AMD XC6VLX240T-L1FFG784I

Overview

XC6VLX240T-L1FFG784I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 240,000 logic cells, 15.9 Mb of block RAM, and 720 DSP48E1 slices. It operates at -1 speed grade with I-grade temperature rating (–40°C to +100°C) and uses a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It targets high-bandwidth digital signal processing in radar and wired communications infrastructure.

For engineers reviewing the XC6VLX240T-L1FFG784I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, DSP slice count, I/O voltage support (1.2 V to 3.3 V), thermal performance under sustained operation, and compatibility with Vivado and ISE design tools.

Technical Context

The XC6VLX240T-L1FFG784I implements a 40 nm CMOS architecture with integrated SelectIO technology supporting single-ended and differential standards including LVCMOS, LVDS, and TMDS. Its clocking system includes up to 32 CMTs (Clock Management Tiles), each containing two DCMs and one PLL for precise jitter management and frequency synthesis.

It supports partial reconfiguration and built-in configuration security via AES-256 bitstream encryption. Configuration occurs through Master SPI, Slave Serial, or JTAG interfaces, with dual-boot capability enabled by on-chip fallback memory.

Key Specifications

Pinout & Package

Package: 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG), 29×29 mm body, 1.0 mm ball pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-capacity FPGA applications.

Compared with XC6VLX240T-L1FFG784I, XC6VLX315T-L1FFG1156I delivers scalable logic density within the same Virtex-6 family, while XCKU060-2FFVA1156I represents a generational shift offering superior performance per watt but requiring full design revalidation and tool migration.

Availability

XC6VLX240T-L1FFG784I is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, and medical imaging backend systems requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX240T-L1FFG784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Virtex-6 family was engineered for high-throughput, low-latency digital signal processing in infrastructure and defense applications where deterministic timing and configurability are critical.

FAQ

What is the maximum operating junction temperature for XC6VLX240T-L1FFG784I?

The XC6VLX240T-L1FFG784I has an industrial-grade temperature rating with a maximum junction temperature of +100°C. This specification is validated under worst-case voltage, frequency, and ambient conditions defined in the Virtex-6 DC and Switching Characteristics datasheet (DS152). Thermal design must ensure adequate heatsinking to maintain junction temperature within this limit during sustained operation.

Does XC6VLX240T-L1FFG784I support PCIe Gen2 x8 endpoint functionality?

Yes, XC6VLX240T-L1FFG784I includes hardened PCIe Gen2 x8 endpoint blocks compliant with PCI Express Base Specification 2.0. These blocks implement physical layer, data link layer, and transaction layer functions with integrated DMA engines and MSI-X support, enabling direct host communication without external bridge ICs.

Can XC6VLX240T-L1FFG784I be configured via JTAG only, without external flash memory?

Yes, XC6VLX240T-L1FFG784I supports JTAG configuration as a primary method, allowing full bitstream loading and debugging without external configuration memory. However, persistent storage requires external SPI flash or BPI PROM for power-on auto-configuration, since SRAM-based configuration is volatile.

What I/O standards are supported on Bank 34 of XC6VLX240T-L1FFG784I?

Bank 34 of XC6VLX240T-L1FFG784I supports LVCMOS18, LVCMOS25, LVCMOS33, and LVDS_25 I/O standards. Voltage compliance is determined by VCCO = 1.8 V, 2.5 V, or 3.3 V respectively, and all standards in this bank are compatible with differential termination and programmable output drive strength up to 24 mA.

Is partial reconfiguration supported on XC6VLX240T-L1FFG784I without additional licensing?

Yes, partial reconfiguration is natively supported on XC6VLX240T-L1FFG784I using standard ISE Design Suite 14.7 or later. No separate license is required; the feature relies on hardware primitives in the Virtex-6 fabric and is enabled through standard place-and-route constraints and bitstream generation workflows.