AMD XC6VLX240T-3FFG784C

Overview

XC6VLX240T-3FFG784C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 240,000 logic cells, 15.36 Gb/s transceiver line rate, and integrated PCIe® Gen2 x8 endpoint capability. It operates at -3 speed grade (fastest), supports DDR3 memory interfaces up to 800 MHz, and is used in high-bandwidth wired communications infrastructure.

For engineers reviewing the XC6VLX240T-3FFG784C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (XAUI/SGMII), I/O bank voltage flexibility (1.2V–3.3V), deterministic timing closure for multi-gigabit serial links, and support for partial reconfiguration in field-deployed systems.

Technical Context

The XC6VLX240T-3FFG784C implements a hierarchical FPGA architecture with Configurable Logic Blocks (CLBs), 18×25 DSP48E1 slices, and 32 block RAMs (each 36 Kb). It integrates 24 RocketIO™ GTP transceivers supporting 600 Mb/s to 3.75 Gb/s per lane, with built-in PRBS generators and eye diagram monitors.

It features dual-register 6-input LUTs, dedicated carry chains, and clock management tiles with MMCM and PLL blocks enabling sub-150 ps jitter performance. The device uses SelectIO™ technology with programmable slew rate, drive strength, and on-die termination across 16 I/O banks.

Key Specifications

Pinout & Package

XC6VLX240T-3FFG784C is housed in a 784-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35x35 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant construction. Thermal design requires 1.5 W/mm² max power density under full utilization.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX240T-3FFG784C, the XCVU9P offers superior bandwidth and power efficiency but requires new PCB layout and toolchain migration, while the XC7VX485T provides pin-compatible upgrade path within same footprint family yet lacks integrated PCIe endpoint and transceiver count.

Availability

XC6VLX240T-3FFG784C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, medical imaging, and test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX240T-3FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets following its acquisition of Xilinx in 2022.

The Virtex-6 family was designed for high-bandwidth, low-latency system integration in wired communications, aerospace, and high-performance computing where deterministic timing and multi-standard serial connectivity are critical.

FAQ

What is the maximum supported DDR3 memory interface speed for XC6VLX240T-3FFG784C?

The XC6VLX240T-3FFG784C supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock), corresponding to 6.4 Gb/s peak bandwidth per 64-bit interface. This is achieved using dedicated memory controller logic and phase-aligned clocking with the MMCM. The XC6VLX240T-3FFG784C requires proper board-level impedance control and fly-by topology for reliable operation at this rate.

Does XC6VLX240T-3FFG784C include built-in PCIe Gen2 endpoint functionality?

Yes, the XC6VLX240T-3FFG784C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. It handles link training, transaction layer packet (TLP) generation, and configuration space access without external glue logic. The XC6VLX240T-3FFG784C supports both root port and endpoint roles depending on configuration mode.

What transceiver protocols are natively supported by XC6VLX240T-3FFG784C?

The XC6VLX240T-3FFG784C GTP transceivers natively support SGMII, XAUI, CPRI, and Serial RapidIO® physical layers without protocol translation logic. Each transceiver lane operates from 600 Mb/s to 3.75 Gb/s with built-in 8B/10B encoding/decoding and elastic buffer. The XC6VLX240T-3FFG784C does not support PCIe Gen2 at the transceiver level-PCIe is implemented via the dedicated hard IP block.

Can XC6VLX240T-3FFG784C perform partial reconfiguration in the field?

Yes, the XC6VLX240T-3FFG784C supports dynamic partial reconfiguration (PR) using Xilinx ISE Design Suite tools. This allows runtime swapping of functional modules-such as changing filter coefficients or protocol stacks-without resetting the entire device. The XC6VLX240T-3FFG784C requires dedicated configuration memory and careful floorplanning to isolate reconfigurable regions from static logic.

What is the thermal design power (TDP) range for XC6VLX240T-3FFG784C under typical usage?

The XC6VLX240T-3FFG784C has a typical thermal design power between 8.5 W and 14.2 W depending on resource utilization, I/O activity, and transceiver count in use. At full transceiver load (24 lanes active at 3.75 Gb/s), power consumption reaches ~13.8 W. The XC6VLX240T-3FFG784C requires a 4-layer PCB with internal ground/power planes and ≥2.5 cm² copper area under the package for passive thermal dissipation.