AMD XC6VLX365T-1FF1156I
- Part No.:
- XC6VLX365T-1FF1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX365T-1FF1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VLX365T-1FF1156I from AMD (formerly Xilinx) is a high-performance 40 nm Virtex-6 FPGA with 365,760 logic cells, 1,200 DSP48E1 slices, and 16.8 Mb of block RAM. It supports transceivers up to 6.6 Gb/s and operates at -1 speed grade (1.2 V core, industrial temperature range). It is used in high-bandwidth wired communications infrastructure.
For engineers reviewing the XC6VLX365T-1FF1156I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (600), transceiver lane count (24), LVDS support, thermal performance in FF1156 package, and compatibility with Vivado and ISE design tools.
Technical Context
The XC6VLX365T-1FF1156I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 24 multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and SRIO.
It features SelectIO technology with support for LVCMOS, LVDS, SSTL, HSTL, and differential signaling standards across 600 user I/Os. Configuration is performed via JTAG, Master SPI, or Slave SelectMAP modes using external PROM or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 365,760 - total programmable fabric resources for custom digital logic implementation |
| DSP Slices | 1,200 × DSP48E1 - fixed-point arithmetic and filtering capability per slice |
| Block RAM | 16.8 Mb - distributed on-chip memory for FIFOs, buffers, and lookup tables |
| Transceivers | 24 × 6.6 Gb/s - serial I/O for high-speed protocols including PCIe Gen2 and SRIO |
| I/O Pins | 600 - user-configurable pins supporting multiple voltage and signaling standards |
| Speed Grade | -1 - specifies maximum operating frequency and timing closure margin under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
The XC6VLX365T-1FF1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FF1156) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal and mechanical design requires adherence to Xilinx UG373 layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, clock management, and transceivers |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per I/O bank; sets signaling voltage standard for associated pins |
| M0–M2 | Configuration mode select | Three-pin encoding determines boot source (JTAG, SPI, SelectMAP) |
| INIT_B | Configuration status | Open-drain output indicating configuration success or failure |
| PROGRAM_B | Configuration reset | Active-low signal to initiate reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management | Integrated DCM and PLL blocks enable precise clock synthesis, phase alignment, and jitter reduction for multi-clock domain designs |
| PCIe Gen2 Endpoint Support | Hard IP blocks provide compliant root complex or endpoint functionality without consuming logic resources |
| Low-Power 40 nm Process | Reduces dynamic and static power vs. prior 65 nm Virtex-5, enabling higher density in thermally constrained systems |
| AXI4-Compliant Interfaces | Native support for AXI4 interconnect protocol simplifies integration with ARM-based processors and SoC subsystems |
| Partial Reconfiguration | Enables runtime logic updates in designated regions without disrupting active system operation |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in LTE/5G remote radio units. IC Role / Device Role / Timing Role: Programmable baseband accelerator handling FFT, FIR, and MIMO processing pipelines. Use Value: 1,200 DSP48E1 slices deliver >2 TeraMAC/s throughput while maintaining deterministic latency under variable load. | Use Scenario: Signal generation and analysis in automated test systems for semiconductor validation. IC Role / Device Role / Timing Role: High-precision pattern generator and real-time response analyzer with sub-nanosecond timing control. Use Value: 24 × 6.6 Gb/s transceivers enable parallel multi-channel stimulus/response capture at full line rate. |
| Avionics Data Concentrators | Medical Imaging Back-End |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553 data aggregation in flight control systems. IC Role / Device Role / Timing Role: Deterministic network interface controller with time-triggered scheduling and redundancy management. Use Value: -1 speed grade and industrial temp rating ensure reliable operation in uncontrolled avionics bays without forced cooling. | Use Scenario: Real-time image reconstruction and beamforming in ultrasound and MRI systems. IC Role / Device Role / Timing Role: Pipeline accelerator for back-projection and convolutional neural network inference kernels. Use Value: 16.8 Mb block RAM enables on-chip buffering of full-frame DICOM datasets during reconstruction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-1FF1156I | Fewer logic cells (240,000), reduced DSP count (720), same package and transceiver count | Suitable for lower-complexity signal processing where full XC6VLX365T capacity is unused | Select when design fits within 65% of XC6VLX365T-1FF1156I resources to reduce cost and power |
| XCKU040-2FFVA1156I | Kintex UltraScale architecture, higher transceiver speed (12.5 Gb/s), different pinout and voltage requirements | Targeting next-generation protocols like PCIe Gen3 and 10G Ethernet requiring higher serial bandwidth | Choose for new designs needing higher serial I/O performance and scalability beyond Virtex-6 roadmap |
Compared with XC6VLX240T-1FF1156I and XCKU040-2FFVA1156I, the XC6VLX365T-1FF1156I delivers optimal balance of mature 40 nm density, proven 6.6 Gb/s transceiver reliability, and industrial-qualified thermal behavior - making it preferred for sustaining legacy high-throughput infrastructure deployments.
Availability
XC6VLX365T-1FF1156I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and medical imaging systems requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX365T-1FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Virtex-6 family was originally designed by Xilinx to address high-performance logic, DSP, and serial connectivity requirements in wired communications, defense, and scientific instrumentation.
FAQ
What is the maximum transceiver data rate supported by the XC6VLX365T-1FF1156I?
The XC6VLX365T-1FF1156I supports transceiver data rates up to 6.6 Gb/s per lane. This enables compliance with PCIe Gen2 (5.0 GT/s), SATA II (3.0 Gb/s), and Serial RapidIO 1.2/2.0 standards. The actual achievable rate depends on board layout, reference clock stability, and signal integrity margins.
Does the XC6VLX365T-1FF1156I support partial reconfiguration?
Yes, the XC6VLX365T-1FF1156I supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This allows dynamic replacement of logic modules in designated regions without resetting the entire device or halting system operation - critical for mission-critical and real-time applications.
What configuration modes are available for the XC6VLX365T-1FF1156I?
The XC6VLX365T-1FF1156I supports JTAG, Master SPI, and Slave SelectMAP configuration modes. Mode selection is controlled by the M0–M2 pins at power-up. External configuration PROMs (e.g., XCFxx series) or microprocessors can drive these interfaces depending on system architecture requirements.
Is the XC6VLX365T-1FF1156I qualified for industrial temperature operation?
Yes, the XC6VLX365T-1FF1156I is rated for -40°C to +100°C operation and carries the 'I' suffix denoting industrial temperature qualification. This includes full timing specification compliance across the range without derating, verified per Xilinx DS152 and DS153 documentation.
What design tools are compatible with the XC6VLX365T-1FF1156I?
The XC6VLX365T-1FF1156I is fully supported in Xilinx ISE Design Suite 14.7, the final official tool release for Virtex-6 devices. While Vivado does not support synthesis or implementation for this part, it can be used for simulation, debugging, and bitstream analysis in mixed-toolflow environments.
XC6VLX365T-1FF1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 28440
- Number of Logic Elements/Cells:
- 364032
- Total RAM Bits:
- 15335424
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX365T-1FF1156I FAQ
1.How can I place an order for XC6VLX365T-1FF1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX365T-1FF1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX365T-1FF1156I reliable?
The price and inventory of XC6VLX365T-1FF1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX365T-1FF1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX365T-1FF1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX365T-1FF1156I transactions.
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5.How can I obtain technical support or documentation for XC6VLX365T-1FF1156I?
For technical support, including XC6VLX365T-1FF1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX365T-1FF1156I requirements.
6.How does Aetrix verify that XC6VLX365T-1FF1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX365T-1FF1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX365T-1FF1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX365T-1FF1156I?
All XC6VLX365T-1FF1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX365T-1FF1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX365T-1FF1156I part is unused and in its original packaging.
Return procedure for XC6VLX365T-1FF1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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