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AMD XC6VLX240T-3FFG1759C
- Part No.:
- XC6VLX240T-3FFG1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-3FFG1759C.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,122
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Product details
Overview
XC6VLX240T-3FFG1759C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 240,000 logic cells, 15.36 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It operates at -3 speed grade, features 1759-pin Flip-Chip Fine-Pitch BGA (FFG) packaging, and targets high-bandwidth digital signal processing in radar and wired communications infrastructure.
For engineers reviewing the XC6VLX240T-3FFG1759C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O bank voltage flexibility, embedded Block RAM depth, DSP48E1 slice count, and thermal performance under sustained 2.5W/mm² power density.
Technical Context
The XC6VLX240T-3FFG1759C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 36-Kbit Block RAMs, and 25×18-bit DSP48E1 slices optimized for pipelined arithmetic. Its 24 GTX transceivers support protocols including CPRI, SRIO, and 10GBASE-R with programmable equalization and clock correction.
I/O banks are organized into 12 groups supporting LVDS, SSTL, HSTL, and differential signaling standards at voltages from 1.2V to 3.3V. Configuration occurs via Master SelectMAP or JTAG, with dual-boot capability enabled through external SPI flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,000 - determines maximum combinational/sequential logic capacity for complex state machines or protocol stacks |
| Transceivers | 24 GTX @ 2.48–6.6 Gb/s - enables multi-lane serial interfaces like CPRI v6 or 10GbE MAC without external retimers |
| Block RAM | 14,040 Kbits - supports dual-port buffering for video frame stores or packet reassembly buffers |
| DSP Slices | 768 DSP48E1 - delivers 1.2 billion MAC operations/sec for real-time FIR filtering or beamforming |
| I/O Pins | 720 user-configurable - accommodates wide parallel buses or high-density SerDes breakout routing |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for critical paths in 100 MHz+ control planes |
Pinout & Package
XC6VLX240T-3FFG1759C uses a 1759-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, 35 mm × 35 mm body size, and thermal lid for enhanced heat dissipation in air-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration shift register during Master SelectMAP mode; requires clean 50 MHz source |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading; must be pulled up externally |
| INIT_B | Configuration Initialization | Active-low signal asserting reset during configuration error or power-on sequence |
| GTX_CLK0_M2C | Transceiver Reference Clock | Primary input for GTX quad clocking; supports 100–625 MHz range with < ±50 ppm stability |
| VCCINT | Core Power Supply | 1.0V ±3% supply for CLB and interconnect; requires low-noise regulation and local decoupling |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP block eliminates need for external PHY and reduces latency by 12 ns vs soft-core implementations |
| Partial Reconfiguration Support | Enables dynamic function swapping in field-deployed systems without full reconfiguration downtime |
| AXI Interconnect Fabric | Provides scalable, non-blocking connectivity between multiple masters/slaves with QoS arbitration |
| Multi-Boot Capability | Allows fallback to secondary bitstream stored in SPI flash upon CRC failure or watchdog timeout |
Applications
| Radar Signal Processing | Wireline Communications |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems with 16-channel ADC inputs. IC Role / Device Role / Timing Role: FPGA fabric implements time-domain beamforming, CFAR detection, and STAP algorithms with deterministic sub-100 ns latency. Use Value: 768 DSP48E1 slices enable simultaneous 128-tap FIR filters per channel while maintaining 200 MHz system clock timing. | Use Scenario: Line card controller in 10G/40G OTN transport equipment handling OTU2/OTU3 framing and FEC. IC Role / Device Role / Timing Role: Configurable SerDes and hardened PCS/PMA layers perform OTN mapping, scrambling, and forward error correction. Use Value: 24 GTX transceivers support eight independent 10.709 Gb/s lanes, eliminating external retimer ICs and reducing board area by 32 mm². |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: High-speed data acquisition and image reconstruction pipeline in MRI systems with 64-channel RF receive chains. IC Role / Device Role / Timing Role: Synchronizes ADC sampling clocks, performs real-time gridding and FFT acceleration, and manages DDR3 memory bandwidth. Use Value: 14,040 Kbits of Block RAM provides dual-port access for overlapping acquisition and reconstruction cycles at 120 fps. | Use Scenario: Modular digitizer module in automated test equipment requiring 1 GS/s sampling across 8 channels with timestamp correlation. IC Role / Device Role / Timing Role: Coordinates multi-board trigger distribution, implements TDC logic, and handles PCIe Gen2 x8 host interface. Use Value: Integrated PCIe endpoint reduces host driver complexity and achieves sustained 3.2 GB/s throughput with < 5 µs interrupt latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | 16nm UltraScale+ architecture; 2.5× higher logic density but no native PCIe Gen2 endpoint | Requires external PCIe controller IP or soft core; better suited for AI inference acceleration than legacy protocol bridging | Select when migrating to newer process node and requiring >500K LUTs with DDR4/PCIe Gen3 support |
| XC7VX485T-2FFG1761I | 28nm 7-series; lower transceiver count (16 GTX), same -2 speed grade, identical FFG1761 footprint | Limited to 4-lane PCIe Gen2; suitable for cost-sensitive upgrades where existing PCB layout must be preserved | Choose for drop-in replacement on compatible boards needing reduced power and simplified thermal design |
Compared with XC6VLX240T-3FFG1759C, the XC7VX485T-2FFG1761I offers layout compatibility and lower static power but sacrifices transceiver bandwidth, while the XCVU9P-2FLGA2104I delivers superior compute density and DDR4 support at the cost of increased design complexity and absence of hardened PCIe Gen2.
Availability
XC6VLX240T-3FFG1759C is available at Aetrix Electronics and suitable for radar signal processing, wireline communications infrastructure, and medical imaging backend systems requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX240T-3FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms for data center, AI, and high-performance embedded markets.
The Virtex-6 family was designed for high-throughput, low-latency signal processing in infrastructure equipment where deterministic timing and multi-protocol SerDes integration are critical.
FAQ
What is the maximum supported transceiver data rate for XC6VLX240T-3FFG1759C?
The XC6VLX240T-3FFG1759C supports GTX transceivers rated up to 6.6 Gb/s per lane. This enables compliance with CPRI v6, 10GBASE-R, and SRIO Gen2 protocols. Operation at 6.6 Gb/s requires proper reference clock jitter filtering and PCB impedance control within ±10% tolerance on differential pairs.
Does XC6VLX240T-3FFG1759C include a hardened PCIe Gen2 endpoint?
Yes, XC6VLX240T-3FFG1759C integrates a fully compliant PCIe Gen2 x8 endpoint hard IP block. It supports link training, power management states (L0/L1/L2), and transaction layer packet handling without external PHY. The block is accessible via AXI-Stream and AXI4-Lite interfaces for seamless integration with user logic.
What configuration modes does XC6VLX240T-3FFG1759C support?
XC6VLX240T-3FFG1759C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Dual-boot capability is enabled using two separate bitstreams stored in external SPI flash, allowing fail-safe recovery after configuration errors or firmware updates.
What is the I/O voltage range supported by XC6VLX240T-3FFG1759C?
XC6VLX240T-3FFG1759C supports I/O bank voltages from 1.2V to 3.3V, enabling direct interfacing with DDR2/DDR3 memory, LVDS sensors, and legacy CMOS peripherals. Each of the 12 I/O banks can be independently powered, allowing mixed-voltage operation on a single device without level shifters.
Is partial reconfiguration supported on XC6VLX240T-3FFG1759C?
Yes, XC6VLX240T-3FFG1759C supports partial reconfiguration through Xilinx ISE Design Suite tools. This allows dynamic swapping of functional modules-such as filter coefficients or protocol engines-without resetting the entire device or disrupting active I/O operations, critical for mission-critical field-upgradable systems.
XC6VLX240T-3FFG1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX240T-3FFG1759C FAQ
1.How can I place an order for XC6VLX240T-3FFG1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-3FFG1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-3FFG1759C reliable?
The price and inventory of XC6VLX240T-3FFG1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-3FFG1759C is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-3FFG1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-3FFG1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-3FFG1759C?
XC6VLX240T-3FFG1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-3FFG1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-3FFG1759C?
For technical support, including XC6VLX240T-3FFG1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-3FFG1759C requirements.
6.How does Aetrix verify that XC6VLX240T-3FFG1759C is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-3FFG1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-3FFG1759C meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-3FFG1759C?
All XC6VLX240T-3FFG1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-3FFG1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-3FFG1759C part is unused and in its original packaging.
Return procedure for XC6VLX240T-3FFG1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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