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AMD XC6VLX240T-3FFG1156C
- Part No.:
- XC6VLX240T-3FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-3FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,726
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Product details
Overview
XC6VLX240T-3FFG1156C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 240,000 logic cells, 15.36 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It operates at -3 speed grade, features 1156-pin Flip-Chip BGA (FFG) packaging, and targets high-bandwidth wired communications infrastructure.
For engineers reviewing the XC6VLX240T-3FFG1156C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and data rate, embedded block RAM capacity, DSP48E1 slice count, and I/O bank voltage flexibility for multi-protocol interface design.
Technical Context
The XC6VLX240T-3FFG1156C implements a hierarchical FPGA architecture with Configurable Logic Blocks (CLBs), 18x25 embedded multipliers, and 36 Kb block RAMs. It supports differential I/O standards including LVDS, SSTL, and HSTL across 24 I/O banks.
This device integrates six RocketIO GTP transceivers operating up to 3.75 Gb/s per lane and includes hard IP for PCI Express v2.0, tri-mode Ethernet MAC, and memory controllers for DDR3/DDR2/LPDDR.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,000 - determines maximum combinational and sequential logic capacity for complex digital systems |
| Transceiver Speed | 3.75 Gb/s - enables serial protocols including SATA, CPRI, and Serial RapidIO in baseband processing |
| Block RAM | 14,976 Kb - supports large on-chip buffering for packet processing, video frame storage, or FIFO implementation |
| DSP Slices | 768 - provides fixed-point arithmetic acceleration for filtering, FFT, and modulation/demodulation functions |
| I/O Pins | 600 - delivers flexible connectivity across multiple voltage domains and signaling standards |
| PCIe Interface | Gen2 x8 Endpoint - allows direct attachment to host systems without external bridge logic |
Pinout & Package
XC6VLX240T-3FFG1156C uses a 1156-ball flip-chip BGA package (FFG1156) with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK0 | Transceiver Reference Clock Input | Provides low-jitter clock source for GTP transceiver banks; requires external 100–300 MHz oscillator |
| MRCC0 | Multi-Region Clock Capable Input | Primary global clock input supporting phase-aligned distribution to multiple clock regions |
| VCCO_0 | I/O Bank Power Supply | Configurable 1.2–3.3 V supply for Bank 0 I/Os enabling mixed-voltage interface design |
| INIT_B | Configuration Initialization | Active-low signal indicating configuration memory readiness; drives external status LED during startup |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Reduces system-level component count by eliminating external PCIe switch or bridge IC |
| Hard Tri-Mode Ethernet MAC | Supports 10/100/1000 Mbps operation without consuming logic resources or requiring soft IP licensing |
| DDR3 Memory Controller | Enables direct connection to 800–1066 Mbps DDR3 SDRAM with built-in calibration and timing closure assistance |
| GTP Transceiver Banks | Each bank supports independent reference clocking and termination control for protocol-specific signal integrity tuning |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during runtime-critical for adaptive radio and real-time protocol switching |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital predistortion (DPD) and MIMO signal processing in LTE-Advanced and 5G NR remote radio units. IC Role / Device Role / Timing Role: Programmable baseband processor implementing custom PHY-layer algorithms with deterministic latency under 200 ns. Use Value: 768 DSP48E1 slices enable concurrent wideband filter banks and FFT engines while maintaining sub-microsecond interrupt response. | Use Scenario: Multi-channel digital pattern generation and acquisition in automated test equipment for ASIC validation. IC Role / Device Role / Timing Role: High-speed I/O controller synchronizing 600+ pins at 200+ MHz with precise skew control across voltage domains. Use Value: 600 user I/Os with programmable slew rate and drive strength allow simultaneous emulation of diverse DUT interface standards. |
| Avionics Data Concentrators | Medical Imaging Back-End Processors |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control data networks. IC Role / Device Role / Timing Role: Deterministic packet routing engine with hardware timestamping and traffic shaping for safety-critical deterministic latency. Use Value: Integrated PCIe Gen2 x8 endpoint enables direct connection to avionics host processors without external protocol translation layers. | Use Scenario: Real-time reconstruction pipeline for CT and MRI image data using iterative algorithms and back-projection kernels. IC Role / Device Role / Timing Role: Acceleration co-processor offloading compute-intensive floating-point operations from host CPU. Use Value: 14,976 Kb of block RAM supports dual-frame buffering for continuous acquisition and reconstruction without DMA stalls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX365T-3FFG1156C | 365K logic cells, same package and speed grade, higher DSP and BRAM resources | Better suited for larger algorithmic workloads requiring >200K LUTs or >1000 DSP slices | Select when design exceeds XC6VLX240T-3FFG1156C resource utilization by >15% in critical paths |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, 20nm process, 324K logic cells, 16.3 Gb/s transceivers | Requires updated toolchain (Vivado 2015.4+), different pinout, no native PCIe Gen2 hard IP | Choose for new designs targeting lower power per GOP and higher serial bandwidth, accepting migration effort |
Compared with XC6VLX240T-3FFG1156C, the XC6VLX365T-3FFG1156C offers headroom for logic expansion without PCB change, while the XCKU060-2FFVA1156I enables next-generation bandwidth and efficiency at the cost of full redesign and toolchain transition.
Availability
XC6VLX240T-3FFG1156C is available at Aetrix Electronics and suitable for wireless infrastructure, test instrumentation, and avionics systems requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX240T-3FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Virtex-6 family was engineered for high-throughput, low-latency signal processing in wired communications, military radar, and scientific instrumentation where deterministic timing and transceiver integration are critical.
FAQ
What is the maximum supported DDR3 data rate for XC6VLX240T-3FFG1156C?
The XC6VLX240T-3FFG1156C supports DDR3 interfaces up to 1066 Mbps (533 MHz clock). Its integrated memory controller includes calibration logic and timing closure tools optimized for 1.5 V DDR3 SDRAM operation across all 24 I/O banks, with verified performance on JEDEC-compliant modules meeting tRFC and tFAW specifications.
Does XC6VLX240T-3FFG1156C include hard IP for Ethernet?
Yes, XC6VLX240T-3FFG1156C integrates a tri-mode Ethernet MAC hard IP block supporting 10/100/1000 Mbps operation. This dedicated logic operates independently of fabric resources, provides IEEE 802.3-compliant framing, and supports GMII, RGMII, and SGMII physical layer interfaces without consuming LUTs or block RAM.
What transceiver protocols are natively supported by XC6VLX240T-3FFG1156C?
XC6VLX240T-3FFG1156C supports native transceiver protocols including PCIe Gen2, SATA I/II, CPRI, Serial RapidIO, and Aurora via its six RocketIO GTP transceivers. Each transceiver lane operates up to 3.75 Gb/s with programmable equalization and pre-emphasis, and protocol-specific encoding (8b/10b, 64b/66b) is implemented in hard logic.
Is partial reconfiguration supported on XC6VLX240T-3FFG1156C?
Yes, XC6VLX240T-3FFG1156C fully supports partial reconfiguration through Xilinx ISE Design Suite 14.7 and later. This capability allows dynamic swapping of logic modules during operation-enabling adaptive waveform changes in SDR radios or protocol updates in network switches without full device reset or downtime.
What is the thermal design power (TDP) range for XC6VLX240T-3FFG1156C under typical operation?
XC6VLX240T-3FFG1156C exhibits a typical thermal design power between 12.5 W and 24.8 W depending on configuration, clock frequency, and I/O activity. The FFG1156 package includes a thermal lid and is qualified for junction temperatures up to 100°C, with recommended heatsink solutions rated for ≥1.2°C/W in forced-air environments.
XC6VLX240T-3FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX240T-3FFG1156C FAQ
1.How can I place an order for XC6VLX240T-3FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-3FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-3FFG1156C reliable?
The price and inventory of XC6VLX240T-3FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-3FFG1156C is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-3FFG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-3FFG1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-3FFG1156C?
XC6VLX240T-3FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-3FFG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-3FFG1156C?
For technical support, including XC6VLX240T-3FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-3FFG1156C requirements.
6.How does Aetrix verify that XC6VLX240T-3FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-3FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-3FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-3FFG1156C?
All XC6VLX240T-3FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-3FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-3FFG1156C part is unused and in its original packaging.
Return procedure for XC6VLX240T-3FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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