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AMD XC6VLX240T-2FFG1156I

Part No.:
XC6VLX240T-2FFG1156I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC6VLX240T-2FFG1156I.pdf
Description:
IC FPGA 600 I/O 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,800

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Product details

Overview

XC6VLX240T-2FFG1156I from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 240,960 logic cells, 15,360 DSP48E1 slices, and 12.8 Gb/s transceiver capability. It features 1,156-pin Flip-Chip BGA (FFG1156) packaging, -2 speed grade, and industrial temperature range (-40°C to +100°C), deployed in high-speed serial interface bridging and radar signal processing systems.

For engineers reviewing the XC6VLX240T-2FFG1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, configuration mode options, and thermal performance under sustained DSP load.

Technical Context

The XC6VLX240T-2FFG1156I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), and dedicated high-speed serial transceivers compliant with PCIe Gen2, SATA, and SRIO standards. It supports multi-voltage I/O banks (1.2V–3.3V) and dual-register flip-flops per slice for timing-critical paths.

Configuration occurs via Master SelectMAP, Slave SelectMAP, or JTAG modes using external SPI flash or PROM. Built-in clock management tiles (CMT) integrate DCMs and PLLs for jitter-reduced clock synthesis across multiple domains up to 550 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells240,960 - determines maximum combinational/sequential logic capacity for complex state machines or protocol stacks
DSP Slices15,360 DSP48E1 - enables parallel multiply-accumulate operations at up to 400 MHz for real-time filtering or FFT
Transceiver Speed12.8 Gb/s - supports single-lane PCIe Gen2 x4 or dual-lane SRIO 2.1 links without retiming
I/O Pins600 user I/O - distributed across 24 selectable I/O banks with independent VCCO and VREF settings
Block RAM14,544 kbits - provides on-chip memory for FIFOs, coefficient tables, or frame buffers without external DRAM
Speed Grade-2 - guarantees timing closure at worst-case industrial temperature and voltage corners per Xilinx DS152
Operating Temp-40°C to +100°C - validated for deployment in enclosed industrial enclosures without forced airflow

Pinout & Package

XC6VLX240T-2FFG1156I uses a 1156-ball Flip-Chip BGA (FFG1156) package with 35×35 array, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power configurations.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputDrives internal configuration shift register during Master SelectMAP mode; requires clean 50 MHz source
DONEConfiguration Status OutputOpen-drain signal pulled high externally; asserts high when bitstream loading and CRC check complete
INIT_BConfiguration InitializationActive-low open-drain output indicating readiness to accept new configuration data
GTX_CLK0_M2C_P/NTransceiver Reference ClockDifferential pair feeding GTX transceiver tile; supports 100–625 MHz input for 1.25–12.8 Gb/s operation
VCCAUXAnalog Auxiliary Supply1.8V ±3% supply powering transceivers, CMT, and configuration logic; requires low-noise regulation

Key Features

FeatureDesign Value
Advanced DSP48E1 SliceIntegrated pre-adder, multiplier, and accumulator with 25×18-bit signed multiplication and pipeline control
Multi-standard TransceiversSupports PCIe Gen2, SATA II/III, SRIO 1.2/2.1, and 10 Gigabit Ethernet protocols via GTY-compatible PHY
Flexible Clock ManagementEach CMT contains two DCMs and one PLL for independent domain clock synthesis, phase shifting, and duty-cycle correction
Partial Reconfiguration SupportEnables dynamic module swapping without full device reset-verified in Xilinx UG394 v1.11
System MonitorOn-die analog-to-digital converter measuring die temperature and supply voltages (VCCINT, VCCAUX, VCCO)

Applications

Radar Signal ProcessingHigh-Speed Data Acquisition

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; transceivers interface with ADC/DAC over JESD204B.

Use Value: 15,360 DSP48E1 slices enable concurrent 1024-point FFTs at 200 MS/s sample rate with <100 ns latency.

Use Scenario: Multi-channel oscilloscope front-end capturing synchronized analog waveforms at 1 GS/s.

IC Role / Device Role / Timing Role: Configurable I/O banks condition LVDS inputs from 12-bit ADCs; BRAM buffers raw samples before PCIe Gen2 upload.

Use Value: 600 user I/O pins support 32-channel LVDS capture with per-bank 1.8V/2.5V VCCO matching ADC output standards.

PCIe Gen2 BridgeAvionics Data Concentrator

Use Scenario: Protocol translation between legacy parallel bus peripherals and modern PCIe-based host controllers.

IC Role / Device Role / Timing Role: Implements PCIe endpoint logic with DMA engine and custom AXI4-Stream interconnect; transceivers handle 5 GT/s encoding.

Use Value: Native PCIe Gen2 x4 endpoint capability eliminates need for external bridge IC, reducing BOM count and latency by 1.2 μs.

Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 message aggregation in flight control computers.

IC Role / Device Role / Timing Role: Dual-role controller managing deterministic time-triggered AFDX queues and legacy 1553 bus arbitration.

Use Value: -2 speed grade ensures guaranteed timing closure for 1553 bus cycle timing (1 µs response window) at +100°C ambient.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104I16 nm UltraScale+ architecture; 2,586K logic cells; 72 GTY transceivers (32.75 Gb/s); higher power densityTargets next-gen radar with 40 Gb/s serial interfaces and AI-accelerated preprocessingSelect when migrating to higher bandwidth or requiring hardened AI engines; requires PCB redesign due to FLGA2104 package
XC7VX690T-2FFG1927I28 nm 7-series; 693,120 logic cells; 36 GTX transceivers (13.1 Gb/s); lower static power than Virtex-6Suitable for cost-optimized radar subsystems where 12.8 Gb/s is sufficient and thermal budget is tighterChoose for drop-in replacement in existing Virtex-6 designs with compatible FFG1927 footprint; same I/O voltage and configuration modes

Compared with XC6VLX240T-2FFG1156I, the XC7VX690T offers higher logic density and lower static power at identical transceiver speed, while the XCVU9P delivers significantly higher serial bandwidth and AI acceleration but demands new thermal and layout design.

Availability

XC6VLX240T-2FFG1156I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX240T-2FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated workloads.

The Virtex-6 family was designed for high-bandwidth, compute-intensive applications in aerospace, defense, and wired communications where deterministic latency and multi-protocol serial connectivity are critical.

FAQ

What is the maximum supported transceiver line rate for XC6VLX240T-2FFG1156I?

The XC6VLX240T-2FFG1156I supports a maximum transceiver line rate of 12.8 Gb/s per channel using its GTX transceivers. This enables compliance with PCIe Gen2, SATA III, and SRIO 2.1 standards. The actual achievable rate depends on board layout quality, reference clock jitter (<1.5 ps RMS), and termination matching per Xilinx DS152 specification.

Does XC6VLX240T-2FFG1156I support partial reconfiguration?

Yes, XC6VLX240T-2FFG1156I supports partial reconfiguration as documented in Xilinx UG394 v1.11. This allows dynamic swapping of functional modules-such as different filter coefficients or protocol engines-without resetting the entire device. Implementation requires PlanAhead or Vivado 2015.4+ toolflow and specific HDL partitioning.

What configuration modes are supported by XC6VLX240T-2FFG1156I?

XC6VLX240T-2FFG1156I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Master SelectMAP uses internal oscillator to drive CCLK; Slave SelectMAP relies on external controller. Configuration bitstream can be stored in external SPI flash or PROM devices compatible with Xilinx XCFxx series.

What is the purpose of the VCCAUX supply on XC6VLX240T-2FFG1156I?

VCCAUX supplies 1.8V ±3% to the XC6VLX240T-2FFG1156I's transceivers, clock management tiles (CMT), and configuration logic. It must be independently regulated with low noise (<15 mVpp) and adequate decoupling (minimum 10×100 nF + 2×10 μF per bank). Failure to meet VCCAUX tolerance causes transceiver PLL unlock or configuration failure.

Is XC6VLX240T-2FFG1156I qualified for industrial temperature operation?

Yes, XC6VLX240T-2FFG1156I is rated for industrial temperature operation from -40°C to +100°C ambient, as specified in Xilinx DS152. Thermal validation includes junction temperature monitoring via on-die System Monitor and derating curves for VCCINT current versus ambient temperature. Operation above +100°C requires external cooling verification.

XC6VLX240T-2FFG1156I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 LXT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
18840
Number of Logic Elements/Cells:
241152
Total RAM Bits:
15335424
Number of I/O:
600
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)

XC6VLX240T-2FFG1156I FAQ

1.How can I place an order for XC6VLX240T-2FFG1156I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VLX240T-2FFG1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VLX240T-2FFG1156I reliable?

The price and inventory of XC6VLX240T-2FFG1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-2FFG1156I is usually 5 days.

3.What payment methods are accepted for XC6VLX240T-2FFG1156I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-2FFG1156I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VLX240T-2FFG1156I?

XC6VLX240T-2FFG1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VLX240T-2FFG1156I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VLX240T-2FFG1156I?

For technical support, including XC6VLX240T-2FFG1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-2FFG1156I requirements.

6.How does Aetrix verify that XC6VLX240T-2FFG1156I is sourced from the original manufacturer or authorized distributors?

All XC6VLX240T-2FFG1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-2FFG1156I meets industry standards.

7.What is the process for return or replacement of XC6VLX240T-2FFG1156I?

All XC6VLX240T-2FFG1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-2FFG1156I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VLX240T-2FFG1156I part is unused and in its original packaging.

Return procedure for XC6VLX240T-2FFG1156I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VLX240T-2FFG1156I Tags

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