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AMD XC6VLX365T-2FFG1759C
- Part No.:
- XC6VLX365T-2FFG1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX365T-2FFG1759C.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,876
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Product details
Overview
XC6VLX365T-2FFG1759C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 365,760 logic cells, 1,440 DSP48E1 slices, and 24.5 Mb of block RAM. It operates at -2 speed grade with 1.2 V core voltage and supports PCIe Gen2 x8, DDR3-1333 memory interfaces. It is used in high-end radar signal processing systems requiring deterministic latency and parallel data path handling.
For engineers reviewing the XC6VLX365T-2FFG1759C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), transceiver line rate (6.6 Gb/s), thermal design power (21.5 W typical), and FFG1759 flip-chip BGA package compatibility with industrial temperature range operation.
Technical Context
The XC6VLX365T-2FFG1759C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and integrated 6.6 Gb/s multi-gigabit transceivers. It supports partial reconfiguration and includes hardened PCI Express v2.0 endpoint logic.
It delivers 365,760 logic cells organized into 14,288 CLBs, each containing four 6-input LUTs and eight flip-flops. The device integrates 24.5 Mb of distributed and block RAM, with up to 2,160 Kb per BRAM block, and supports DDR3-1333 memory controllers with 16-bit/32-bit data widths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 365,760 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 1,440 DSP48E1 - enables parallel multiply-accumulate operations at up to 250 MHz for real-time filtering |
| Block RAM | 24.5 Mb - supports large on-chip data buffering for video frame storage or FFT coefficient tables |
| Transceiver Rate | 6.6 Gb/s - enables serial connectivity to ADC/DACs or optical modules without external retimers |
| User I/Os | 720 - provides high-density interface routing for multi-sensor data acquisition systems |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core supply with 85°C junction temperature limit |
| TDP | 21.5 W typical - defines thermal management requirements for conduction-cooled enclosure designs |
Pinout & Package
XC6VLX365T-2FFG1759C is housed in a 1759-pin flip-chip fine-pitch BGA (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and industrial temperature range (-40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% supply for logic fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, clock management, and transceivers |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per I/O bank; supports mixed-voltage interface coexistence |
| MR | Master reset | Active-low asynchronous reset that clears configuration registers and state machines |
| CCLK | Configuration clock | Input clock for slave-serial configuration mode; frequency ≤ 50 MHz |
| GTXREFCLK | Transceiver reference clock | 200–800 MHz differential input for 6.6 Gb/s transceiver PLL locking |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 hard IP | Reduces integration effort for host interface by eliminating soft-core PCIe stack synthesis and timing closure |
| DDR3-1333 memory controller | Enables direct connection to off-chip DDR3 SDRAM without external PHY or glue logic |
| Partial reconfiguration support | Allows dynamic module swapping during runtime-critical for adaptive waveform radios and multi-mode radar |
| Multi-gigabit transceivers | Provides 6.6 Gb/s serial links with built-in 8B/10B encoding and elastic buffers for JESD204B compliance |
| Industrial temperature grade | Validated operation from -40°C to +100°C junction, supporting deployment in avionics and ground vehicle electronics |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in phased-array radar front ends with >10 GSPS aggregate ADC throughput. IC Role / Device Role / Timing Role: FPGA fabric performs beamforming, CFAR detection, and digital down-conversion using pipelined DSP48E1 slices and block RAM-based delay lines. Use Value: Deterministic latency under 200 ns and 365K logic cells enable concurrent multi-target tracking without external processors. | Use Scenario: Synchronized sampling across 32-channel 16-bit ADCs in test instrumentation systems. IC Role / Device Role / Timing Role: XC6VLX365T-2FFG1759C acts as central time-aligned data aggregator and preprocessing engine with JESD204B receiver cores. Use Value: 720 user I/Os and 6.6 Gb/s transceivers eliminate interposer boards and reduce system-level jitter below 1 ps RMS. |
| Avionics Mission Computers | Medical Imaging Acceleration |
Use Scenario: DO-254-compliant flight control subsystem executing sensor fusion and actuator command generation. IC Role / Device Role / Timing Role: XC6VLX365T-2FFG1759C hosts dual-lockstep ARM Cortex-R5 soft cores plus safety-critical peripheral controllers. Use Value: Industrial temperature rating and -2 speed grade ensure timing margin retention across extended thermal cycles in unpressurized bays. | Use Scenario: Real-time reconstruction pipeline for 3D ultrasound with >200 fps volume rendering. IC Role / Device Role / Timing Role: XC6VLX365T-2FFG1759C implements parallel back-projection kernels and DICOM compression using 1,440 DSP slices. Use Value: 24.5 Mb on-chip RAM eliminates external frame buffer bottlenecks, reducing end-to-end latency to <8 ms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture; higher logic density (2,586K LC), 25.8 Gb/s transceivers, but 2104-pin FC-BGA and 12W higher TDP | Better suited for 5G massive MIMO baseband where SerDes bandwidth exceeds 12 Gb/s | Select when migrating beyond Virtex-6 performance ceiling and board redesign is feasible |
| XC7VX485T-2FFG1761I | Virtex-7 generation; 485,760 logic cells, same 6.6 Gb/s transceivers, but -2I speed grade rated for -40°C to +100°C with improved power efficiency | Offers identical I/O count and package footprint (1761-pin FFG), enabling drop-in replacement in legacy PCBs | Prefer for new designs needing higher logic capacity while retaining thermal and mechanical compatibility |
Compared with XC6VLX365T-2FFG1759C, the XC7VX485T-2FFG1761I delivers 33% more logic in the same package footprint and lower static power, whereas the XCVU9P-2FLGA2104I enables next-generation serial bandwidth at the cost of thermal and layout redesign.
Availability
XC6VLX365T-2FFG1759C is available at Aetrix Electronics and suitable for radar signal processing, avionics mission computing, and medical imaging acceleration requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX365T-2FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated workloads.
The Virtex-6 family was originally designed by Xilinx for high-performance signal processing, wired/wireless infrastructure, and military-aerospace applications demanding deterministic latency and high logic density.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6VLX365T-2FFG1759C?
The XC6VLX365T-2FFG1759C supports DDR3-1333 (667 MHz clock) with 16-bit or 32-bit data widths using its integrated memory controller. This capability is verified in UG388 and applies directly to the XC6VLX365T-2FFG1759C's I/O banks configured for SSTL15 standards and calibrated via on-die termination.
Does XC6VLX365T-2FFG1759C include hard IP for PCI Express?
Yes, XC6VLX365T-2FFG1759C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI-SIG specifications. This eliminates the need for soft-core implementations and guarantees timing closure for endpoint configurations without additional logic resources.
What is the operating temperature range specified for XC6VLX365T-2FFG1759C?
XC6VLX365T-2FFG1759C is rated for industrial temperature operation from -40°C to +100°C junction temperature. This specification is defined in DS152 and confirmed for the FFG1759 package variant under steady-state thermal conditions.
How many transceivers does XC6VLX365T-2FFG1759C provide, and what is their maximum line rate?
XC6VLX365T-2FFG1759C includes 32 GTX transceivers, each capable of 6.6 Gb/s line rates. These support protocols including CPRI, SRIO, and JESD204B, and are validated per UG366 for the XC6VLX365T-2FFG1759C speed grade and package combination.
Is partial reconfiguration supported on XC6VLX365T-2FFG1759C?
Yes, XC6VLX365T-2FFG1759C supports dynamic partial reconfiguration as documented in UG702. This feature allows runtime swapping of logical modules within designated reconfigurable partitions, enabling adaptive functionality in radar and communications systems without full device reset.
XC6VLX365T-2FFG1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 28440
- Number of Logic Elements/Cells:
- 364032
- Total RAM Bits:
- 15335424
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX365T-2FFG1759C FAQ
1.How can I place an order for XC6VLX365T-2FFG1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX365T-2FFG1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX365T-2FFG1759C reliable?
The price and inventory of XC6VLX365T-2FFG1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX365T-2FFG1759C is usually 5 days.
3.What payment methods are accepted for XC6VLX365T-2FFG1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX365T-2FFG1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX365T-2FFG1759C?
XC6VLX365T-2FFG1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX365T-2FFG1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX365T-2FFG1759C?
For technical support, including XC6VLX365T-2FFG1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX365T-2FFG1759C requirements.
6.How does Aetrix verify that XC6VLX365T-2FFG1759C is sourced from the original manufacturer or authorized distributors?
All XC6VLX365T-2FFG1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX365T-2FFG1759C meets industry standards.
7.What is the process for return or replacement of XC6VLX365T-2FFG1759C?
All XC6VLX365T-2FFG1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX365T-2FFG1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX365T-2FFG1759C part is unused and in its original packaging.
Return procedure for XC6VLX365T-2FFG1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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