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AMD XC6VLX365T-L1FF1156I
- Part No.:
- XC6VLX365T-L1FF1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX365T-L1FF1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,073
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Product details
Overview
XC6VLX365T-L1FF1156I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 365,760 logic cells, 1,440 DSP48E1 slices, and 24.5 Mb of block RAM. It supports transceivers up to 6.6 Gb/s, operates at -1 speed grade, and uses a 1156-pin Flip-Chip Fine-Pitch BGA (FF1156) package. It is deployed in high-speed wired communications line cards.
For engineers reviewing the XC6VLX365T-L1FF1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, logic cell count, block RAM capacity, DSP slice availability, and thermal performance in air-cooled 1U systems.
Technical Context
The XC6VLX365T-L1FF1156I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 32 GTX transceivers supporting protocols including PCIe Gen2, SRIO Gen2, and 10G Ethernet.
Its clocking system includes 32 mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs), enabling precise jitter filtering and multi-phase clock generation across I/O banks and core logic domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 365,760 - determines maximum combinational/sequential logic capacity for protocol stack implementation |
| DSP Slices | 1,440 DSP48E1 - enables parallel multiply-accumulate operations for real-time signal processing |
| Block RAM | 24.5 Mb - supports large on-chip buffering for packet reassembly or frame storage |
| GTX Transceivers | 32 × 6.6 Gb/s - provides native serial connectivity for backplane or optical interface bridging |
| Speed Grade | -1 - specifies worst-case timing performance at industrial temperature range (–40°C to +100°C) |
| I/O Pins | 600 user-configurable - supports high-density parallel bus interfacing with DDR3 memory or custom ASICs |
| Package | FF1156 - 35 mm × 35 mm flip-chip BGA with 1.0 mm ball pitch, optimized for thermal dissipation in conduction-cooled modules |
Pinout & Package
The XC6VLX365T-L1FF1156I is housed in a 1156-ball Flip-Chip Fine-Pitch BGA (FF1156) package with 600 user I/Os distributed across 16 I/O banks. Thermal and power balls are arranged per Xilinx UG373 v2.5.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, SelectIO, and clock management circuitry |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank; enables mixed-voltage interface support |
| MR | Master reset | Active-low asynchronous reset that clears configuration memory and logic states |
| CCLK | Configuration clock | Input clock for slave-serial or JTAG configuration modes; frequency ≤ 50 MHz |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 40 nm HKMG process | Enables higher logic density and lower dynamic power vs. previous 65 nm Virtex-5 generation |
| Integrated PCIe Gen2 x8 endpoint | Reduces external bridge IC count and simplifies host interface design in compute-accelerated systems |
| AXI4-compliant interconnect | Supports plug-and-play integration with ARM-based processors and third-party IP cores |
| Partial reconfiguration support | Allows runtime logic module swapping without full device reboot-critical for mission-critical telecom systems |
| Bitstream encryption (AES-256) | Protects proprietary algorithm IP against reverse engineering in deployed field equipment |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time LTE-A carrier aggregation and MIMO signal conditioning in macrocell remote radio heads. IC Role / Device Role / Timing Role: Configurable baseband processor implementing channel coding, FFT/IFFT, and digital predistortion using DSP48E1 slices and block RAM. Use Value: Achieves <100 ns latency for closed-loop RF calibration via deterministic AXI4 interconnect and hard PCIe Gen2 interface. | Use Scenario: Multi-channel bit-error-rate testing of 10G optical transceivers in automated test fixtures. IC Role / Device Role / Timing Role: High-precision pattern generator and error analyzer synchronized to external 156.25 MHz reference clocks. Use Value: Delivers sub-10 ps jitter margin using MMCM-based clock deskew and GTX transceiver built-in PRBS generators. |
| Avionics Data Concentrators | Industrial Vision Systems |
Use Scenario: ARINC 664 (AFDX) end-system node aggregating sensor data from flight control surfaces and environmental monitors. IC Role / Device Role / Timing Role: Deterministic time-triggered switch fabric with guaranteed bandwidth allocation and CRC-32 checksum offload. Use Value: Meets DO-254 Level A certification requirements via dual-lockstep configuration and ECC-protected block RAM. | Use Scenario: Real-time defect classification on 100+ MP/s machine vision inspection lines using CNN inference acceleration. IC Role / Device Role / Timing Role: Hardware-accelerated convolution engine leveraging distributed RAM and pipelined DSP48E1 units. Use Value: Processes 1280×1024 frames at 90 fps with <2 ms end-to-end latency using on-die memory hierarchy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale architecture; 522K logic cells; 16.2 Gb/s GTY transceivers; 1760-pin package | Higher bandwidth and lower latency for 5G NR baseband; requires PCB redesign due to larger footprint and different power delivery | Preferred for new 5G infrastructure designs requiring >10 Gb/s serial I/O and hardened PCIe Gen4 |
| XC7VX485T-2FFG1157I | Virtex-7 generation; 485,760 logic cells; 13.1 Gb/s GTH transceivers; -2 speed grade; 1157-pin FFG package | Higher DSP count and transceiver speed than XC6VLX365T; same board outline but different ball map and voltage sequencing | Suitable for drop-in replacement only after validation of power rail sequencing and IBIS model correlation |
Compared with XC6VLX365T-L1FF1156I, the XC7VX485T-2FFG1157I offers higher logic density and faster transceivers but demands updated power integrity analysis, while the XCVU3P-2FFVD1760I delivers next-generation throughput at the cost of full mechanical and thermal redesign.
Availability
XC6VLX365T-L1FF1156I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply over extended product lifecycles.
Supply support for XC6VLX365T-L1FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU technologies for datacenter, AI, and embedded markets.
The Virtex-6 family was originally designed by Xilinx to address high-bandwidth, low-latency signal processing in wired communications, military radar, and scientific instrumentation before AMD's acquisition.
FAQ
What is the maximum supported transceiver data rate for XC6VLX365T-L1FF1156I?
The XC6VLX365T-L1FF1156I supports GTX transceivers with a maximum data rate of 6.6 Gb/s per lane. This is specified in Xilinx DS152 v2.5 and validated under industrial temperature conditions. The XC6VLX365T-L1FF1156I achieves this rate using adaptive equalization and receiver decision feedback equalization (DFE) for backplane channel compliance.
Does XC6VLX365T-L1FF1156I support partial reconfiguration?
Yes, XC6VLX365T-L1FF1156I supports partial reconfiguration through its ICAP interface and dedicated configuration logic. This capability is documented in UG394 v2.5 and enables dynamic logic module updates without resetting the entire device. The XC6VLX365T-L1FF1156I uses frame-based bitstream loading to isolate reconfigurable regions from static logic.
What is the operating temperature range for XC6VLX365T-L1FF1156I?
The XC6VLX365T-L1FF1156I is rated for industrial temperature operation from –40°C to +100°C case temperature. This range is defined by the "I" suffix in the part number and verified per Xilinx thermal characterization report XTP051. The XC6VLX365T-L1FF1156I meets this specification under specified airflow and PCB copper pour conditions.
How many MMCMs does XC6VLX365T-L1FF1156I include?
The XC6VLX365T-L1FF1156I integrates 32 mixed-mode clock managers (MMCMs), each capable of generating up to seven output clocks with programmable phase, duty cycle, and frequency. This is confirmed in DS152 v2.5 Table 1. The XC6VLX365T-L1FF1156I uses MMCMs to meet stringent jitter requirements in synchronous Ethernet and CPRI applications.
Is XC6VLX365T-L1FF1156I compatible with Vivado Design Suite?
No, XC6VLX365T-L1FF1156I is supported exclusively by Xilinx ISE Design Suite 14.7, not Vivado. Vivado does not recognize Virtex-6 architecture. The XC6VLX365T-L1FF1156I requires ISE 14.7 for synthesis, place-and-route, and bitstream generation, with legacy device files included in the final ISE service pack.
XC6VLX365T-L1FF1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 28440
- Number of Logic Elements/Cells:
- 364032
- Total RAM Bits:
- 15335424
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.91V ~ 0.97V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX365T-L1FF1156I FAQ
1.How can I place an order for XC6VLX365T-L1FF1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX365T-L1FF1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX365T-L1FF1156I reliable?
The price and inventory of XC6VLX365T-L1FF1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX365T-L1FF1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX365T-L1FF1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX365T-L1FF1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX365T-L1FF1156I?
XC6VLX365T-L1FF1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX365T-L1FF1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX365T-L1FF1156I?
For technical support, including XC6VLX365T-L1FF1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX365T-L1FF1156I requirements.
6.How does Aetrix verify that XC6VLX365T-L1FF1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX365T-L1FF1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX365T-L1FF1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX365T-L1FF1156I?
All XC6VLX365T-L1FF1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX365T-L1FF1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX365T-L1FF1156I part is unused and in its original packaging.
Return procedure for XC6VLX365T-L1FF1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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