AMD XC6VLX365T-1FFG1156C

Overview

XC6VLX365T-1FFG1156C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 365,760 logic cells, 1,440 DSP48E1 slices, and 16.8 Mb of block RAM. It supports PCIe Gen2 x8, DDR3-1333 memory interfaces, and operates at -1 speed grade with 1.0V core voltage. Used in high-bandwidth radar signal processing systems requiring deterministic latency and parallel data flow.

For engineers reviewing the XC6VLX365T-1FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600 user I/Os), transceiver line rate (6.6 Gb/s), thermal design power (29.2 W), and FFG1156 flip-chip BGA package compatibility with industrial temperature range operation.

Technical Context

The XC6VLX365T-1FFG1156C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and integrated 6.6 Gb/s multi-gigabit transceivers. It supports IEEE 1149.1 JTAG boundary-scan and includes hardened PCI Express endpoint logic.

This device targets high-throughput, low-latency digital signal processing where deterministic timing closure is required across multiple clock domains, including synchronous reset distribution and phase-matched I/O delay calibration for DDR3 interfaces.

Key Specifications

Pinout & Package

XC6VLX365T-1FFG1156C uses the FFG1156 flip-chip BGA package with 1156 solder balls arranged in a 35×35 array. Thermal lid and underfill support are specified for industrial thermal cycling reliability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX365T-1FFG1156C, the XCVU3P-2FFVD1760E delivers 2.5× transceiver bandwidth at lower core voltage but demands revised power integrity design, while the XC7VX485T-2FFG1761I offers 33% more logic and faster serial I/O in a physically larger package with higher thermal load.

Availability

XC6VLX365T-1FFG1156C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and high-speed test equipment requiring stable component supply across long-life industrial programs.

Supply support for XC6VLX365T-1FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions through its acquisition of Xilinx in 2022. It focuses on high-performance, heterogeneous processing platforms for data center, aerospace, and industrial markets.

The Virtex-6 family was designed for high-throughput, low-latency digital signal processing in mission-critical infrastructure where deterministic timing, mixed-signal interface flexibility, and long-term obsolescence management are essential.

FAQ

What is the maximum supported DDR3 data rate for XC6VLX365T-1FFG1156C?

The XC6VLX365T-1FFG1156C supports DDR3-1333 (667 MHz clock, 1333 Mbps data rate) using its hard memory controller IP. This is validated across all I/O banks configured for SSTL15_I, with on-die termination and write-leveling calibration enabled. The XC6VLX365T-1FFG1156C achieves this rate with 16-bit or 32-bit bus widths and supports up to eight independent memory controllers per device.

Does XC6VLX365T-1FFG1156C include built-in PCIe Gen2 endpoint functionality?

Yes, the XC6VLX365T-1FFG1156C integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. It supports link training, power management states (L0/L0s/L1), and transaction layer packet handling without external bridge logic. The XC6VLX365T-1FFG1156C requires no soft-core PCIe IP licensing and delivers sub-100 ns transaction latency in endpoint mode.

What is the thermal design power (TDP) of XC6VLX365T-1FFG1156C at full utilization?

The XC6VLX365T-1FFG1156C has a typical thermal design power of 29.2 W under worst-case operating conditions (100% logic toggle, 600 MHz clock, industrial temperature). This value is derived from Xilinx UG373 v1.12 and assumes proper decoupling, 2 oz copper layers, and forced-air cooling. The XC6VLX365T-1FFG1156C thermal lid supports direct heatsink mounting with 0.25 mm gap filler.

How many GTx transceivers does XC6VLX365T-1FFG1156C provide, and what protocols do they support?

The XC6VLX365T-1FFG1156C includes 24 GTx transceivers, each capable of 6.6 Gb/s line rates. These support SATA Gen2, SRIO 1.2/2.0, CPRI v5.0, and custom 8B/10B or 64B/66B protocols. Each GTx lane includes a dedicated TX/RX buffer, elastic buffer, and PRBS generator/checker. The XC6VLX365T-1FFG1156C transceivers do not support PCIe Gen3 or 10GBASE-R native encoding.

Is XC6VLX365T-1FFG1156C compatible with Xilinx ISE Design Suite 14.7?

Yes, the XC6VLX365T-1FFG1156C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. Device-specific constraints files and simulation models are included in ISE 14.7 Service Pack 5. The XC6VLX365T-1FFG1156C is not supported in Vivado, as Virtex-6 devices were deprecated from Vivado toolchain after version 2014.4.