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AMD XC6VLX550T-1FF1759I
- Part No.:
- XC6VLX550T-1FF1759I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX550T-1FF1759I.pdf
- Description:
- IC FPGA 840 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,735
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Product details
Overview
XC6VLX550T-1FF1759I from AMD (formerly Xilinx) is a high-capacity Virtex-6 FPGA featuring 551,680 logic cells, 28,224 Kbits of block RAM, and 1,128 DSP48E1 slices. It operates at -1 speed grade with I-grade temperature rating (–40°C to +100°C) and is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1759) package. It targets high-performance digital signal processing in radar and broadband wireless infrastructure.
For engineers reviewing the XC6VLX550T-1FF1759I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, DSP slice count, I/O voltage support (1.2V/1.5V/1.8V/2.5V/3.3V), transceiver line rate (up to 6.6 Gbps), and thermal performance in convection-cooled systems.
Technical Context
The XC6VLX550T-1FF1759I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated 6.6 Gbps multi-gigabit transceivers. It supports PCI Express Gen2 x8, Serial RapidIO, and CPRI protocols via its GTx transceivers.
Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption and SEU mitigation features enabled. The device uses 40 nm bulk CMOS process technology and supports partial reconfiguration for dynamic function swapping without full system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 551,680 - determines maximum combinational and sequential logic capacity for complex state machines and datapaths |
| Block RAM | 28,224 Kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory latency |
| DSP Slices | 1,128 DSP48E1 - enables parallel multiply-accumulate operations for FIR filters, FFT engines, and beamforming |
| Transceiver Line Rate | 6.6 Gbps - supports CPRI Option 3, OBSAI, and 10G Ethernet physical layer interfaces |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, Differential Signaling - allows direct interfacing with ADCs, DACs, memory, and FPGAs across mixed-voltage systems |
| Speed Grade | -1 - guarantees timing closure at specified maximum clock frequencies under industrial temperature conditions |
| Temperature Grade | I-grade (–40°C to +100°C) - qualified for operation in base station cabinets and outdoor radio units without active cooling |
Pinout & Package
The XC6VLX550T-1FF1759I is packaged in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1759) with 35 × 35 mm body size, 1.0 mm ball pitch, and center power/ground array for low-inductance supply delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during master mode startup; must be stable before INIT_B deassertion |
| INIT_B | Configuration Status Output | Open-drain signal indicating configuration memory readiness; pulled high externally during normal operation |
| DONE | Configuration Completion Indicator | Signals successful bitstream loading; used to enable downstream logic after configuration lock |
| PROGRAM_B | Global Reset Input | Asynchronous active-low signal that clears configuration memory and restarts boot sequence |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock Input | Differential pair feeding GTX transceiver PLL; requires <1.5 ps RMS jitter for 6.6 Gbps operation |
| VCCINT | Core Supply Voltage | 1.0V ±3% supply powering CLBs, interconnect, and configuration logic; requires low-noise regulation |
| VCCAUX | Auxiliary Supply Voltage | 2.5V ±3% supply for configuration, clocking, and transceiver analog circuitry |
| VCCO_0 | I/O Bank Supply | Programmable voltage (1.2V–3.3V) per bank enabling mixed-voltage interface design |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime swapping of logic partitions without resetting the entire device, critical for adaptive radio and protocol agility |
| SEU Mitigation Logic | Includes built-in error detection and correction for configuration memory, meeting DO-254 and IEC 61508 functional safety requirements |
| Integrated PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4/x8 link widths with end-to-end data integrity and power management |
| Multi-Gigabit Transceivers | 64 GTX transceivers with programmable pre-emphasis and receiver equalization for channel loss compensation up to 25 dB |
| Advanced Clock Management | Eight Mixed-Mode Clock Managers (MMCM) and Digital Clock Managers (DCM) for sub-100 fs jitter synthesis and phase alignment |
Applications
| Radar Signal Processing | Broadband Wireless Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: Primary compute engine executing beamforming, matched filtering, and FFT-based spectral analysis with deterministic latency. Use Value: 1,128 DSP48E1 slices deliver >2.2 TMAC/s throughput while maintaining sub-microsecond latency for closed-loop control loops. | Use Scenario: Multi-carrier, multi-standard (LTE, 5G NR, WiMAX) baseband processing in macrocell and massive MIMO remote radio heads. IC Role / Device Role / Timing Role: Baseband processor handling channel coding, modulation, and digital up/down conversion across 16+ RF chains. Use Value: 64 GTX transceivers with 6.6 Gbps line rate support CPRI fronthaul and eCPRI over single-lane optical links. |
| Medical Imaging Acceleration | High-Performance Test Equipment |
Use Scenario: Real-time reconstruction of MRI and CT scan data using iterative algorithms and back-projection kernels. IC Role / Device Role / Timing Role: Co-processor offloading compute-intensive kernels from host CPU, synchronized via PCIe Gen2 x8 interface. Use Value: 551,680 logic cells enable parallel execution of 32+ reconstruction pipelines with on-chip RAM buffering to minimize DDR latency. | Use Scenario: High-speed digital pattern generation and analysis in automated test equipment for ASIC and SoC validation. IC Role / Device Role / Timing Role: Programmable stimulus generator and response analyzer with sub-nanosecond timing resolution and deep capture memory. Use Value: I/O banks supporting 1.2V–3.3V standards allow direct connection to DUTs across multiple voltage domains without level-shifter components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2.5× higher logic density (1,182K LUTs), 16.3 Gbps transceivers, but larger 2104-pin package and higher power | Targets next-gen 5G mmWave and AI inference acceleration where bandwidth exceeds Virtex-6 capability | Select when migrating to higher serial bandwidth or requiring hardened 100G Ethernet MAC cores |
| XC7VX690T-2FFG1930I | Virtex-7 architecture, 690K logic cells, 13.1 Gbps transceivers, same FFG1930 package footprint but incompatible pinout | Suitable for brownfield upgrades requiring higher DSP throughput and lower latency than XC6VLX550T-1FF1759I | Choose for new designs needing improved power efficiency per DSP operation and support for DDR4 memory interfaces |
Compared with XC6VLX550T-1FF1759I, the XC7VX690T-2FFG1930I delivers 25% more DSP throughput at 30% lower power per MAC, while the XCVU9P-2FLGA2104I enables 2× higher serial bandwidth but requires PCB redesign due to non-compatible packaging and voltage rail changes.
Availability
XC6VLX550T-1FF1759I is available at Aetrix Electronics and suitable for radar signal processing, broadband wireless infrastructure, and medical imaging acceleration requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX550T-1FF1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering high-performance computing, graphics, and adaptive SoC solutions, with heritage in FPGA innovation through its acquisition of Xilinx.
The Virtex-6 family was designed for high-throughput, low-latency digital signal processing in communications infrastructure, defense electronics, and scientific instrumentation where deterministic timing and I/O flexibility are critical.
FAQ
What is the maximum supported transceiver line rate for XC6VLX550T-1FF1759I?
The XC6VLX550T-1FF1759I supports a maximum transceiver line rate of 6.6 Gbps using its GTX transceivers. This enables compliance with CPRI Option 3, Serial RapidIO Gen2, and 10GBASE-R Ethernet physical layers. Operation at this rate requires proper reference clock jitter specification (<1.5 ps RMS) and board-level signal integrity design per UG371.
Does XC6VLX550T-1FF1759I support partial reconfiguration?
Yes, XC6VLX550T-1FF1759I supports partial reconfiguration through its ICAP interface and dedicated configuration logic. This allows dynamic swapping of logic modules-such as modulator/demodulator blocks in wireless systems-without resetting the entire device or interrupting active I/O channels.
What I/O voltage standards are supported by XC6VLX550T-1FF1759I?
XC6VLX550T-1FF1759I supports LVCMOS (1.2V/1.5V/1.8V/2.5V/3.3V), LVDS, BLVDS, RSDS, Differential SSTL, and HSTL across its 600+ user I/O pins. Each I/O bank is independently powered, enabling mixed-voltage interface design without external level shifters.
What is the operating temperature range for XC6VLX550T-1FF1759I?
XC6VLX550T-1FF1759I is rated for industrial temperature operation from –40°C to +100°C (I-grade). This qualification covers junction temperature limits under specified airflow and power dissipation, making it suitable for sealed outdoor radio units and avionics enclosures without forced cooling.
How many block RAM resources does XC6VLX550T-1FF1759I provide?
XC6VLX550T-1FF1759I provides 28,224 Kbits of total block RAM, implemented as 720 dual-port 36-Kbit RAMB36E1 primitives. These can be configured as true dual-port memory, FIFO, or shift register, and support byte-write enable and parity generation for safety-critical applications.
XC6VLX550T-1FF1759I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 42960
- Number of Logic Elements/Cells:
- 549888
- Total RAM Bits:
- 23298048
- Number of I/O:
- 840
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX550T-1FF1759I FAQ
1.How can I place an order for XC6VLX550T-1FF1759I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX550T-1FF1759I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX550T-1FF1759I reliable?
The price and inventory of XC6VLX550T-1FF1759I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX550T-1FF1759I is usually 5 days.
3.What payment methods are accepted for XC6VLX550T-1FF1759I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX550T-1FF1759I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX550T-1FF1759I?
XC6VLX550T-1FF1759I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX550T-1FF1759I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX550T-1FF1759I?
For technical support, including XC6VLX550T-1FF1759I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX550T-1FF1759I requirements.
6.How does Aetrix verify that XC6VLX550T-1FF1759I is sourced from the original manufacturer or authorized distributors?
All XC6VLX550T-1FF1759I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX550T-1FF1759I meets industry standards.
7.What is the process for return or replacement of XC6VLX550T-1FF1759I?
All XC6VLX550T-1FF1759I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX550T-1FF1759I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX550T-1FF1759I part is unused and in its original packaging.
Return procedure for XC6VLX550T-1FF1759I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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