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AMD XC6VLX365T-2FFG1759I
- Part No.:
- XC6VLX365T-2FFG1759I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX365T-2FFG1759I.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,188
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Product details
Overview
XC6VLX365T-2FFG1759I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 365,704 logic cells, 1,440 DSP48E1 slices, and 24.5 Mb of block RAM. It operates at -2 speed grade with I/O support up to 1.25 Gbps and targets high-bandwidth digital signal processing in radar and wired communications infrastructure.
For engineers reviewing the XC6VLX365T-2FFG1759I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, transceiver count, memory bandwidth, thermal performance in FFG1759 packaging, and compatibility with Vivado and ISE design tools.
Technical Context
The XC6VLX365T-2FFG1759I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and high-speed serial transceivers compliant with PCIe Gen2, SATA, and SRIO standards. It supports multi-gigabit transceiver rates from 600 Mbps to 6.6 Gbps across 32 GTx channels.
Configuration occurs via Master SelectMAP, Slave SelectMAP, or JTAG interfaces, with bitstream security enabled through AES-256 encryption and HMAC authentication. The device integrates clock management tiles (CMTs) containing DCMs and PLLs for jitter reduction and frequency synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 365,704 - determines maximum combinational/sequential logic capacity for complex RTL implementation |
| DSP Slices | 1,440 × DSP48E1 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 24.5 Mb - supports large on-chip data buffering and coefficient storage without external memory |
| GTx Transceivers | 32 × 600 Mbps–6.6 Gbps - provides native interface to PCIe Gen2, SATA II/III, and SRIO 1.2/2.1 |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL, TMDS - ensures interoperability with ADCs, DACs, memory, and video PHYs |
| Speed Grade | -2 - guarantees timing closure at worst-case junction temperature (Tj = 100°C) and VCCINT = 0.95 V |
| Package | FFG1759 - 1759-pin flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
XC6VLX365T-2FFG1759I is housed in a 1759-pin flip-chip fine-pitch ball grid array (FFG1759) package with 1.0 mm pitch, designed for high I/O count and thermal management in demanding compute-accelerated systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master mode programming |
| DIN | Configuration Data Input | Serial bitstream input for SelectMAP or slave serial configuration |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Asynchronous active-low reset that clears configuration memory and restarts boot process |
| M0–M2 | Mode Selection Inputs | Set configuration mode (JTAG, Master/Slave SelectMAP, Serial) at power-up |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock Input | Differential reference clock for GTx channel 0, supporting 100–625 MHz frequencies |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint Support | Integrated hard IP enables full-line-rate endpoint operation without soft-core overhead |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning of configured logic |
| Multi-Voltage I/O Banks | 18 banks support independent VCCO (1.2–3.3 V) for mixed-signal interface consolidation |
| Dynamic Reconfiguration | Enables partial reconfiguration of logic regions while system remains operational |
| UltraScale-Compatible Toolflow | Supports migration path to UltraScale+ via ISE 14.7 and Vivado 2019.2+ tool compatibility |
Applications
| Radar Signal Processing | High-Speed Wired Communications |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; GTx transceivers interface with high-speed ADC/DACs and RF front-end ICs. Use Value: 365K logic cells and 1,440 DSP slices enable concurrent multi-channel processing with sub-microsecond latency. | Use Scenario: Line-card processing in 10G/40G Ethernet switches and OTN transport equipment. IC Role / Device Role / Timing Role: Implements packet classification, traffic shaping, and SerDes aggregation using integrated GTx and memory controllers. Use Value: Native PCIe Gen2 x8 and 32 GTx lanes eliminate external bridging ICs and reduce board-level complexity. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Digital backend for MRI and CT scanners requiring real-time image reconstruction and motion correction. IC Role / Device Role / Timing Role: Configurable logic processes raw k-space data; block RAM buffers frame sequences; DDR3 controller manages off-chip memory. Use Value: 24.5 Mb on-chip RAM reduces external memory bandwidth bottlenecks and improves deterministic processing timing. | Use Scenario: High-resolution oscilloscopes and protocol analyzers capturing multi-GHz analog waveforms or serial data streams. IC Role / Device Role / Timing Role: Synchronizes sampling clocks, performs real-time pattern matching, and formats data for PCIe host transfer. Use Value: -2 speed grade ensures reliable timing closure at 600+ MHz internal clock domains under industrial temperature conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-2FFG1156I | Lower logic count (240,080 CLBs), 20 GTx transceivers, smaller FFG1156 package | Suitable for cost-sensitive 10G line cards with reduced DSP and memory requirements | Select when full XC6VLX365T capacity is unnecessary and PCB area is constrained |
| XCVU3P-2FFVD1760I | UltraScale architecture, 350K logic cells, 40 GTUs, higher transceiver density and lower static power | Better suited for new designs targeting PCIe Gen3, 100G Ethernet, or AI inference acceleration | Choose for roadmap continuity and improved power efficiency where legacy ISE tool support is not required |
Compared with XC6VLX365T-2FFG1759I, the XC6VLX240T offers reduced cost and footprint but limits scalability in DSP-intensive radar systems, while the XCVU3P delivers architectural advances and higher serial bandwidth at the expense of legacy toolchain compatibility.
Availability
XC6VLX365T-2FFG1759I is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, and medical imaging backend systems requiring stable component supply and long-term industrial availability.
Supply support for XC6VLX365T-2FFG1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, ACAPs, and AI accelerators for data center, aerospace, and industrial markets.
The Virtex-6 family was engineered for high-performance logic, signal processing, and serial connectivity in infrastructure equipment where throughput, determinism, and I/O flexibility are critical.
FAQ
What is the maximum transceiver data rate supported by XC6VLX365T-2FFG1759I?
The XC6VLX365T-2FFG1759I supports GTx transceiver data rates from 600 Mbps to 6.6 Gbps per lane. This range enables compliance with PCIe Gen2 (5.0 GT/s), SATA III (6.0 Gbps), and SRIO 2.1 (6.25 Gbps) standards. All 32 transceivers in the XC6VLX365T-2FFG1759I are rated for this full speed range under industrial temperature conditions.
Does XC6VLX365T-2FFG1759I support partial reconfiguration?
Yes, XC6VLX365T-2FFG1759I supports dynamic partial reconfiguration (PR) through its configuration logic and frame-based bitstream architecture. This allows designated logic regions to be updated while the rest of the design remains operational-critical for adaptive radar modes or protocol-switching in communications gear. PR requires ISE Design Suite 13.4 or later and proper floorplanning.
What configuration modes are available for XC6VLX365T-2FFG1759I?
XC6VLX365T-2FFG1759I supports multiple configuration modes: Master/Slave SelectMAP (parallel), Serial (SPI flash), and JTAG. Mode selection is controlled by M0–M2 pins at power-up. Configuration can be initiated automatically from external SPI flash or triggered externally via PROGRAM_B, enabling flexible boot strategies in field-deployed systems.
Is XC6VLX365T-2FFG1759I compatible with Vivado Design Suite?
XC6VLX365T-2FFG1759I is fully supported in ISE Design Suite 14.7, the final official tool release for Virtex-6. While Vivado does not support XC6VLX365T-2FFG1759I natively, Vivado 2019.2+ provides limited migration analysis and bitstream conversion utilities for legacy Virtex-6 designs targeting newer architectures like UltraScale+.
What thermal specifications apply to XC6VLX365T-2FFG1759I in industrial use?
XC6VLX365T-2FFG1759I is rated for industrial temperature range (–40°C to +100°C junction). Its FFG1759 package includes thermal vias and copper heat spreader features. Thermal design must maintain θJA ≤ 11.5°C/W with appropriate PCB copper area and airflow; junction temperature must stay below 100°C under worst-case voltage (VCCINT = 0.95 V) and speed grade (-2) conditions.
XC6VLX365T-2FFG1759I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 28440
- Number of Logic Elements/Cells:
- 364032
- Total RAM Bits:
- 15335424
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX365T-2FFG1759I FAQ
1.How can I place an order for XC6VLX365T-2FFG1759I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX365T-2FFG1759I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX365T-2FFG1759I reliable?
The price and inventory of XC6VLX365T-2FFG1759I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX365T-2FFG1759I is usually 5 days.
3.What payment methods are accepted for XC6VLX365T-2FFG1759I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX365T-2FFG1759I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX365T-2FFG1759I?
XC6VLX365T-2FFG1759I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX365T-2FFG1759I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX365T-2FFG1759I?
For technical support, including XC6VLX365T-2FFG1759I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX365T-2FFG1759I requirements.
6.How does Aetrix verify that XC6VLX365T-2FFG1759I is sourced from the original manufacturer or authorized distributors?
All XC6VLX365T-2FFG1759I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX365T-2FFG1759I meets industry standards.
7.What is the process for return or replacement of XC6VLX365T-2FFG1759I?
All XC6VLX365T-2FFG1759I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX365T-2FFG1759I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX365T-2FFG1759I part is unused and in its original packaging.
Return procedure for XC6VLX365T-2FFG1759I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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