AMD XC6VLX365T-2FFG1156C

Overview

XC6VLX365T-2FFG1156C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 365,704 logic cells, 1,536 DSP48E1 slices, and 16.8 Mb of block RAM. It supports transceivers up to 6.6 Gb/s and operates at -2 speed grade (1.2 V core, industrial temperature range). It is used in high-bandwidth wired communications infrastructure equipment.

For engineers reviewing the XC6VLX365T-2FFG1156C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage support (1.2–3.3 V), PCIe Gen2 endpoint capability, and thermal performance in air-cooled 1156-pin flip-chip BGA systems.

Technical Context

The XC6VLX365T-2FFG1156C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and high-speed serial transceivers. It integrates 32 RocketIO GTP transceivers, each supporting protocols including SATA, SRIO, and CPRI.

It features SelectIO technology with support for LVDS, SSTL, HSTL, and differential signaling standards across 24 I/O banks. Configuration is performed via Master SPI or JTAG, with bitstream encryption available using AES-256.

Key Specifications

Pinout & Package

The XC6VLX365T-2FFG1156C is housed in a 1156-pin flip-chip BGA (FFG1156) package with 35 × 35 mm footprint, 1.0 mm ball pitch, and thermal lid. Pin functions are organized into configuration, clock, I/O, power, and transceiver banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX240T-2FFG1156C and XCKU060-2FFVA1156I, the XC6VLX365T-2FFG1156C delivers optimal balance of mature 40nm transceiver reliability, PCIe Gen2 endpoint integration, and proven thermal behavior in air-cooled 1U systems-making it preferred for field-deployed telecom equipment with long lifecycle requirements.

Availability

XC6VLX365T-2FFG1156C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport networking, and radar signal processing requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX365T-2FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Virtex-6 family was designed for high-performance logic, signal processing, and serial connectivity in wired communications, aerospace, and defense systems where reliability and long-term availability are critical.

FAQ

What is the maximum supported transceiver data rate for XC6VLX365T-2FFG1156C?

The XC6VLX365T-2FFG1156C supports RocketIO GTP transceivers with a maximum data rate of 6.6 Gb/s. This rate is validated under industrial temperature conditions and at -2 speed grade with proper reference clock jitter and PCB interconnect design. The XC6VLX365T-2FFG1156C achieves this performance using adaptive equalization and pre-emphasis settings configured via the transceiver wizard.

Does XC6VLX365T-2FFG1156C support PCI Express Gen2 endpoint functionality?

Yes, the XC6VLX365T-2FFG1156C includes hardened PCIe Gen2 endpoint logic supporting x1, x2, and x4 configurations. It complies with PCIe Base Specification 2.1 and supports features such as completion timeout, advanced error reporting, and power management states. The XC6VLX365T-2FFG1156C implements this without consuming fabric resources, reducing latency and configuration complexity.

What I/O standards are supported by XC6VLX365T-2FFG1156C?

The XC6VLX365T-2FFG1156C supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS, BLVDS, RSDS, and Differential SSTL across its 24 I/O banks. Each bank operates independently at voltages from 1.2 V to 3.3 V. The XC6VLX365T-2FFG1156C allows mixing of standards within a single bank only when compatible with shared VCCO and termination settings.

Is bitstream encryption available on XC6VLX365T-2FFG1156C?

Yes, the XC6VLX365T-2FFG1156C supports AES-256 bitstream encryption using a user-provided 256-bit key stored in on-chip eFUSE. This prevents unauthorized readback and cloning of configuration data. The XC6VLX365T-2FFG1156C requires encrypted bitstreams to be generated with Xilinx ISE Design Suite v14.7 or later and loaded via JTAG or BPI flash.

What is the thermal design power (TDP) of XC6VLX365T-2FFG1156C under typical operating conditions?

The XC6VLX365T-2FFG1156C has a typical thermal design power of 12.5 W at 100°C junction temperature with 50% logic utilization and active transceivers. Power consumption varies significantly with design utilization, I/O activity, and transceiver count. The XC6VLX365T-2FFG1156C datasheet provides detailed power estimation using Xilinx XPE tool with user-specific toggle rates and resource usage.