AMD XC6VLX240T-2FFG1156C

Overview

XC6VLX240T-2FFG1156C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA featuring 240,960 logic cells, 15,360 DSP48E1 slices, and 12.8 Gb/s transceiver capability. It integrates dual 36-Kb block RAM per column, supports DDR3 memory interfaces up to 800 MHz, and is deployed in high-speed wired communications infrastructure.

For engineers reviewing the XC6VLX240T-2FFG1156C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O bank voltage flexibility, block RAM depth, DSP slice count, and thermal performance under sustained 2.0 W dynamic power.

Technical Context

The XC6VLX240T-2FFG1156C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and multi-gigabit transceivers compliant with PCIe Gen2, SATA, and SRIO standards. It supports SelectIO technology with programmable I/O standards including LVDS, SSTL, and HSTL across 24 I/O banks.

Configuration is performed via Master SPI or JTAG, with support for partial reconfiguration and bitstream encryption using AES-256. The device operates at -2 speed grade, guaranteeing timing closure at 1.2 V core voltage and junction temperatures up to 85°C.

Key Specifications

Pinout & Package

XC6VLX240T-2FFG1156C is housed in a 1156-pin flip-chip fine-pitch BGA (FFG1156) package with 1.0 mm ball pitch, thermal lid, and controlled impedance routing support. Pin functions are organized into dedicated configuration, clock, I/O, power, and transceiver banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC6VLX240T-2FFG1156C, the XC7VX485T delivers 2× logic capacity and enhanced DSP throughput within the same architectural family, whereas the XCVU3P targets next-generation compute workloads with significantly higher transistor density and reduced power per operation.

Availability

XC6VLX240T-2FFG1156C is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX240T-2FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms spanning FPGAs, ACAPs, and software-defined hardware solutions.

The Virtex-6 family was designed for high-performance logic, signal processing, and serial connectivity in wired/wireless infrastructure and defense systems before the UltraScale transition.

FAQ

What is the maximum supported DDR3 memory interface speed for XC6VLX240T-2FFG1156C?

The XC6VLX240T-2FFG1156C supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock frequency) using its integrated memory controller and I/O timing calibration. This enables 6.4 GB/s peak bandwidth per 64-bit interface, validated across commercial temperature ranges with appropriate PCB layout and termination.

Does XC6VLX240T-2FFG1156C include hard IP for PCI Express?

Yes, XC6VLX240T-2FFG1156C integrates dedicated hard IP blocks supporting PCI Express Gen2 as an endpoint or root port with x1, x2, x4, or x8 lane configurations. These blocks handle link training, transaction layer, and data link layer functions without consuming programmable logic resources.

What configuration modes are supported by XC6VLX240T-2FFG1156C?

XC6VLX240T-2FFG1156C supports multiple configuration modes including Master SPI, Slave Serial, Slave Parallel, and JTAG. Mode selection is controlled by the M0–M2 pins at power-up, and configuration bitstreams can be loaded from external flash, host processor, or boundary-scan interface.

Is partial reconfiguration supported on XC6VLX240T-2FFG1156C?

Yes, XC6VLX240T-2FFG1156C supports partial reconfiguration through Xilinx ISE Design Suite tools. This allows dynamic replacement of specific logic modules while the rest of the design remains operational-enabling runtime adaptation in communication protocols and radar waveform updates.

What is the thermal design power (TDP) of XC6VLX240T-2FFG1156C under typical operating conditions?

XC6VLX240T-2FFG1156C has a typical dynamic power consumption of 2.0 W at 100% logic utilization and 100 MHz clock frequency under commercial temperature conditions. Thermal design must accommodate junction temperatures up to 85°C, with recommended heatsink and airflow per Xilinx UG373 guidelines.