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AMD XC6VLX365T-3FF1759C
- Part No.:
- XC6VLX365T-3FF1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX365T-3FF1759C.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,883
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Product details
Overview
XC6VLX365T-3FF1759C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA with 364,800 logic cells, 1,536 DSP48E1 slices, and 24.3 Mb of block RAM. It features 720 user I/Os in a 1759-pin Flip-Chip Fine-Pitch BGA package and operates at -3 speed grade (fastest commercial grade), supporting demanding applications such as high-speed wired communications infrastructure.
For engineers reviewing the XC6VLX365T-3FF1759C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gb/s, and configuration via Master SelectMAP or JTAG.
Technical Context
The XC6VLX365T-3FF1759C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates six 6.6 Gb/s GTP serial transceivers and supports PCI Express® Gen1/Gen2 x8 endpoints.
Configuration is performed through internal configuration access port (ICAP), MultiBoot, or fallback modes using external SPI/BPI flash. The device supports partial reconfiguration and includes built-in system monitoring for on-chip temperature and supply voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 364,800 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| DSP Slices | 1,536 × DSP48E1 - fixed-point arithmetic units supporting 25×18 multiply, 48-bit accumulation, and pre-adder |
| Block RAM | 24.3 Mb - configurable dual-port RAM blocks usable as memory, FIFO, or buffer with byte-write enable |
| Transceivers | 6 × GTP - 6.6 Gb/s serial transceivers compliant with SATA, PCIe Gen1/Gen2, and CPRI protocols |
| I/O Pins | 720 user-configurable I/Os - supports LVCMOS, LVDS, SSTL, HSTL, and differential signaling standards |
| Speed Grade | -3 - fastest commercial speed grade, enabling highest clock frequencies and lowest propagation delay |
| Package | FF1759 - 1759-pin Flip-Chip Fine-Pitch BGA, 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant |
Pinout & Package
XC6VLX365T-3FF1759C is housed in a 1759-ball Flip-Chip Fine-Pitch BGA (FF1759) package with 720 user I/Os, 48 configuration and JTAG pins, 48 power/ground balls per supply domain (VCCINT, VCCAUX, VCCO), and dedicated configuration/reset pins including INIT_B, PROGRAM_B, and DONE.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asynchronous reset that clears configuration memory and initiates reload from external source |
| INIT_B | Active-Low Configuration Status | Open-drain output indicating configuration memory integrity and readiness for loading |
| DONE | Configuration Completion Indicator | Open-drain output asserted high when configuration completes successfully and device enters user mode |
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master SelectMAP or slave serial configuration |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., JTAG, Master SPI, Slave SelectMAP) at power-up |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in field-upgradable systems |
| Integrated System Monitor | On-die ADC measures die temperature and supply voltages (VCCINT, VCCAUX) for real-time thermal and power health monitoring |
| Dedicated PCIe Endpoint Logic | Hard IP supporting PCIe Gen1/Gen2 x8 endpoint operation without consuming fabric resources or requiring external PHY |
| MultiBoot Configuration | Allows up to 32 independent bitstreams stored in external flash, enabling fail-safe firmware updates and hardware versioning |
| Advanced Clock Management | 16 MMCMs and 16 PLLs provide jitter filtering, phase shifting, frequency synthesis, and clock domain crossing support |
Applications
| High-Speed Backplane Interconnect | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Line cards in 10G/40G Ethernet and OTN transport equipment require protocol bridging, packet classification, and SerDes aggregation. IC Role / Device Role / Timing Role: XC6VLX365T-3FF1759C serves as the central packet processing and interface aggregation unit with integrated GTP transceivers and PCIe endpoint. Use Value: 6.6 Gb/s transceivers and 720 I/Os enable direct connection to multiple SFP+ modules and backplane traces without external retimers or bridges. | Use Scenario: CT and MRI scanner front-end subsystems digitize and preprocess multi-channel analog sensor data at >100 MSPS. IC Role / Device Role / Timing Role: XC6VLX365T-3FF1759C implements real-time digital beamforming, FIR filtering, and DDR3 memory controller for raw data buffering. Use Value: 1,536 DSP48E1 slices deliver >2.5 GOPS of fixed-point compute throughput for low-latency image reconstruction pipelines. |
| Avionics Data Concentrator Unit | Test & Measurement High-Frequency Signal Generator |
Use Scenario: ARINC 664 (AFDX) end systems aggregate deterministic traffic from multiple LRUs under strict latency and jitter budgets. IC Role / Device Role / Timing Role: XC6VLX365T-3FF1759C hosts AFDX endpoint logic, time-triggered scheduler, and dual-redundant Ethernet MACs. Use Value: Built-in PCIe Gen2 x8 endpoint and deterministic timing control ensure sub-10 µs end-to-end latency for safety-critical avionics networks. | Use Scenario: Modular PXIe instruments generate calibrated RF waveforms up to 3 GHz using arbitrary waveform synthesis and digital upconversion. IC Role / Device Role / Timing Role: XC6VLX365T-3FF1759C implements DDS engines, interpolation filters, and JESD204B transmitter logic for DAC interfacing. Use Value: 24.3 Mb block RAM provides deep pattern storage for multi-segment waveform playback with zero-gap streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | 16 nm UltraScale+ architecture, 1,182,240 logic cells, higher transceiver count (20× 25.8 Gb/s GTY), no native PCIe Gen2 endpoint hard IP | Better suited for next-gen 100G+ optical transport and AI inference acceleration where process node and bandwidth outweigh legacy interface compatibility | Select XCVU3P-2FFVD1760E only if migrating to 16 nm process, requiring >10 Gb/s serial links, or needing higher logic density; not drop-in compatible |
| XC6VLX240T-3FF1156C | Same Virtex-6 family, smaller footprint (1156-pin BGA), 240,000 logic cells, 1,152 DSP slices, 16.2 Mb block RAM, 4× GTP transceivers | Targeted for cost-optimized mid-range applications like video processing or industrial motion control where full LX365T capacity is unnecessary | Choose XC6VLX240T-3FF1156C for reduced BOM cost and PCB area when design fits within its resource ceiling and I/O count |
Compared with XC6VLX365T-3FF1759C, XCVU3P-2FFVD1760E offers superior bandwidth and logic scale but requires board redesign and new toolchain validation, while XC6VLX240T-3FF1156C retains identical architecture and tooling at lower capacity-making it a viable scaling-down option within the same family.
Availability
XC6VLX365T-3FF1759C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, medical imaging systems, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX365T-3FF1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-6 family was designed for high-performance logic, signal processing, and serial connectivity in wired infrastructure, defense, and scientific instrumentation applications.
FAQ
What is the maximum supported transceiver line rate for XC6VLX365T-3FF1759C?
The XC6VLX365T-3FF1759C integrates six GTP transceivers each supporting a maximum line rate of 6.6 Gb/s. This enables compliance with protocols including PCIe Gen2, SATA II/III, and CPRI Option 3. The actual achievable rate depends on PCB layout quality, reference clock stability, and signal integrity margin.
Does XC6VLX365T-3FF1759C support partial reconfiguration?
Yes, XC6VLX365T-3FF1759C supports partial reconfiguration through its ICAP interface and dedicated configuration logic. This allows runtime swapping of designated logic partitions without resetting the entire device, which is essential for mission-critical systems requiring continuous operation during firmware updates or mode changes.
What configuration modes are supported by XC6VLX365T-3FF1759C?
XC6VLX365T-3FF1759C supports multiple configuration modes including Master SelectMAP, Slave SelectMAP, Serial (SPI flash), BPI (parallel NOR flash), and JTAG. Mode selection is controlled by M0–M2 pins at power-up, and MultiBoot capability allows up to 32 distinct bitstreams to be stored and selected dynamically.
What is the operating temperature range for XC6VLX365T-3FF1759C?
The XC6VLX365T-3FF1759C is rated for commercial operation from 0 °C to +85 °C ambient temperature (case temperature). Its on-chip System Monitor provides real-time die temperature measurement, enabling thermal throttling or alarm triggers in thermally constrained environments.
Is XC6VLX365T-3FF1759C pin-compatible with other Virtex-6 devices?
No, XC6VLX365T-3FF1759C uses the FF1759 package, which is unique to the LX365T and certain SX/LX550T variants. Pinouts differ significantly across Virtex-6 densities and speed grades-even within the same package variant-so direct pin compatibility cannot be assumed without verifying the specific device's pin map and bank voltage constraints.
XC6VLX365T-3FF1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 28440
- Number of Logic Elements/Cells:
- 364032
- Total RAM Bits:
- 15335424
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX365T-3FF1759C FAQ
1.How can I place an order for XC6VLX365T-3FF1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX365T-3FF1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX365T-3FF1759C reliable?
The price and inventory of XC6VLX365T-3FF1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX365T-3FF1759C is usually 5 days.
3.What payment methods are accepted for XC6VLX365T-3FF1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX365T-3FF1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX365T-3FF1759C?
XC6VLX365T-3FF1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX365T-3FF1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX365T-3FF1759C?
For technical support, including XC6VLX365T-3FF1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX365T-3FF1759C requirements.
6.How does Aetrix verify that XC6VLX365T-3FF1759C is sourced from the original manufacturer or authorized distributors?
All XC6VLX365T-3FF1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX365T-3FF1759C meets industry standards.
7.What is the process for return or replacement of XC6VLX365T-3FF1759C?
All XC6VLX365T-3FF1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX365T-3FF1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX365T-3FF1759C part is unused and in its original packaging.
Return procedure for XC6VLX365T-3FF1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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