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AMD XC6VLX365T-1FFG1759C
- Part No.:
- XC6VLX365T-1FFG1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX365T-1FFG1759C.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,520
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Product details
Overview
XC6VLX365T-1FFG1759C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 365,704 logic cells, 1,536 DSP48E1 slices, and 16.4 Mb of block RAM. It supports transceiver data rates up to 6.6 Gb/s and operates at -1 speed grade with 1.0 V core voltage. It is deployed in high-end wired communications infrastructure and radar signal processing systems.
For engineers reviewing the XC6VLX365T-1FFG1759C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), transceiver lane count (32 GTX), thermal design power (22.5 W typical), and FFG1759 package compatibility with high-density PCB routing.
Technical Context
The XC6VLX365T-1FFG1759C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and integrated multi-gigabit transceivers (GTX). It supports PCI Express Gen2 x8, Serial RapidIO Gen2, and CPRI protocols via its transceiver bank configuration.
Configuration is performed via Master SelectMAP or JTAG, with support for dual-boot from two external flash devices. The device includes built-in clock management tiles (CMTs) with PLLs and MMCMs for jitter reduction and frequency synthesis across multiple clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 365,704 - determines maximum combinational/sequential logic capacity for complex digital signal processing pipelines |
| DSP Slices | 1,536 × DSP48E1 - enables parallel multiply-accumulate operations for real-time FIR/IIR filtering and FFT acceleration |
| Block RAM | 16.4 Mb - supports large on-chip buffering for video frame stores, packet buffering, or coefficient tables |
| Transceivers | 32 × GTX (6.6 Gb/s) - provides serial connectivity for optical line cards, baseband units, and test equipment interfaces |
| User I/Os | 720 - enables high-pin-count interface consolidation including DDR3 memory controllers and parallel sensor buses |
| Speed Grade | -1 - specifies maximum operating frequency under worst-case voltage/temperature conditions (1.0 V, 85°C junction) |
| Core Voltage | 1.0 V ±3% - defines power delivery requirements and impacts dynamic power consumption and thermal dissipation |
Pinout & Package
The XC6VLX365T-1FFG1759C is housed in a 1759-ball Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 1.0 mm ball pitch, designed for high-speed signal integrity and thermal performance in multi-layer PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0 V to CLBs, DSP slices, and interconnect; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, selectMAP interface, and clock management tiles |
| VCCO | I/O bank power | Configurable per-bank (1.2–3.3 V); sets output swing and input threshold for interfacing with external peripherals |
| MR | Master reset | Asynchronous global reset that clears configuration registers and halts state machines until reconfiguration completes |
| CCLK | Configuration clock | Drives internal configuration shift register during SelectMAP or slave serial mode; max 50 MHz |
| GTXREFCLK | Transceiver reference clock | Provides clean 100–625 MHz reference to GTX PLLs; must meet phase noise and jitter specs per UG366 |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTX Transceivers | 32 lanes supporting 600 Mb/s–6.6 Gb/s with built-in 8B/10B encoding and elastic buffers for protocol alignment |
| DSP48E1 Slice Architecture | Each slice delivers 25×18-bit multiply + 48-bit accumulate in one cycle, enabling 16-bit complex MAC at 400+ MHz |
| PCIe Gen2 x8 Endpoint | Hard IP block with full link training, error reporting, and TLP handling-reduces soft-core implementation overhead |
| Multi-Mode Clock Manager (MMCM) | Generates up to 6 independent output clocks with programmable phase/duty cycle; jitter < 150 ps RMS over 12 kHz–20 MHz |
| Configurable I/O Standards | Supports LVCMOS, SSTL, HSTL, differential LVDS, and TMDS per bank-enables direct interface to DDR3, HDMI, and SERDES PHYs |
Applications
| Wireless Baseband Processing | Radar Signal Processing |
|---|---|
Use Scenario: Real-time channelization, MIMO precoding, and OFDM symbol generation in LTE-A and 5G NR macro base stations. IC Role / Device Role / Timing Role: Primary programmable fabric for L1/L2 protocol stack acceleration and RF front-end timing synchronization. Use Value: 32 GTX transceivers enable direct fronthaul interface to remote radio units; 1,536 DSP slices sustain >200 GMAC/s for beamforming matrix computation. | Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture radar (SAR) image reconstruction in airborne platforms. IC Role / Device Role / Timing Role: High-throughput data path engine with deterministic latency for ADC sample ingestion and FFT-based spectral analysis. Use Value: 16.4 Mb block RAM allows storage of 4K-point complex FFT twiddle tables and intermediate range-Doppler maps without external memory access. |
| High-Speed Test Equipment | Optical Transport Line Cards |
Use Scenario: Bit-error-rate testing (BERT), jitter tolerance validation, and protocol conformance verification for 10G/40G Ethernet and Fibre Channel. IC Role / Device Role / Timing Role: Programmable pattern generator and error analyzer with sub-nanosecond timing resolution and PRBS-31 generation. Use Value: 720 user I/Os support parallel multi-lane stimulus injection; GTX transceivers operate at precise 10.3125 Gb/s for 10GBASE-R compliance. | Use Scenario: OTU2/OTU3 framing, FEC decoding, and multiplexing in DWDM line interface cards for metro/core networks. IC Role / Device Role / Timing Role: Protocol-aware transport processor handling G.709 framing, Reed-Solomon decoding, and OPUk mapping. Use Value: Hard PCIe Gen2 x8 interface enables direct host CPU offload; 365K logic cells implement full OTN stack with < 2 μs latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-1FFG1156I | Fewer logic cells (240,016), 24 GTX transceivers, smaller FFG1156 package (1156 balls), -1I extended temperature grade | Lower bandwidth and compute density; suited for compact radar modules or mid-tier test instruments | Select when thermal envelope or board area constraints limit use of FFG1759, and 24 GTX lanes suffice |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture; higher DSP density (1,540 vs. 1,536), 32 GTY transceivers (16.3 Gb/s), 1.2 V core, different pinout | Enables next-gen 100G+ interfaces and AI-accelerated inference; not pin-compatible with Virtex-6 | Choose for new designs requiring higher serial bandwidth or lower power per MAC, accepting re-layout and toolchain migration |
Compared with XC6VLX240T-1FFG1156I and XCKU060-2FFVA1156I, the XC6VLX365T-1FFG1759C delivers highest logic capacity and I/O count in the Virtex-6 family, making it optimal for legacy infrastructure upgrades where FFG1759 footprint and -1 speed grade are fixed requirements.
Availability
XC6VLX365T-1FFG1759C is available at Aetrix Electronics and suitable for wireless infrastructure, defense radar, and high-speed test equipment requiring stable component supply across long product lifecycles.
Supply support for XC6VLX365T-1FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-6 family was engineered for high-bandwidth, high-compute applications in wired communications, aerospace, and instrumentation-prioritizing transceiver density, DSP throughput, and deterministic timing closure.
FAQ
What is the maximum supported transceiver data rate for the XC6VLX365T-1FFG1759C?
The XC6VLX365T-1FFG1759C supports GTX transceivers with a maximum data rate of 6.6 Gb/s. This is confirmed in Xilinx UG366 (Virtex-6 FPGA GTX Transceivers User Guide) and applies to all 32 GTX lanes under -1 speed grade and recommended voltage/temperature conditions. The XC6VLX365T-1FFG1759C does not support higher-rate GTY or GTH transceivers found in newer families.
Does the XC6VLX365T-1FFG1759C support PCI Express Gen2 x8 endpoint functionality?
Yes, the XC6VLX365T-1FFG1759C includes hard IP blocks for PCI Express Gen2 x8 endpoint operation, including link training, transaction layer packet handling, and error reporting. This capability is documented in Xilinx UG371 (Virtex-6 FPGA PCI Express Solution User Guide) and requires no soft-core implementation. The XC6VLX365T-1FFG1759C uses dedicated PCIe block resources, preserving logic cells for application logic.
What is the total block RAM capacity of the XC6VLX365T-1FFG1759C?
The XC6VLX365T-1FFG1759C contains 16.4 Mb of total block RAM, implemented as 1,152 × 36 Kb BRAM primitives. This capacity is distributed across the device fabric and supports true dual-port operation with independent read/write clocks. The XC6VLX365T-1FFG1759C block RAM is used for on-chip buffering, FIFOs, and lookup tables without external memory latency.
Is the XC6VLX365T-1FFG1759C pin-compatible with other Virtex-6 FFG1759 devices?
Yes, the XC6VLX365T-1FFG1759C shares the same FFG1759 package footprint and pinout with other Virtex-6 LX/T devices in the same package variant, including XC6VLX240T-1FFG1759C and XC6VLX550T-1FFG1759C. Power and configuration pins are identical; I/O bank assignments and transceiver locations are consistent across the family, enabling hardware reuse in scalable designs.
What configuration modes does the XC6VLX365T-1FFG1759C support?
The XC6VLX365T-1FFG1759C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Configuration bitstream can be loaded from SPI flash, BPI flash, or external processor via parallel bus. The XC6VLX365T-1FFG1759C also supports dual-boot with fallback capability using two separate flash devices, as defined in Xilinx UG380 (Virtex-6 FPGA Configuration User Guide).
XC6VLX365T-1FFG1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 28440
- Number of Logic Elements/Cells:
- 364032
- Total RAM Bits:
- 15335424
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX365T-1FFG1759C FAQ
1.How can I place an order for XC6VLX365T-1FFG1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX365T-1FFG1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX365T-1FFG1759C reliable?
The price and inventory of XC6VLX365T-1FFG1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX365T-1FFG1759C is usually 5 days.
3.What payment methods are accepted for XC6VLX365T-1FFG1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX365T-1FFG1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX365T-1FFG1759C?
XC6VLX365T-1FFG1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX365T-1FFG1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX365T-1FFG1759C?
For technical support, including XC6VLX365T-1FFG1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX365T-1FFG1759C requirements.
6.How does Aetrix verify that XC6VLX365T-1FFG1759C is sourced from the original manufacturer or authorized distributors?
All XC6VLX365T-1FFG1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX365T-1FFG1759C meets industry standards.
7.What is the process for return or replacement of XC6VLX365T-1FFG1759C?
All XC6VLX365T-1FFG1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX365T-1FFG1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX365T-1FFG1759C part is unused and in its original packaging.
Return procedure for XC6VLX365T-1FFG1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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