AMD XC6VLX550T-1FFG1759I

Overview

XC6VLX550T-1FFG1759I from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 551,680 logic cells, 24.8 Mb of block RAM, and 2,520 DSP48E1 slices. It supports transceivers up to 6.6 Gb/s and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-end radar signal processing systems requiring deterministic low-latency data path implementation.

For engineers reviewing the XC6VLX550T-1FFG1759I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (32), I/O standard support (LVDS, SSTL, HSTL), thermal design power (25.2 W typical), and configuration interface (SPIx4, SelectMAP).

Technical Context

The XC6VLX550T-1FFG1759I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and high-speed serial transceivers. It integrates 32 GTX transceivers with built-in PCS/PMA layers supporting protocols including PCIe Gen2, SRIO, and CPRI.

Configuration is performed via Master SPI or SelectMAP mode using external flash or processor. The device supports partial reconfiguration and includes hardened clock management tiles (CMTs) with DCMs and PLLs for jitter reduction and frequency synthesis.

Key Specifications

Pinout & Package

XC6VLX550T-1FFG1759I is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch and 40×40 array footprint. The package supports controlled impedance routing and thermal dissipation via central thermal ball array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC6VLX550T-1FFG1759I, the XC6VLX760T-1FFG1759I offers more logic capacity in identical packaging, while the XCVU3P-2FFVD1760I delivers higher serial bandwidth and architectural efficiency at the cost of board-level redesign and toolchain migration.

Availability

XC6VLX550T-1FFG1759I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging subsystems, avionics data concentrators, and high-speed automated test equipment requiring stable component supply over extended production lifecycles.

Supply support for XC6VLX550T-1FFG1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, aerospace, and industrial applications.

The Virtex-6 family was originally designed by Xilinx for high-bandwidth, high-compute-density applications in wired infrastructure, defense radar, and scientific instrumentation where deterministic latency and mixed-signal integration are critical.

FAQ

What is the maximum supported transceiver data rate for XC6VLX550T-1FFG1759I?

The XC6VLX550T-1FFG1759I supports GTX transceivers with a maximum data rate of 6.6 Gb/s per lane. This specification is validated across the full industrial temperature range and applies to all 32 transceiver channels. The XC6VLX550T-1FFG1759I achieves this performance using its integrated PMA and PCS layers without requiring external signal conditioning components.

Does XC6VLX550T-1FFG1759I support partial reconfiguration?

Yes, the XC6VLX550T-1FFG1759I natively supports partial reconfiguration through its configuration logic interface and frame-based bitstream architecture. This capability allows runtime modification of designated logic regions while maintaining operation of the rest of the design. The XC6VLX550T-1FFG1759I requires use of Xilinx ISE Design Suite 14.7 or later with appropriate license to implement and verify partial reconfiguration flows.

What configuration modes are supported by XC6VLX550T-1FFG1759I?

The XC6VLX550T-1FFG1759I supports Master SPI, Slave SPI, SelectMAP, and JTAG configuration modes. Master SPI is commonly used with quad-SPI flash devices for single-image boot, while SelectMAP enables high-speed parallel loading from microprocessors. The XC6VLX550T-1FFG1759I does not support BPI or serial PROM modes due to internal configuration controller limitations.

What is the thermal design power (TDP) of XC6VLX550T-1FFG1759I under typical operating conditions?

The XC6VLX550T-1FFG1759I has a typical thermal design power of 25.2 W when operating at maximum logic utilization and transceiver activity under industrial temperature conditions. This value is derived from Xilinx UG372 v2.5 and assumes default I/O standards and clock frequencies. Actual power consumption of the XC6VLX550T-1FFG1759I varies based on design-specific resource usage and voltage scaling settings.

Is XC6VLX550T-1FFG1759I qualified for automotive applications?

No, the XC6VLX550T-1FFG1759I is rated for industrial temperature range (-40°C to +100°C) but is not AEC-Q100 qualified or packaged in automotive-grade flow. It lacks automotive-specific reliability testing, failure rate reporting, and enhanced ESD protection required for passenger vehicle ECUs. For automotive use cases, designers should consider AMD/Xilinx Automotive-certified Virtex-7 or Versal derivatives instead of the XC6VLX550T-1FFG1759I.