AMD XC6VLX240T-2FFG1759C

Overview

XC6VLX240T-2FFG1759C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA featuring 240,000 logic cells, 15.36 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It operates at -2 speed grade with 1.2V core voltage and targets high-bandwidth digital signal processing in radar and medical imaging systems.

For engineers reviewing the XC6VLX240T-2FFG1759C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, embedded block RAM capacity, and thermal performance in compact PCB layouts.

Technical Context

The XC6VLX240T-2FFG1759C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 18-kbit block RAMs, and 25×18 multipliers. It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gbps per pin.

This device integrates six 6.6 Gb/s GTP transceivers and one 10.3125 Gb/s GTX transceiver bank, enabling serial protocols such as CPRI, SRIO, and 10GbE. Its configuration interface supports Master SelectMAP, Slave SelectMAP, and JTAG modes with AES bitstream encryption.

Key Specifications

Pinout & Package

XC6VLX240T-2FFG1759C is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-clock-rate operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX240T-2FFG1759C, the XC7VX485T offers PCIe compatibility at lower static power, while the XCVU9P delivers higher compute density but requires redesigning the PCIe interface layer.

Availability

XC6VLX240T-2FFG1759C is available at Aetrix Electronics and suitable for radar signal processing, medical ultrasound imaging, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX240T-2FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, and embedded applications following its acquisition of Xilinx in 2022.

The Virtex-6 family was designed for high-throughput, low-latency signal processing in defense, aerospace, and medical imaging systems where deterministic timing and mixed-signal integration are critical.

FAQ

What is the maximum supported transceiver data rate for XC6VLX240T-2FFG1759C?

The XC6VLX240T-2FFG1759C supports up to 10.3125 Gb/s using its GTX transceiver bank, validated for protocols including 10GbE and CPRI v6.0. This rate applies only to the dedicated GTX lanes-not the GTP transceivers, which are limited to 6.6 Gb/s. The -2 speed grade ensures timing compliance at this rate under specified thermal conditions.

Does XC6VLX240T-2FFG1759C include built-in PCIe Gen2 support?

Yes, XC6VLX240T-2FFG1759C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. It handles link training, transaction layer packet (TLP) generation, and error reporting without external logic, reducing system complexity and board area compared to soft-core PCIe implementations.

What package type and thermal characteristics apply to XC6VLX240T-2FFG1759C?

XC6VLX240T-2FFG1759C uses a 1759-ball FFG package with integrated thermal lid and 1.0 mm ball pitch. Its thermal resistance (θJA) is 3.5°C/W under JEDEC standard board conditions, supporting continuous operation up to 85°C junction temperature when paired with appropriate heatsinking per Xilinx UG372.

Can XC6VLX240T-2FFG1759C perform partial reconfiguration in the field?

Yes, XC6VLX240T-2FFG1759C supports partial reconfiguration via ICAP interface, allowing dynamic replacement of logic modules without resetting the entire device. This capability is used in applications like adaptive radar waveform switching and real-time protocol translation, and requires use of Xilinx Vivado Design Suite 2018.3 or later.

What I/O standards are supported by XC6VLX240T-2FFG1759C?

XC6VLX240T-2FFG1759C supports 21 I/O standards including LVDS, BLVDS, RSDS, Differential SSTL, HSTL, and single-ended LVTTL/LVCMOS across 15 I/O banks. Each bank operates independently at voltages from 1.2V to 3.3V, enabling mixed-voltage interface design without external level shifters.