronics and suitable for wired communications infrastructure, high-speed test equipment, and aerospace data concentrators requiring stable component supply over extended product lifecycles.

Supply support for XC6VLX240T-1FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family for high-performance programmable logic applications.

The Virtex-6 family was designed for demanding serial connectivity, signal processing, and protocol acceleration in infrastructure equipment where deterministic latency and hardware flexibility are critical.

FAQ

What is the maximum supported transceiver line rate for XC6VLX240T-1FFG784C?

The XC6VLX240T-1FFG784C supports a maximum transceiver line rate of 12.8 Gb/s per lane. This enables compliance with PCIe Gen2 (5 GT/s), SATA II (3 Gb/s), and SRIO x4 (3.125 Gb/s per lane) standards. The transceivers are implemented as GTX transceivers and require proper reference clocking and PCB impedance control to achieve full rated performance.

Does XC6VLX240T-1FFG784C include hard IP for PCI Express?

Yes, XC6VLX240T-1FFG784C integrates a PCIe Gen2 Endpoint hard IP block. This dedicated logic handles link training, transaction layer packet handling, and data link layer functions without consuming programmable logic resources. It supports x1, x2, x4, and x8 lane configurations and is fully compliant with the PCI Express Base Specification v2.0.

What I/O standards are supported by XC6VLX240T-1FFG784C?

XC6VLX240T-1FFG784C supports LVDS, LVCMOS (1.2 V to 1.8 V), SSTL-15/18, and HSTL-15/18 I/O standards across its configurable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces-for example, interfacing with DDR3 memory (SSTL-15) while simultaneously connecting to an LVDS sensor array.

What is the operating temperature range for XC6VLX240T-1FFG784C?

The XC6VLX240T-1FFG784C is specified for commercial temperature operation (0 °C to +85 °C ambient). Its thermal design uses the FFG784 package's thermal pad and copper heat slug to dissipate up to 12 W typical power under full utilization, making it suitable for convection-cooled telecom line cards and industrial controllers.

Is partial reconfiguration supported on XC6VLX240T-1FFG784C?

Yes, XC6VLX240T-1FFG784C supports partial reconfiguration through Xilinx ISE Design Suite tools. This allows dynamic loading of specific logic modules-such as filter coefficients or protocol engines-without resetting the entire device or interrupting ongoing data paths, enabling field-upgradable functionality in deployed systems.