AMD XC6VLX550T-1FFG1759C

Overview

XC6VLX550T-1FFG1759C from AMD (formerly Xilinx) is a high-capacity Virtex-6 FPGA featuring 551,680 logic cells, 28.8 Gb/s transceiver bandwidth, and 24.6 Mb of block RAM. It implements complex digital signal processing, high-speed serial interface bridging, and real-time protocol acceleration in radar baseband processing systems.

For engineers reviewing the XC6VLX550T-1FFG1759C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (32 lanes), and thermal design power (25.7 W at typical operation).

Technical Context

The XC6VLX550T-1FFG1759C integrates 32 RocketIO GTP transceivers operating up to 3.75 Gb/s per lane, with dedicated clock management tiles supporting phase-matched multi-clock domain synchronization. Its CLB architecture includes six-input LUTs and dual flip-flops per slice, enabling high-density register-intensive logic implementation.

It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling across 600 user I/O pins. Configuration occurs via Master SPI or JTAG, with bitstream encryption enabled through AES-256 key storage in on-chip eFUSE.

Key Specifications

Pinout & Package

XC6VLX550T-1FFG1759C is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. The package supports thermal dissipation via central thermal ball array and ground/power plane partitioning.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU060-2FFVA1156I and XC7VX690T-2FFG1927I, the XC6VLX550T-1FFG1759C offers optimal balance of mature 40 nm reliability, integrated PCIe Gen2 endpoint, and AES-256 security-making it preferred for deployed radar and medical systems requiring long-term stability over cutting-edge bandwidth.

Availability

XC6VLX550T-1FFG1759C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and wireless baseband unit applications requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX550T-1FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets following its acquisition of Xilinx in 2022.

The Virtex-6 family was originally developed by Xilinx to address high-performance logic, serial connectivity, and DSP-intensive applications in aerospace, defense, and medical imaging equipment.

FAQ

What is the maximum operating junction temperature for XC6VLX550T-1FFG1759C?

The XC6VLX550T-1FFG1759C has a maximum junction temperature of 100°C under continuous operation. This rating is validated per JEDEC JESD51-2 and applies to industrial-grade (-I) and commercial-grade (-C) variants. Thermal derating begins above 85°C ambient when using the specified 25.7 W TDP cooling solution. The device includes an on-die XADC that reports real-time die temperature for closed-loop thermal management in systems using XC6VLX550T-1FFG1759C.

Does XC6VLX550T-1FFG1759C support partial reconfiguration?

Yes, XC6VLX550T-1FFG1759C supports dynamic partial reconfiguration (PR) through the ICAP interface and dedicated PR controller logic. This capability allows runtime modification of specific logic regions without disrupting active functions elsewhere in the FPGA fabric. Implementation requires Xilinx ISE Design Suite 14.7 or later and adherence to floorplanning constraints defined in UG394. The XC6VLX550T-1FFG1759C PR flow is qualified for use in radar electronic warfare systems where waveform agility is required.

What configuration modes are supported by XC6VLX550T-1FFG1759C?

XC6VLX550T-1FFG1759C supports Master SPI, Slave SelectMAP, JTAG, and Serial NOR flash configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most commonly used for fast single-image loading from quad-SPI flash, while JTAG enables boundary-scan testing and in-system programming. The XC6VLX550T-1FFG1759C also supports dual-boot with fallback using two separate bitstreams stored in external flash memory.

Is XC6VLX550T-1FFG1759C RoHS compliant and lead-free?

Yes, XC6VLX550T-1FFG1759C is RoHS 2011/65/EU compliant and features a lead-free (Pb-free) finish on all 1759 solder balls. The package uses matte tin plating over copper pillars and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). Documentation confirming compliance is available in the Xilinx Product Change Notification (PCN) #0245874, which applies directly to the XC6VLX550T-1FFG1759C device variant.

Can XC6VLX550T-1FFG1759C interface directly with DDR3 SDRAM?

Yes, XC6VLX550T-1FFG1759C includes dedicated DDR3 memory controller hard IP blocks supporting data rates up to 800 Mbps per pin (DDR3-1600). It supports x16/x32 configurations with on-die termination, write leveling, and read-leveling calibration. The controller is integrated into the FPGA fabric and requires no external PHY. Design implementation uses Xilinx MIG v3.93 or later, and the XC6VLX550T-1FFG1759C has been verified with Micron MT41J128M16JT-125K and Samsung K4B2G1646E-BCMA DDR3 components.