AMD XC6VLX240T-L1FFG1759I
- Part No.:
- XC6VLX240T-L1FFG1759I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX240T-L1FFG1759I.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VLX240T-L1FFG1759I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 240,000 logic cells, 1,200 DSP48E1 slices, and 17.9 Mb of block RAM. It operates at -1 speed grade with I/O support up to 1.25 Gbps and targets high-bandwidth digital signal processing in radar and wired communications infrastructure.
For engineers reviewing the XC6VLX240T-L1FFG1759I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage compatibility (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), transceiver lane count (32 GTX), and thermal design power (15.2 W typical).
Technical Context
The XC6VLX240T-L1FFG1759I implements a 40 nm CMOS architecture with integrated 6.6 Gbps GTX transceivers, SelectIO technology supporting multiple I/O standards, and clock management tiles with MMCM and PLL blocks. It supports partial reconfiguration and PCIe Gen2 x8 endpoint/root complex operation.
This device belongs to the Virtex-6 LXT family and includes hardened Gigabit Ethernet MACs, tri-mode Ethernet PHY support, and AXI4-compliant interconnect infrastructure for system-on-chip integration in high-reliability embedded systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 240,000 - determines maximum combinational and sequential logic capacity for complex state machines and datapaths |
| DSP Slices | 1,200 × DSP48E1 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 17.9 Mb - supports large on-chip buffering for video frame stores or packet memory in networking |
| GTX Transceivers | 32 lanes @ 6.6 Gbps - provides serial connectivity for JESD204B, CPRI, and 10GbE interfaces |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL - allows direct interfacing with ADCs, DACs, DDR3 memory, and FPGAs |
| Speed Grade | -1 - specifies worst-case timing performance at industrial temperature range (-40°C to +100°C) |
| Package | FFG1759 - 1759-pin flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
XC6VLX240T-L1FFG1759I is housed in a 1759-pin flip-chip fine-pitch BGA (FFG1759) package with 1.0 mm ball pitch, thermal lid, and dedicated power/ground ball arrays for low-noise operation and thermal management in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% supply for logic fabric and CLBs; requires low-ESR decoupling near package corners |
| VCCAUX | Auxiliary supply | 2.5 V supply for configuration logic, clock management, and transceiver reference circuits |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V supply per I/O bank; sets voltage threshold for all pins in that bank |
| MRCC/MRCC_N | Multi-Gigabit RefClk input | Differential reference clock input for GTX transceivers; must meet jitter < 1.0 ps RMS |
| MGTREFCLK0P/N | Transceiver reference clock | Primary differential clock pair for GTX lane 0–15; routed with controlled impedance and length matching |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 x8 Endpoint | Reduces RTL integration effort and verification time for host interface subsystems |
| Tri-Mode Ethernet MAC | Supports 10/100/1000 Mbps operation without external PHY, simplifying board-level Ethernet connectivity |
| Partial Reconfiguration | Enables dynamic function swapping in runtime-critical systems without full FPGA reset |
| AXI4 Interconnect Infrastructure | Provides standardized, scalable bus protocol for connecting processors, DMA, and peripherals in SoC designs |
| MMCM + PLL Clock Management | Delivers up to 12 output clocks per tile with phase alignment and jitter filtering for multi-domain timing |
Applications
| Radar Signal Processing | High-Speed Wired Communications |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; GTX transceivers interface with ADC/DAC modules. Use Value: 32 GTX lanes enable simultaneous multi-channel data ingestion at >5 Gbps aggregate bandwidth. | Use Scenario: Line-card processing in 10G/40G optical transport equipment and packet switches. IC Role / Device Role / Timing Role: Implements packet classification, traffic shaping, and SerDes aggregation using hardened Ethernet MACs and AXI4 interconnect. Use Value: Integrated PCIe Gen2 x8 allows direct CPU coherency via host bridge, reducing latency vs. external switch chips. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Digital backend for ultrasound and MRI systems requiring real-time image reconstruction. IC Role / Device Role / Timing Role: Configurable logic processes echo data streams; block RAM buffers raw RF samples prior to GPU offload. Use Value: 17.9 Mb block RAM supports >256-line scan buffering at 10-bit depth without external memory access. | Use Scenario: High-resolution oscilloscope and arbitrary waveform generator platforms. IC Role / Device Role / Timing Role: Synchronizes multi-channel ADC sampling, performs real-time FFT, and manages USB3.0/PCIe data streaming. Use Value: DSP48E1 slices deliver 2,400 GMAC/s peak throughput for live spectral analysis at 1 GS/s sample rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale architecture, 350K logic cells, 16.3 Gbps GTY transceivers, higher static power | Targets next-gen 5G massive MIMO and AI-accelerated test equipment where bandwidth exceeds Virtex-6 limits | Choose when >10 Gbps serial I/O or >300K logic cells are required; requires new PCB layout and toolchain migration |
| XC6VLX195T-2FFG1156I | Same Virtex-6 LXT family, 195K logic cells, 24 GTX lanes, smaller FFG1156 package | Suitable for cost-optimized radar front-ends or mid-tier communications where full XC6VLX240T capacity is unused | Choose for footprint- and power-constrained designs needing same toolchain and IP compatibility |
Compared with XC6VLX240T-L1FFG1759I, the XCVU3P-2FFVD1760I offers higher bandwidth but demands new design investment, while the XC6VLX195T-2FFG1156I retains full software and IP reuse at reduced logic and I/O scale.
Availability
XC6VLX240T-L1FFG1759I is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX240T-L1FFG1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client applications through its acquisition of Xilinx.
The Virtex-6 family was designed for high-performance, high-bandwidth system integration in aerospace, defense, and wired infrastructure, emphasizing deterministic timing, transceiver density, and long-term industrial support.
FAQ
What is the operating temperature range for XC6VLX240T-L1FFG1759I?
The XC6VLX240T-L1FFG1759I is rated for industrial temperature operation from –40°C to +100°C. This range is validated under the -1 speed grade specification and applies to all functional blocks including GTX transceivers, block RAM, and clock management tiles. Thermal derating curves and junction temperature limits are defined in the Virtex-6 DC and Switching Characteristics datasheet DS152.
Does XC6VLX240T-L1FFG1759I support partial reconfiguration?
Yes, XC6VLX240T-L1FFG1759I supports hardware-verified partial reconfiguration through the Vivado Design Suite and legacy ISE tools. The feature enables dynamic module swapping in active designs without resetting the entire configuration memory, and is used in applications such as adaptive filter banks and protocol stack updates in field-deployed equipment.
What I/O standards are supported by XC6VLX240T-L1FFG1759I?
XC6VLX240T-L1FFG1759I supports LVDS, LVPECL, RSDS, BLVDS, SSTL, HSTL, and multiple LVCMOS voltage levels (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V). Each I/O bank is independently configurable, allowing mixed-voltage interfaces on a single device-critical for interfacing with heterogeneous memory, ADC, and processor subsystems.
How many GTX transceivers does XC6VLX240T-L1FFG1759I include?
XC6VLX240T-L1FFG1759I includes 32 GTX transceiver lanes, each capable of 6.6 Gbps operation. These lanes are grouped into four quads (each quad containing four GTX channels), with dedicated reference clock inputs and shared clock routing resources. All 32 lanes are fully functional and routable in the FFG1759 package.
Is XC6VLX240T-L1FFG1759I compatible with PCIe Gen2 x8?
Yes, XC6VLX240T-L1FFG1759I integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. It supports both endpoint and root complex configurations, with automatic link training, error reporting, and MSI/MSI-X interrupt handling-all implemented in silicon without consuming logic resources.
XC6VLX240T-L1FFG1759I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18840
- Number of Logic Elements/Cells:
- 241152
- Total RAM Bits:
- 15335424
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.91V ~ 0.97V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX240T-L1FFG1759I FAQ
1.How can I place an order for XC6VLX240T-L1FFG1759I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX240T-L1FFG1759I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX240T-L1FFG1759I reliable?
The price and inventory of XC6VLX240T-L1FFG1759I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX240T-L1FFG1759I is usually 5 days.
3.What payment methods are accepted for XC6VLX240T-L1FFG1759I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX240T-L1FFG1759I transactions.
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4.How is shipping managed for XC6VLX240T-L1FFG1759I?
XC6VLX240T-L1FFG1759I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX240T-L1FFG1759I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX240T-L1FFG1759I?
For technical support, including XC6VLX240T-L1FFG1759I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX240T-L1FFG1759I requirements.
6.How does Aetrix verify that XC6VLX240T-L1FFG1759I is sourced from the original manufacturer or authorized distributors?
All XC6VLX240T-L1FFG1759I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX240T-L1FFG1759I meets industry standards.
7.What is the process for return or replacement of XC6VLX240T-L1FFG1759I?
All XC6VLX240T-L1FFG1759I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX240T-L1FFG1759I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX240T-L1FFG1759I part is unused and in its original packaging.
Return procedure for XC6VLX240T-L1FFG1759I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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