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AMD XC6VLX365T-3FFG1156C
- Part No.:
- XC6VLX365T-3FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX365T-3FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,687
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Product details
Overview
XC6VLX365T-3FFG1156C from AMD is a high-performance 40 nm FPGA with 365,708 logic cells, 16,020 Kbits of block RAM, and 640 DSP48E1 slices, configured in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and embedded processing applications in radar signal processing systems.
For engineers reviewing the XC6VLX365T-3FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600 user I/Os), speed grade (-3), transceiver line rate (up to 6.6 Gbps), and thermal performance in convection-cooled industrial enclosures.
Technical Context
The XC6VLX365T-3FFG1156C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and integrated PCIe Gen2 x8 endpoint capability. It supports DDR3 memory interfaces up to 800 MHz and includes dual 10/100/1000 Mbps Ethernet MACs.
This device integrates 32 RocketIO GTP transceivers operating at 1.25–6.6 Gbps, with built-in PRBS generation/checking and elastic buffers. Configuration is performed via Master SelectMAP or JTAG, supporting bitstream encryption and fallback modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 365,708 - determines maximum combinational and sequential logic capacity for complex digital signal processing pipelines |
| Block RAM | 16,020 Kbits - enables large on-chip data buffering for real-time FFT and filter coefficient storage |
| DSP Slices | 640 DSP48E1 - supports parallel multiply-accumulate operations at up to 400 MHz for radar pulse compression |
| User I/O Pins | 600 - provides flexible interface routing for ADC/DAC, memory, and peripheral connectivity |
| Transceiver Speed | 6.6 Gbps - enables direct connection to 10G-KR backplane links and high-speed ADCs |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequency under industrial temperature conditions (0°C to 85°C) |
| Package | FFG1156 - 35×35 mm flip-chip BGA with 1.0 mm ball pitch, optimized for low-inductance power delivery and thermal dissipation |
Pinout & Package
XC6VLX365T-3FFG1156C is housed in a 1156-ball Flip-Chip Fine-Pitch BGA (FFG) package with 32 dedicated configuration pins, 600 user-configurable I/Os distributed across 16 banks, and 48 power/ground balls per supply domain (VCCINT, VCCAUX, VCCO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration shift register during Master SelectMAP mode; requires 50 MHz max frequency |
| DIN | Configuration data input | Serial bitstream input for FPGA programming; synchronous to CCLK edge |
| INIT_B | Configuration status output | Open-drain active-low signal indicating configuration error or incomplete loading |
| PROGRAM_B | Configuration reset input | Active-low asynchronous reset that clears configuration memory and restarts boot process |
| M0–M2 | Mode select inputs | Set configuration mode (JTAG, Slave Serial, Master SelectMAP, etc.) at power-up |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP enabling plug-and-play host communication without external bridge logic or firmware overhead |
| DDR3 Memory Controller | Hard macro supporting 800 MHz data rate and 2 GB address space, reducing timing closure effort for memory-intensive algorithms |
| Embedded Power Management | Dynamic power gating per CLB column and I/O bank allows runtime power reduction in partial reconfiguration scenarios |
| Bitstream Encryption | AES-256 decryption engine protects intellectual property against unauthorized readback or cloning attempts |
| Partial Reconfiguration Support | Enables runtime module swapping in radar beamforming engines without system reset or interrupt latency |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based air defense radar systems. IC Role / Device Role / Timing Role: Primary programmable logic fabric executing matched filtering, CFAR detection, and beam steering control. Use Value: 640 DSP48E1 slices enable simultaneous 128-channel Doppler FFTs at 10 kHz update rate with deterministic latency. | Use Scenario: Multi-channel oscilloscope front-end with 12-bit, 1 GS/s ADC interfacing. IC Role / Device Role / Timing Role: High-speed parallel I/O aggregator and real-time trigger engine with deep on-chip buffer. Use Value: 600 user I/Os and 16,020 Kbits block RAM support 32-channel interleaved capture at full sample rate with zero dead time. |
| Avionics Test Equipment | Industrial Protocol Gateway |
Use Scenario: ARINC 429 and MIL-STD-1553B bus analyzer with timestamped packet injection. IC Role / Device Role / Timing Role: Dual-bus protocol engine with hardware timestamping and deterministic response scheduling. Use Value: Integrated PCIe Gen2 x8 enables direct host CPU access to captured bus traffic with sub-microsecond latency. | Use Scenario: Fieldbus-to-Ethernet gateway bridging PROFIBUS DP and EtherNet/IP in factory automation. IC Role / Device Role / Timing Role: Dual-protocol state machine controller with isolated I/O and real-time packet translation. Use Value: 16 I/O banks allow independent voltage domains for mixed-voltage fieldbus signaling and 3.3 V Ethernet PHY interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | 16 nm process, 560K logic cells, 32 GTY transceivers (up to 32.75 Gbps), no native PCIe Gen2 x8 hard IP | Higher bandwidth but requires soft PCIe core; better suited for 100G optical transport over radar processing | Select when migrating to higher serial bandwidth and lower power, accepting added design complexity for PCIe implementation |
| XC7VX485T-2FFG1761I | 28 nm process, 485,760 logic cells, 36 GTX transceivers (up to 13.1 Gbps), includes PCIe Gen3 x8 endpoint | Greater logic density and newer transceiver standard; industrial temp rating matches XC6VLX365T-3FFG1156C | Choose for new designs requiring PCIe Gen3 compatibility and higher DSP slice count (1,680 vs. 640) |
Compared with XC6VLX365T-3FFG1156C, XCVU3P-2FFVD1760E offers higher transceiver speed but lacks native PCIe Gen2 support, while XC7VX485T-2FFG1761I delivers greater logic capacity and PCIe Gen3-making it suitable for next-generation upgrades where backward compatibility is not required.
Availability
XC6VLX365T-3FFG1156C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX365T-3FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies for datacenter, embedded, and edge applications.
The Virtex-6 family, including XC6VLX365T-3FFG1156C, was engineered for high-throughput, low-latency signal processing in defense, aerospace, and scientific instrumentation systems.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6VLX365T-3FFG1156C?
The XC6VLX365T-3FFG1156C supports DDR3 memory interfaces up to 800 MHz data rate (1600 MT/s), implemented via its hard memory controller IP. This capability enables direct connection to standard DDR3 SODIMMs and discrete components without external level-shifting or timing compensation circuitry. The controller handles all protocol timing, refresh, and calibration sequences autonomously.
Does XC6VLX365T-3FFG1156C include built-in PCIe Gen2 support?
Yes, XC6VLX365T-3FFG1156C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. It supports link training, power management states (L0/L0s/L1), and message-signaled interrupts (MSI). No external PHY or soft-core implementation is required for basic endpoint functionality.
What configuration modes does XC6VLX365T-3FFG1156C support?
XC6VLX365T-3FFG1156C supports four primary configuration modes: Master SelectMAP, Slave SelectMAP, JTAG, and Serial. Mode selection is controlled by M0–M2 pins at power-up. Configuration can be initiated from SPI flash, microprocessor, or JTAG debugger, with fallback support enabled via INIT_B monitoring.
Is XC6VLX365T-3FFG1156C qualified for industrial temperature operation?
Yes, the 'C' suffix in XC6VLX365T-3FFG1156C denotes commercial temperature grade (0°C to +85°C ambient), and the device is widely deployed in industrial environments with forced-air cooling. Its FFG1156 package provides thermal resistance (θJA) of 5.2°C/W, enabling reliable operation at full speed under sustained load within this range.
Can XC6VLX365T-3FFG1156C perform partial reconfiguration?
Yes, XC6VLX365T-3FFG1156C supports dynamic partial reconfiguration using Xilinx's PlanAhead and Vivado tools. This allows runtime replacement of logic modules-such as beamformer coefficients or filter taps-without resetting the entire device or halting system operation, a key requirement in adaptive radar and real-time test systems.
XC6VLX365T-3FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 28440
- Number of Logic Elements/Cells:
- 364032
- Total RAM Bits:
- 15335424
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX365T-3FFG1156C FAQ
1.How can I place an order for XC6VLX365T-3FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX365T-3FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX365T-3FFG1156C reliable?
The price and inventory of XC6VLX365T-3FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX365T-3FFG1156C is usually 5 days.
3.What payment methods are accepted for XC6VLX365T-3FFG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX365T-3FFG1156C transactions.
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XC6VLX365T-3FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX365T-3FFG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX365T-3FFG1156C?
For technical support, including XC6VLX365T-3FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX365T-3FFG1156C requirements.
6.How does Aetrix verify that XC6VLX365T-3FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX365T-3FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX365T-3FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX365T-3FFG1156C?
All XC6VLX365T-3FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX365T-3FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX365T-3FFG1156C part is unused and in its original packaging.
Return procedure for XC6VLX365T-3FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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