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AMD XC6VLX240T-L1FF1156I
- Part No.:
- XC6VLX240T-L1FF1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-L1FF1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,059
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Product details
Overview
XC6VLX240T-L1FF1156I from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 240,000 logic cells, 15.36 Gb/s transceiver capability, and integrated PCIe® Gen2 x8 endpoint support. It operates at -1 speed grade, supports LVDS and SSTL I/O standards, and is used in high-bandwidth wired communications infrastructure.
For engineers reviewing the XC6VLX240T-L1FF1156I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage flexibility, embedded Block RAM depth, and PCIe endpoint compliance for protocol-aware system integration.
Technical Context
The XC6VLX240T-L1FF1156I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 18-kb Block RAMs, and 25×18 DSP48E1 slices. Its transceivers support protocols including SATA, SRIO, and CPRI at data rates up to 6.6 Gb/s per lane.
It integrates dual 36-bit wide memory controllers supporting DDR3-800 and LPDDR2-400, and includes dedicated clock management tiles with MMCM and PLL circuits for low-jitter clock synthesis and phase alignment across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,000 - determines maximum combinational/sequential logic capacity for complex state machines and datapaths |
| Transceiver Lanes | 16 - enables multi-protocol serial connectivity (PCIe/SRIO/SATA) with independent rate and encoding control per lane |
| Block RAM | 15,840 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory latency |
| I/O Pins | 600 - supports high-pin-count interface consolidation including DDR3 memory buses and parallel video interfaces |
| Speed Grade | -1 - guarantees timing closure at specified operating conditions including 85°C junction temperature and 1.0V core supply |
| PCIe Support | Gen2 x8 Endpoint - enables direct host attachment without bridge logic in base station control plane or test equipment applications |
Pinout & Package
XC6VLX240T-L1FF1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1156) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Supply | 1.0V regulated input powering CLBs, interconnect, and configuration logic; requires low-noise decoupling |
| VCCAUX | Auxiliary Supply | 2.5V supply for configuration circuitry, JTAG, and transceiver reference clocks |
| VCCO_0 | I/O Bank Supply | Programmable 1.2–3.3V output bank voltage enabling mixed-voltage interface coexistence |
| MRCC/MRCC_N | Multi-Gigabit Ref Clock | Differential pair for transceiver reference clock input; supports 100–625 MHz frequencies |
| CLK_IN1_P/N | Global Clock Input | Dedicated differential input feeding MMCM/PLL for system-wide clock domain generation |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Reduces BOM cost and board area by eliminating external PCIe switch or bridge IC in baseband unit designs |
| Configurable I/O Standards | Supports simultaneous LVDS, SSTL, HSTL, and TMDS signaling within single device-enabling direct connection to FPGAs, ADCs, and display interfaces |
| MMCM + PLL Clock Management | Enables sub-100 fs jitter synthesis and dynamic phase shifting for multi-lane SerDes alignment and DDR3 timing margining |
| Partial Reconfiguration Support | Allows runtime logic module swapping without full device reset-critical for adaptive radio and real-time protocol stack updates |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital pre-distortion (DPD) and MIMO signal processing in LTE-Advanced macro base stations. IC Role / Device Role / Timing Role: Primary programmable fabric handling RF front-end control, channel estimation, and OFDM symbol generation with deterministic latency. Use Value: 16 transceiver lanes and 240K logic cells enable concurrent multi-carrier DPD across 4×4 MIMO paths without external co-processors. | Use Scenario: Protocol-aware bit-error-rate testing of 10G Ethernet and Fibre Channel links. IC Role / Device Role / Timing Role: Programmable pattern generator and error detector with precise clock recovery and jitter injection capability. Use Value: Integrated MMCM and transceiver calibration registers allow sub-picosecond timing control required for stressed-eye compliance testing. |
| Medical Imaging Data Acquisition | Avionics Data Concentrators |
Use Scenario: High-fidelity ultrasound beamforming with 128-channel echo digitization and real-time filtering. IC Role / Device Role / Timing Role: Time-critical signal processor interfacing directly to ADCs and managing DMA transfers to DDR3 memory subsystem. Use Value: 600 I/O pins and dual DDR3 memory controllers support parallel 128-channel LVDS ADC capture at 80 MSPS with zero-copy buffering. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Deterministic network interface controller implementing time-triggered scheduling and end-system redundancy management. Use Value: PCIe Gen2 endpoint and partial reconfiguration allow hot-swappable AFDX line replaceable units (LRUs) with firmware-updatable protocol stacks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | 16 nm process, 2.5× higher logic density, no native PCIe Gen2 endpoint (requires soft IP) | Targeted at AI inference acceleration and 5G massive MIMO where PCIe is routed via external switch | Choose when migrating to newer process node and requiring >500K logic cells with higher DSP throughput |
| XC7K410T-2FF901I | 28 nm process, 410K logic cells, PCIe Gen3 x8 endpoint, lower transceiver count (8 lanes) | Suitable for mid-range test equipment and radar signal processors needing Gen3 bandwidth but fewer SerDes lanes | Choose when PCIe Gen3 host interface is mandatory and transceiver count can be reduced by 50% |
Compared with XC6VLX240T-L1FF1156I, the XCVU9P offers greater scalability for future-proofing but requires redesign for PCIe integration, while the XC7K410T delivers Gen3 performance at lower transceiver density-making it optimal for cost-sensitive Gen3 endpoint applications where SerDes lane count is secondary.
Availability
XC6VLX240T-L1FF1156I is available at Aetrix Electronics and suitable for wireless infrastructure, high-speed test instrumentation, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX240T-L1FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Virtex-6 family was designed for high-bandwidth, low-latency programmable logic in wired communications, military/aerospace, and scientific instrumentation applications.
FAQ
What is the maximum supported I/O standard voltage for XC6VLX240T-L1FF1156I?
The XC6VLX240T-L1FF1156I supports I/O bank voltages from 1.2 V to 3.3 V, configurable per bank. This allows mixed-voltage interface operation-for example, interfacing 1.8 V DDR3 memory and 3.3 V legacy peripherals simultaneously. The actual voltage setting is determined by the VCCO supply applied to each I/O bank and must match the selected IOSTANDARD attribute in the design constraints file.
Does XC6VLX240T-L1FF1156I include hard IP for PCI Express?
Yes, XC6VLX240T-L1FF1156I integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI-SIG specifications. It handles link training, transaction layer packet (TLP) routing, and configuration space access without consuming logic resources. This hard IP is validated for use in base station control planes and test equipment where deterministic latency and protocol compliance are critical.
What is the operating temperature range for XC6VLX240T-L1FF1156I?
XC6VLX240T-L1FF1156I is rated for industrial temperature operation from –40°C to +100°C junction temperature. The "I" suffix explicitly denotes this extended range, making it suitable for deployment in outdoor wireless base stations and avionics environments where ambient thermal conditions exceed commercial-grade limits.
Can XC6VLX240T-L1FF1156I support DDR3 memory interfaces?
Yes, XC6VLX240T-L1FF1156I includes two integrated DDR3 memory controllers supporting data rates up to 800 Mbps (DDR3-800). Each controller manages up to 16-bit wide interfaces with full read/write leveling, write-leveling, and gate training-enabling reliable high-speed memory subsystems in medical imaging and radar processing applications.
Is partial reconfiguration supported on XC6VLX240T-L1FF1156I?
Yes, XC6VLX240T-L1FF1156I supports hardware-accelerated partial reconfiguration through its ICAP (Internal Configuration Access Port) and frame-based bitstream loading. This enables dynamic logic module updates during operation-used in adaptive radio systems to swap DPD coefficients or protocol stacks without resetting the entire XC6VLX240T-L1FF1156I device.
XC6VLX240T-L1FF1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.91V ~ 0.97V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX240T-L1FF1156I FAQ
1.How can I place an order for XC6VLX240T-L1FF1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-L1FF1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-L1FF1156I reliable?
The price and inventory of XC6VLX240T-L1FF1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-L1FF1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-L1FF1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-L1FF1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-L1FF1156I?
XC6VLX240T-L1FF1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-L1FF1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-L1FF1156I?
For technical support, including XC6VLX240T-L1FF1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-L1FF1156I requirements.
6.How does Aetrix verify that XC6VLX240T-L1FF1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-L1FF1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-L1FF1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-L1FF1156I?
All XC6VLX240T-L1FF1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-L1FF1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-L1FF1156I part is unused and in its original packaging.
Return procedure for XC6VLX240T-L1FF1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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