AMD XC6VLX240T-2FFG1759I

Overview

XC6VLX240T-2FFG1759I from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 240,000 logic cells, 15.36 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It features 1,759-ball Flip-Chip Fine-Pitch BGA (FFG) packaging, -2 speed grade, and industrial temperature range (-40°C to +100°C), deployed in high-bandwidth protocol bridging and reconfigurable computing systems.

For engineers reviewing the XC6VLX240T-2FFG1759I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility (1.2V/1.5V/1.8V/2.5V/3.3V), block RAM depth, DSP48E1 slice count, and PCIe endpoint compliance for embedded acceleration designs.

Technical Context

The XC6VLX240T-2FFG1759I implements a hierarchical FPGA architecture with Configurable Logic Blocks (CLBs), 36-Kbit block RAMs, and 25×18-bit DSP48E1 slices optimized for arithmetic-intensive workloads. Its 24 GTX transceivers operate at 600 Mb/s to 6.6 Gb/s with built-in 8B/10B encoding and elastic buffers.

It supports SelectIO™ technology with programmable I/O standards across 16 banks, differential signaling (LVDS, BLVDS, RSDS), and on-die termination. The device integrates a hardened PCI Express® v2.0 endpoint block with AXI interface and supports partial reconfiguration via ICAP.

Key Specifications

Pinout & Package

XC6VLX240T-2FFG1759I uses a 1759-ball Flip-Chip Fine-Pitch BGA (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid. Ball map follows Xilinx Virtex-6 FFG1759 mechanical specification.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC6VLX240T-2FFG1759I, the XCVU3P-2FFVD1760I enables next-generation serial bandwidth and logic capacity but demands full design revalidation, while the XC7VX485T-2FFG1761I extends the Virtex-7 roadmap with improved transceiver performance and larger fabric-both require board redesign and are not drop-in replacements.

Availability

XC6VLX240T-2FFG1759I is available at Aetrix Electronics and suitable for high-reliability aerospace data concentrators, industrial protocol gateways, and reconfigurable compute accelerators requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX240T-2FFG1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Virtex-6 family was originally designed by Xilinx for high-performance logic, serial connectivity, and embedded processing in wired infrastructure, defense, and test equipment applications.

FAQ

What is the maximum supported transceiver data rate for XC6VLX240T-2FFG1759I?

The XC6VLX240T-2FFG1759I supports GTX transceivers rated up to 6.6 Gb/s per lane. This rate is validated across the full industrial temperature range and includes support for 8B/10B encoding, comma detection, and elastic buffer alignment. The XC6VLX240T-2FFG1759I achieves this performance using 40nm copper process technology and on-die calibration for PVT compensation.

Does XC6VLX240T-2FFG1759I include a hard PCIe controller?

Yes, the XC6VLX240T-2FFG1759I integrates a hardened PCIe Gen2 x8 endpoint block compliant with the PCI Express Base Specification v2.0. This dedicated silicon IP eliminates soft-core resource usage and guarantees deterministic latency. The XC6VLX240T-2FFG1759I exposes an AXI4-Lite interface for register access and supports MSI and INTx interrupt mechanisms.

What I/O standards are supported by XC6VLX240T-2FFG1759I?

The XC6VLX240T-2FFG1759I supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, BLVDS, RSDS, and Mini-LVDS across its 16 I/O banks. Each bank operates independently with selectable VCCO (1.2V–3.3V) and programmable VREF. The XC6VLX240T-2FFG1759I also supports on-die termination (ODT) and digitally controlled impedance (DCI) for signal integrity optimization.

Is partial reconfiguration supported on XC6VLX240T-2FFG1759I?

Yes, the XC6VLX240T-2FFG1759I supports dynamic partial reconfiguration via the Internal Configuration Access Port (ICAP). This allows runtime replacement of designated logic modules without resetting the entire device or halting active functions. The XC6VLX240T-2FFG1759I requires bitstream partitioning during implementation and uses frame-based addressing for secure, verified reconfiguration.

What is the operating temperature range for XC6VLX240T-2FFG1759I?

The XC6VLX240T-2FFG1759I is rated for industrial temperature operation from -40°C to +100°C case temperature. This rating applies to all functional blocks including GTX transceivers, block RAM, and PCIe endpoint logic. The XC6VLX240T-2FFG1759I undergoes burn-in and characterization across this range to ensure timing closure and signal integrity compliance under worst-case PVT conditions.