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AMD XC6VLX240T-3FF1759C
- Part No.:
- XC6VLX240T-3FF1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-3FF1759C.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,157
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Product details
Overview
XC6VLX240T-3FF1759C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 240,000 logic cells, 15.4 Gb/s transceiver capability, and embedded Block RAM totaling 10,380 kbits. It implements complex digital signal processing and high-speed serial interface functions in radar baseband processing systems.
For engineers reviewing the XC6VLX240T-3FF1759C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), -3 speed grade timing performance, and FF1759 flip-chip BGA package compatibility with high-density PCB routing.
Technical Context
The XC6VLX240T-3FF1759C integrates 600 DSP48E1 slices for arithmetic-intensive tasks and supports PCIe Gen2 x8 endpoint functionality. Its transceivers operate at 600 Mb/s to 6.6 Gb/s with built-in 8B/10B encoding and elastic buffers.
This device uses 40 nm copper CMOS process technology and includes SelectIO™ technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. Configuration occurs via JTAG, Master SPI, or Slave SelectMAP interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| Block RAM | 10,380 kbits - provides on-chip memory for FIFOs, buffering, and data table storage |
| Transceiver Speed | 600 Mb/s to 6.6 Gb/s - enables SerDes links for SFP+, CPRI, and JESD204B interfaces |
| Speed Grade | -3 - guarantees worst-case timing performance at highest operating frequency for critical paths |
| I/O Standards | SSTL, HSTL, LVCMOS, LVDS, TMDS - supports direct interfacing with DDR3, video PHYs, and FPGAs |
| Configuration Mode | JTAG / Master SPI / Slave SelectMAP - allows flexible programming during development and in-system update |
Pinout & Package
XC6VLX240T-3FF1759C is housed in a 1759-pin flip-chip fine-pitch BGA (FF1759) package with 1.0 mm ball pitch, designed for thermal and signal integrity in high-speed digital systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, clock management, and transceivers |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface design |
| MR | Master reset input | Active-low asynchronous reset that clears configuration registers and state machines |
| INIT_B | Configuration status output | Open-drain indicator signaling successful bitstream loading or configuration error |
| CCLK | Configuration clock input | Drives internal configuration logic during Master SPI mode; max 50 MHz |
Key Features
| Feature | Design Value |
|---|---|
| DSP48E1 Slices | 600 dedicated arithmetic units supporting 25×18 multiply-accumulate with pipeline control |
| PCIe Gen2 Endpoint | Integrated hard IP supporting x1/x2/x4/x8 lane configurations without external bridge logic |
| SelectIO Technology | Programmable I/O standards per bank enable mixed-signal interface coexistence on single PCB |
| Transceiver Calibration | Automatic analog calibration of PLLs and receivers ensures stable operation across voltage/temperature |
Applications
| Radar Baseband Processing | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFT and CFAR algorithms; transceivers interface with ADC/DAC over JESD204B. Use Value: 240K logic cells and 600 DSP slices enable full pipeline implementation of multi-channel radar processing within one device. | Use Scenario: High-throughput CT/MRI sensor data aggregation and preprocessing before GPU-based reconstruction. IC Role / Device Role / Timing Role: Acts as a deterministic data concentrator and real-time filter between 32+ ADC channels and PCIe Gen2 host interface. Use Value: FF1759 package I/O density and -3 speed grade ensure sub-10 ns timing closure for 16-bit, 125 MSPS ADC capture across multiple banks. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 protocol bridging in flight control subsystems. IC Role / Device Role / Timing Role: Implements dual-redundant protocol engines with deterministic latency and CRC offload. Use Value: Embedded Block RAM and distributed RAM provide dedicated buffer space for time-triggered message queues meeting DO-254 Level A requirements. | Use Scenario: Bit-error-rate testing and pattern generation for 10G Ethernet and Fibre Channel physical layers. IC Role / Device Role / Timing Role: Generates and analyzes PRBS31 patterns at 10.3125 Gb/s using transceiver PMA/PMD blocks. Use Value: Built-in transceiver eye diagram monitoring and adaptive equalization reduce test setup complexity and calibration time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, higher logic density (2,586K LUTs), 25.8 Gb/s transceivers, 14 nm process | Supports next-generation 5G NR and AI inference acceleration; requires updated toolchain (Vivado 2019.1+) | Choose for new designs requiring >10 Gb/s serial bandwidth or >1M LUT capacity; not pin-compatible with XC6VLX240T-3FF1759C |
| XC7VX485T-2FFG1761I | Virtex-7 architecture, 485K logic cells, 13.1 Gb/s transceivers, 28 nm process, no GTX but GTH transceivers | Offers improved power efficiency and larger Block RAM (37,920 kbits); supports DDR4 controller hard IP | Prefer when migrating legacy Virtex-6 designs needing higher memory bandwidth and lower static power; package footprint differs (FFG1761 vs FF1759) |
Compared with XC6VLX240T-3FF1759C, the XCVU9P-2FLGA2104I delivers 10× more logic and 4× faster transceivers but demands newer silicon and tools, while the XC7VX485T-2FFG1761I extends Virtex-6 capabilities with DDR4 support and better power scaling-both require board redesign and firmware revalidation.
Availability
XC6VLX240T-3FF1759C is available at Aetrix Electronics and suitable for radar baseband processing, medical imaging data acquisition, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX240T-3FF1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-6 family was engineered for high-performance logic and serial connectivity in mission-critical infrastructure, targeting applications demanding deterministic latency, high I/O bandwidth, and long-term obsolescence resilience.
FAQ
What is the maximum supported transceiver data rate for XC6VLX240T-3FF1759C?
The XC6VLX240T-3FF1759C supports transceiver data rates from 600 Mb/s up to 6.6 Gb/s. This range covers protocols including CPRI, SATA, and JESD204B. The actual achievable rate depends on reference clock stability, PCB layout quality, and termination compliance. All transceiver lanes in the XC6VLX240T-3FF1759C are identical and fully configurable within this specification.
Does XC6VLX240T-3FF1759C support PCIe Gen2 x8 endpoint functionality?
Yes, XC6VLX240T-3FF1759C includes hardened PCIe Gen2 endpoint logic supporting x1, x2, x4, and x8 lane configurations. It complies with PCI Express Base Specification 2.0 and requires no external bridge chips. The XC6VLX240T-3FF1759C implements all required link training, power management, and transaction layer functions in dedicated hardware blocks.
What configuration modes are supported by XC6VLX240T-3FF1759C?
XC6VLX240T-3FF1759C supports three primary configuration modes: JTAG for debugging and programming, Master SPI for compact flash-based boot, and Slave SelectMAP for high-speed parallel loading from microcontrollers or processors. Each mode uses dedicated pins and has defined timing requirements documented in the Virtex-6 Configuration User Guide (UG364).
What is the I/O voltage range supported per bank on XC6VLX240T-3FF1759C?
XC6VLX240T-3FF1759C supports per-bank I/O voltages from 1.2 V to 3.3 V, allowing mixed-voltage operation across different interface standards. Each I/O bank must be powered by a single VCCO supply, and the selected standard (e.g., LVCMOS18, SSTL15) must match the applied voltage. This flexibility enables direct connection to DDR3, video PHYs, and legacy parallel buses without level shifters.
Is XC6VLX240T-3FF1759C qualified for extended temperature operation?
No, XC6VLX240T-3FF1759C is rated for commercial temperature range (0 °C to +85 °C). The "C" suffix explicitly denotes commercial grade. For extended temperature applications (-40 °C to +100 °C), the industrial-grade variant XC6VLX240T-3FF1759I must be used. Thermal derating and validation per JEDEC JESD22-A104 are required for non-standard operating conditions.
XC6VLX240T-3FF1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX240T-3FF1759C FAQ
1.How can I place an order for XC6VLX240T-3FF1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-3FF1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-3FF1759C reliable?
The price and inventory of XC6VLX240T-3FF1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-3FF1759C is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-3FF1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-3FF1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-3FF1759C?
XC6VLX240T-3FF1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-3FF1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-3FF1759C?
For technical support, including XC6VLX240T-3FF1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-3FF1759C requirements.
6.How does Aetrix verify that XC6VLX240T-3FF1759C is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-3FF1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-3FF1759C meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-3FF1759C?
All XC6VLX240T-3FF1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-3FF1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-3FF1759C part is unused and in its original packaging.
Return procedure for XC6VLX240T-3FF1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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