AMD XC6VLX550T-2FF1759C

Overview

XC6VLX550T-2FF1759C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 551,680 logic cells, 24.3 Mb of block RAM, and 2,520 DSP48E1 slices. It operates at -2 speed grade with 1.2 V core voltage and supports transceivers up to 6.6 Gb/s. It is used in high-end radar signal processing systems requiring deterministic low-latency data path implementation.

For engineers reviewing the XC6VLX550T-2FF1759C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), transceiver lane count (32 lanes), thermal design power (29.5 W typical), and support for PCIe Gen2 x8 endpoint configuration.

Technical Context

The XC6VLX550T-2FF1759C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 32 GTP transceivers compliant with SATA, SRIO, and CPRI protocols, each supporting 600 Mb/s to 6.6 Gb/s data rates.

It features SelectIO technology supporting LVDS, SSTL, HSTL, and differential signaling standards across 720 user-configurable I/O pins. The device includes hardened PCI Express v2.0 endpoint logic, 10/100/1000 Ethernet MAC blocks, and clock management tiles with MMCM and PLL resources.

Key Specifications

Pinout & Package

The XC6VLX550T-2FF1759C is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal and mechanical data comply with IPC/JEDEC J-STD-020D moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC6VLX550T-2FF1759C, the XCVU9P offers 3× more logic and 5× higher transceiver bandwidth but requires new PCB design and toolchain migration; the XC7VX690T delivers 25% more logic and Gen3 PCIe support while retaining similar thermal profile and pin-compatible board reuse potential.

Availability

XC6VLX550T-2FF1759C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and medical imaging backend systems requiring stable component supply over extended industrial lifecycles.

Supply support for XC6VLX550T-2FF1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU architectures for data center, aerospace, and industrial markets.

The Virtex-6 family was originally designed by Xilinx for high-bandwidth, low-latency compute-intensive applications in defense electronics, wired communications infrastructure, and scientific instrumentation.

FAQ

What is the maximum supported transceiver data rate for XC6VLX550T-2FF1759C?

The XC6VLX550T-2FF1759C supports GTP transceivers operating from 600 Mb/s up to 6.6 Gb/s per lane. This range covers SATA II (3 Gb/s), CPRI (up to 6.144 Gb/s), and SRIO Gen2 (5 Gb/s) protocols. Performance is guaranteed under -2 speed grade conditions with proper reference clock jitter and PCB channel loss compliance.

Does XC6VLX550T-2FF1759C include hard IP for PCI Express?

Yes, XC6VLX550T-2FF1759C integrates a hardened PCI Express v2.0 endpoint block supporting x1, x2, x4, and x8 configurations. It handles link training, transaction layer packet (TLP) generation, and data scrambling without consuming programmable logic resources, reducing design verification effort for host interface implementation.

What I/O standards are supported by XC6VLX550T-2FF1759C?

XC6VLX550T-2FF1759C supports 18 SelectIO standards including LVDS, LVPECL, SSTL-18/25, HSTL-I/III, and differential signaling with internal termination. Each of its 720 user I/Os can be independently configured per bank, enabling mixed-voltage operation across interfaces such as DDR3 memory, CMOS sensors, and high-speed ADCs.

Is partial reconfiguration supported on XC6VLX550T-2FF1759C?

Yes, XC6VLX550T-2FF1759C supports partial reconfiguration through Xilinx ISE Design Suite tools. This capability allows dynamic replacement of functional modules-such as digital down-converters or encryption engines-while the rest of the design remains operational, critical for mission-critical systems requiring zero-downtime updates.

What is the thermal design power (TDP) of XC6VLX550T-2FF1759C?

The typical thermal design power (TDP) of XC6VLX550T-2FF1759C is 29.5 W under worst-case operating conditions (-2 speed grade, 85°C junction temperature, full utilization). Actual power varies with design utilization, I/O activity, and transceiver count; Xilinx XPower Analyzer provides accurate estimation based on placed-and-routed bitstreams.