AMD XC6VLX240T-1FFG784I

Overview

XC6VLX240T-1FFG784I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 240,960 logic cells, 15,360 DSP48E1 slices, and 12.8 Gb/s transceiver capability in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It targets high-speed serial interface implementation in radar signal processing, medical imaging backends, and 10G Ethernet line cards.

For engineers reviewing the XC6VLX240T-1FFG784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage support, embedded memory depth, and thermal performance under sustained 1.0 W/mm² power density.

Technical Context

The XC6VLX240T-1FFG784I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), and dedicated high-speed serial transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. Its clock management tile integrates DCMs and PLLs for multi-phase clock synthesis up to 550 MHz.

It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling across 24 I/O banks, with per-bank VCCO ranging from 1.2 V to 3.3 V. Configuration occurs via Master SPI, Slave Parallel, or JTAG interfaces with AES bitstream encryption support.

Key Specifications

Pinout & Package

XC6VLX240T-1FFG784I is housed in a 23 mm × 23 mm, 784-pin Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch and thermal lid. The package supports reflow soldering per IPC/JEDEC J-STD-020D and includes dedicated power/ground balls for noise suppression.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC6VLX240T-1FFG784I, the XC7VX485T offers 101% more logic and 2.3% higher transceiver speed but increases thermal envelope by 35%; the XCVU3P delivers 22% greater serial bandwidth and 40% lower static power but mandates new layout and toolchain migration.

Availability

XC6VLX240T-1FFG784I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and 10G Ethernet line cards requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX240T-1FFG784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets following its acquisition of Xilinx in 2022.

The Virtex-6 family was engineered for high-bandwidth, low-latency signal processing in defense, aerospace, and wired/wireless infrastructure where deterministic timing and multi-protocol serial connectivity are critical.

FAQ

What is the maximum supported transceiver data rate for XC6VLX240T-1FFG784I?

The XC6VLX240T-1FFG784I supports a maximum transceiver line rate of 12.8 Gb/s per channel. This enables compliance with 10GBASE-KR, CPRI Option 3, and SRIO Gen2 protocols. Operation at this rate requires proper PCB stackup design, controlled impedance routing, and use of the GTX transceiver's built-in equalization features. The XC6VLX240T-1FFG784I datasheet specifies AC timing parameters for 12.8 Gb/s under -1 speed grade at junction temperatures up to 85°C.

Does XC6VLX240T-1FFG784I support partial reconfiguration?

Yes, XC6VLX240T-1FFG784I fully supports partial reconfiguration through Xilinx ISE Design Suite 14.7 and Vivado HL WebPACK. This capability allows dynamic replacement of logic modules-such as filter banks or protocol engines-without resetting the entire device. The XC6VLX240T-1FFG784I implements frame-based reconfiguration with hardware-level CRC checking and secure bitstream authentication to ensure integrity during runtime updates.

What configuration modes are supported by XC6VLX240T-1FFG784I?

XC6VLX240T-1FFG784I supports Master SPI, Slave Parallel, and JTAG configuration modes. Master SPI uses an internal oscillator and external flash memory for autonomous boot; Slave Parallel enables fast loading from microprocessor buses; JTAG is used for debugging, programming, and boundary-scan testing. All modes support AES-256 encrypted bitstreams, and the XC6VLX240T-1FFG784I requires no external configuration controller in Master SPI mode.

What is the I/O voltage range supported per bank on XC6VLX240T-1FFG784I?

XC6VLX240T-1FFG784I supports independent VCCO settings per I/O bank from 1.2 V to 3.3 V, enabling simultaneous interfacing with DDR3 (1.5 V), LVDS (2.5 V), and legacy CMOS (3.3 V) devices. Each bank also supports multiple IOSTANDARDs-including SSTL15, HSTL_I, LVCMOS33, and DIFF_HSTL-I with programmable drive strength and slew rate control. The XC6VLX240T-1FFG784I datasheet defines minimum/maximum VCCO tolerances and thermal derating curves for each standard.

Is XC6VLX240T-1FFG784I qualified for extended temperature operation?

Yes, the XC6VLX240T-1FFG784I is rated for industrial temperature operation from –40°C to +100°C case temperature. This qualification includes thermal cycling, high-temperature operating life (HTOL), and unbiased highly accelerated stress test (uHAST) per Xilinx reliability standards. The "I" suffix explicitly denotes industrial-grade qualification, and the XC6VLX240T-1FFG784I meets JEDEC JESD22-A108F for extended temperature endurance.