AMD XC6VLX240T-2FF784I

Overview

XC6VLX240T-2FF784I from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA featuring 240,960 logic cells, 15,360 DSP48E1 slices, and 12.8 Gb/s transceiver capability. It integrates dual 36-Kb block RAMs per column, supports DDR3 memory interfaces up to 800 MHz, and is deployed in high-speed wired communications infrastructure and radar signal processing systems.

For engineers reviewing the XC6VLX240T-2FF784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage flexibility, embedded memory depth, and thermal performance under sustained 2.0 W/mm² power density.

Technical Context

The XC6VLX240T-2FF784I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and multi-gigabit transceivers (MGTs) compliant with PCIe Gen2, SATA, and SRIO standards. It supports SelectIO™ technology with programmable I/O standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gb/s.

Its clocking system includes eight mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs), enabling precise jitter filtering and frequency synthesis across multiple domains. The device operates across industrial temperature range (–40°C to +100°C) and requires external configuration via SPI or BPI flash.

Key Specifications

Pinout & Package

XC6VLX240T-2FF784I is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG784) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant construction. Thermal pad on underside enables direct PCB thermal coupling to internal ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX240T-2FF784I, the XC7VX485T offers greater logic capacity and I/O but requires board redesign due to FFG1157 package; the XCVU3P delivers superior serial bandwidth and AI compute density but increases thermal management complexity and power delivery requirements.

Availability

XC6VLX240T-2FF784I is available at Aetrix Electronics and suitable for wireless infrastructure, defense radar, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX240T-2FF784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets following its acquisition of Xilinx in 2022.

The Virtex-6 family was designed specifically for high-throughput, low-latency signal processing in wired communications, aerospace, and defense systems demanding deterministic timing and radiation-tolerant configuration.

FAQ

What is the maximum supported DDR3 memory interface speed for XC6VLX240T-2FF784I?

The XC6VLX240T-2FF784I supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock frequency) using its dedicated memory controller IP and calibrated I/O timing. This capability is validated in Xilinx UG388 and requires proper PCB layout with matched trace lengths and controlled impedance routing to maintain signal integrity.

Does XC6VLX240T-2FF784I include hard IP for PCI Express?

Yes, XC6VLX240T-2FF784I integrates a hard PCIe Gen2 endpoint block supporting x1, x2, x4, and x8 configurations with full TLP handling, DMA engine, and MSI/MSI-X interrupt support. This eliminates the need for soft-core implementations and reduces resource utilization by approximately 12,000 LUTs compared to equivalent soft IP solutions.

What configuration modes are supported by XC6VLX240T-2FF784I?

XC6VLX240T-2FF784I supports Master Serial, Slave Serial, Slave Parallel, Boundary Scan (JTAG), and System ACE configuration modes. Configuration bitstream can be loaded from SPI flash, BPI flash, or external processor via dedicated configuration interface pins, with fallback mechanisms enabled through INIT_B and DONE pin monitoring.

Is partial reconfiguration supported on XC6VLX240T-2FF784I?

Yes, XC6VLX240T-2FF784I fully supports partial reconfiguration as defined in Xilinx UG702. It allows runtime swapping of designated logic partitions without disrupting operation of the rest of the design, provided that reconfigurable modules adhere to frame-level boundary constraints and use approved routing resources.

What is the thermal resistance (θJA) of the XC6VLX240T-2FF784I package?

The XC6VLX240T-2FF784I in the FFG784 package has a typical junction-to-ambient thermal resistance (θJA) of 12.5°C/W under standard JEDEC 2s2p board conditions. Actual thermal performance depends on PCB copper area, airflow, and heatsink integration; thermal simulation using Xilinx XPE is recommended for system-level validation.