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AMD XC6VLX240T-L1FFG1156I
- Part No.:
- XC6VLX240T-L1FFG1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-L1FFG1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,196
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Product details
Overview
XC6VLX240T-L1FFG1156I from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA featuring 240,000 logic cells, 15.9 Mb of block RAM, and 784 DSP48E1 slices. It supports PCIe Gen2 x8, DDR3-1333 memory interfaces, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). Used in high-bandwidth digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC6VLX240T-L1FFG1156I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600), transceiver line rate (6.6 Gb/s), static power consumption (≈3.2 W typical), and support for JTAG and SelectMAP configuration modes.
Technical Context
The XC6VLX240T-L1FFG1156I implements a hierarchical FPGA architecture with CLBs, distributed RAM, shift registers, and dedicated carry logic. It integrates 32 GTX transceivers capable of 6.6 Gb/s line rates and supports multi-gigabit serial protocols including SATA, SRIO, and CPRI.
Configuration is supported via Master SelectMAP, Slave SelectMAP, or JTAG, with bitstream encryption and HMAC authentication available. The device uses 1.2 V core voltage, 2.5 V/3.3 V I/O banks with programmable drive strength and slew rate control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,000 - determines maximum combinational and sequential logic capacity for complex RTL implementations |
| Block RAM | 15.9 Mb - enables large on-chip data buffering and FIFOs without external memory |
| DSP Slices | 784 × DSP48E1 - supports parallel multiply-accumulate operations for filtering and FFTs |
| GTX Transceivers | 32 × 6.6 Gb/s - provides native SerDes for high-speed serial interconnects |
| I/O Pins | 600 user I/O - supports wide parallel buses and multi-bank voltage interfacing |
| Speed Grade | -1 - guarantees timing closure at specified frequencies under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and aerospace environments |
Pinout & Package
XC6VLX240T-L1FFG1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1156) package with 35×35 mm body size, 1.0 mm ball pitch, and standard I/O pad arrangement per Xilinx UG373 v1.12.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (JTAG, SelectMAP, or SPI) during power-up |
| CCLK | Configuration Clock | Drives clock input for Master SelectMAP configuration; bidirectional in Slave mode |
| DIN/DOUT | Data In/Out | Serial data path for configuration bitstream loading or readback |
| INIT_B | Initialization Status | Open-drain output indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and restarts boot sequence |
| GTxP/N | Transceiver Differential Pair | High-speed differential I/O supporting 6.6 Gb/s serial protocols |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 40nm HPL Process | Enables higher logic density and lower dynamic power vs. previous 65nm Virtex-5 generation |
| Integrated PCIe Endpoint Block | Hard IP supporting Gen2 x8 root port or endpoint without soft-core overhead |
| DDR3 Memory Controller | Hard macro supporting 1333 Mbps data rate with calibration and training logic |
| Bitstream Encryption | AES-256 encryption with HMAC authentication prevents unauthorized configuration and cloning |
| Partial Reconfiguration Support | Allows dynamic module swapping in operational system without full reconfiguration |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; GTX transceivers interface with ADC/DAC modules and backhaul links. Use Value: 784 DSP48E1 slices enable concurrent 1024-point FFTs; 6.6 Gb/s transceivers sustain raw sensor data ingestion at >4 Gbps. | Use Scenario: High-throughput image reconstruction in MRI and CT scanners using iterative algorithms. IC Role / Device Role / Timing Role: Configurable logic accelerates back-projection and denoising; DDR3 controller manages gigabyte-scale frame buffers. Use Value: 15.9 Mb block RAM reduces off-chip memory access latency; -1 speed grade ensures deterministic timing for safety-critical pipelines. |
| Avionics Data Concentrators | 5G Baseband Prototyping |
Use Scenario: ARINC 429/664 and MIL-STD-1553 bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Implements protocol engines and time-triggered scheduling logic; I/O banks interface with multiple voltage domains. Use Value: 600 user I/O pins support simultaneous multi-protocol physical layer interfaces; industrial temp rating meets DO-254 qualification requirements. | Use Scenario: Layer-1 PHY algorithm development and channel emulation for massive MIMO base stations. IC Role / Device Role / Timing Role: Hosts real-time OFDM modulation/demodulation and precoding; GTX transceivers connect to RF front-end FMC modules. Use Value: 32 GTX transceivers allow 8×8 MIMO channel simulation; partial reconfiguration enables rapid waveform iteration without system reset. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | 16 nm UltraScale+ architecture; 591K logic cells; higher transceiver count (48× 12.5 Gb/s) | Better suited for 5G NR and AI inference acceleration requiring >10 Gb/s serial bandwidth | Choose XCVU3P-2FFVD1760I when migrating to newer process node with higher bandwidth and lower power per function |
| XC7VX485T-2FFG1761I | 28 nm 7-series; 485K logic cells; 36 GTX transceivers (6.6 Gb/s); larger package (1761-ball) | Offers more logic resources and I/O but lacks PCIe Gen2 hard IP and has higher static power | Choose XC7VX485T-2FFG1761I when legacy design compatibility and maximum logic density outweigh transceiver performance needs |
Compared with XC6VLX240T-L1FFG1156I, the XCVU3P-2FFVD1760I delivers higher throughput and lower power at 16 nm, while the XC7VX485T-2FFG1761I extends logic capacity within the same 40nm-era I/O and timing ecosystem-both require PCB redesign due to different packages and pinouts.
Availability
XC6VLX240T-L1FFG1156I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC6VLX240T-L1FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-6 family was designed for high-performance, high-bandwidth applications including wired communications, defense systems, and scientific computing where deterministic timing and multi-protocol flexibility are critical.
FAQ
What is the maximum supported DDR3 data rate for XC6VLX240T-L1FFG1156I?
The XC6VLX240T-L1FFG1156I integrates a hard memory controller supporting DDR3-1333 (667 MHz clock, 1333 Mbps data rate) with built-in calibration and training logic. This capability is documented in Xilinx UG388 v1.11 and verified across industrial temperature operation. XC6VLX240T-L1FFG1156I does not support DDR4 or LPDDR3 interfaces.
Does XC6VLX240T-L1FFG1156I include hard PCIe Gen2 endpoints?
Yes, XC6VLX240T-L1FFG1156I contains dedicated hard IP blocks for PCIe Gen2 x1, x2, x4, and x8 endpoints and root complexes. These blocks comply with PCI Express Base Specification v2.0 and eliminate the need for soft-core implementations. XC6VLX240T-L1FFG1156I requires no external PHY and supports both link training and power management states.
What configuration modes are supported by XC6VLX240T-L1FFG1156I?
XC6VLX240T-L1FFG1156I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Mode selection is controlled by M0–M2 pins at power-up. All modes support bitstream encryption and HMAC authentication. XC6VLX240T-L1FFG1156I does not support passive parallel or BPI configuration.
Is XC6VLX240T-L1FFG1156I qualified for automotive applications?
No, XC6VLX240T-L1FFG1156I is rated for industrial temperature (-40°C to +100°C) but is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation. XC6VLX240T-L1FFG1156I is intended for industrial, aerospace, and communications equipment-not automotive ECUs or ADAS control units.
Can XC6VLX240T-L1FFG1156I perform partial reconfiguration?
Yes, XC6VLX240T-L1FFG1156I supports dynamic partial reconfiguration (PR) through its ICAP interface and dedicated PR controller logic. Verified designs demonstrate runtime swapping of functional modules such as filter banks or protocol stacks without disrupting active logic. XC6VLX240T-L1FFG1156I requires Vivado Design Suite 2018.3 or later for PR implementation flow.
XC6VLX240T-L1FFG1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.91V ~ 0.97V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX240T-L1FFG1156I FAQ
1.How can I place an order for XC6VLX240T-L1FFG1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-L1FFG1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-L1FFG1156I reliable?
The price and inventory of XC6VLX240T-L1FFG1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-L1FFG1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-L1FFG1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-L1FFG1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX240T-L1FFG1156I?
XC6VLX240T-L1FFG1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-L1FFG1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-L1FFG1156I?
For technical support, including XC6VLX240T-L1FFG1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-L1FFG1156I requirements.
6.How does Aetrix verify that XC6VLX240T-L1FFG1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-L1FFG1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-L1FFG1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-L1FFG1156I?
All XC6VLX240T-L1FFG1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-L1FFG1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-L1FFG1156I part is unused and in its original packaging.
Return procedure for XC6VLX240T-L1FFG1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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