AMD XC6VLX240T-2FFG784C

Overview

XC6VLX240T-2FFG784C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 240,000 logic cells, 15.36 Gb/s transceiver line rate, and integrated PCIe Gen2 x8 endpoint capability. It operates at -2 speed grade, supports DDR3 memory interfaces up to 800 MHz, and targets high-bandwidth digital signal processing in radar and wired communications systems.

For engineers reviewing the XC6VLX240T-2FFG784C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (ANSI TIA/EIA-644-A), I/O bank voltage flexibility (1.2 V to 3.3 V), and deterministic timing closure for multi-gigabit serial protocols.

Technical Context

The XC6VLX240T-2FFG784C implements a column-based architecture with dedicated DSP48E1 slices (384 units), block RAM (3,328 kbits), and clock management tiles (CMT) containing DCMs and PLLs. It supports partial reconfiguration and built-in system monitoring via on-chip temperature and supply sensors.

Its FFG784 package provides 528 user I/Os across 24 selectable I/O banks, each configurable for LVDS, SSTL, HSTL, or TMDS signaling. The -2 speed grade guarantees setup/hold timing margins for 600 MHz system clocks and 1.25 Gb/s source-synchronous interfaces.

Key Specifications

Pinout & Package

XC6VLX240T-2FFG784C uses a 784-pin Fine-Pitch Flip-Chip BGA (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in sustained compute workloads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX240T-2FFG784C, the XC7VX485T offers greater logic capacity and PCIe Gen3 support at the cost of reduced SerDes bandwidth, while the XCVU3P delivers superior transceiver performance and power efficiency but requires migration to Vivado 2019.1+ and lacks integrated Gen2 endpoint logic.

Availability

XC6VLX240T-2FFG784C is available at Aetrix Electronics and suitable for radar signal processing, 10G network acceleration, and medical imaging data acquisition requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX240T-2FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions through its acquisition of Xilinx in 2022, focusing on high-performance programmable logic and heterogeneous system architectures.

The Virtex-6 family was designed for bandwidth-intensive infrastructure applications including wired/wireless communications, defense radar, and scientific instrumentation where deterministic timing and multi-protocol SerDes are critical.

FAQ

What is the maximum supported DDR3 memory interface speed for XC6VLX240T-2FFG784C?

The XC6VLX240T-2FFG784C supports DDR3 memory interfaces up to 800 MHz data rate (1600 MT/s) using its dedicated memory controller IP and I/O banks configured for SSTL15. This enables dual-rank, 72-bit-wide DDR3 subsystems with ECC, validated per Xilinx UG388 for reliable operation in telecom baseband units.

Does XC6VLX240T-2FFG784C include built-in PCIe Gen2 endpoint functionality?

Yes, XC6VLX240T-2FFG784C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.1. It handles link training, transaction layer packet routing, and MSI-X interrupt generation without soft logic overhead, reducing design effort for embedded host interface applications.

What thermal management guidance applies to XC6VLX240T-2FFG784C in continuous operation?

XC6VLX240T-2FFG784C requires a thermal solution maintaining junction temperature below 100°C under worst-case power conditions. Xilinx UG373 specifies a 1.5 W thermal resistance (θJA) target using a 4-layer PCB with internal ground/power planes and 2 oz copper, plus a 15 mm × 15 mm heatsink attached to the thermal lid.

Can XC6VLX240T-2FFG784C perform partial reconfiguration in-system?

Yes, XC6VLX240T-2FFG784C supports dynamic partial reconfiguration via ICAP interface, enabling runtime swapping of functional modules such as filter coefficients or protocol stacks. This capability is implemented using Xilinx PlanAhead 14.7 tools and requires dedicated configuration memory partitioning per UG702.

What I/O standards are supported by XC6VLX240T-2FFG784C's user banks?

XC6VLX240T-2FFG784C supports LVDS, BLVDS, RSDS, mini-LVDS, SSTL15/18, HSTL I/III, and TMDS across its 24 user-configurable I/O banks. Each bank operates independently at 1.2 V to 3.3 V, allowing mixed-voltage interfaces like DDR3 memory (SSTL15) alongside 10G Ethernet PHYs (LVDS).