AMD XC6VLX550T-2FFG1759C
- Part No.:
- XC6VLX550T-2FFG1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VLX550T-2FFG1759C.pdf
- Description:
- IC FPGA 840 I/O 1759FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,675
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Product details
Overview
XC6VLX550T-2FFG1759C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 551,680 logic cells, 24.5 Mb of block RAM, 2,520 DSP48E1 slices, and 72 GTX transceivers operating up to 6.6 Gb/s. It is used in high-speed serial communication systems, radar signal processing, and reconfigurable computing platforms.
For engineers reviewing the XC6VLX550T-2FFG1759C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (720 user I/Os), speed grade (-2), thermal performance in FFG1759 package, and GTX transceiver compliance with PCIe Gen2 and SRIO v2.
Technical Context
The XC6VLX550T-2FFG1759C implements a fully programmable logic architecture based on 4-input LUTs and distributed RAM, with integrated clock management using DCM and PLL blocks supporting jitter filtering and phase alignment. It supports multi-gigabit serial protocols including PCIe Gen2, SATA, and SRIO via dedicated GTX transceivers.
Configuration is performed via Master SelectMAP or JTAG, with support for dual-boot and fallback modes. The device uses 40 nm CMOS process technology and operates at core voltage of 1.0 V ±3% with I/O banks configurable for LVDS, SSTL, HSTL, and TMDS signaling standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 551,680 - total available LUT-based configurable logic resources for custom digital logic implementation |
| Block RAM | 24.5 Mb - embedded memory capacity usable as FIFOs, buffers, or lookup tables without external memory |
| DSP Slices | 2,520 DSP48E1 - hardwired arithmetic units enabling high-throughput multiply-accumulate operations |
| GTX Transceivers | 72 × 6.6 Gb/s - serial I/O capable of native PCIe Gen2 x8 or SRIO v2 x4 lane configurations |
| User I/O Pins | 720 - configurable single-ended and differential I/Os across 24 banks with independent voltage support |
| Speed Grade | -2 - guarantees timing closure at specified maximum frequencies for logic and I/O paths |
| Package | FFG1759 - 1759-pin flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
The XC6VLX550T-2FFG1759C is housed in a 1759-pin flip-chip fine-pitch BGA (FFG1759) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal management in high-power FPGA applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0 V ±3% to FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration circuitry, JTAG, and select I/O banks |
| VCCO | I/O bank power | Per-bank voltage source (1.2–3.3 V) defining output swing and input threshold for associated pins |
| CONFIG_IO | Configuration interface | Multi-function pins supporting Master SelectMAP, Slave Serial, or JTAG configuration modes |
| GTX_RX/TX | High-speed serial transceiver | Differential pairs supporting 600 Mb/s to 6.6 Gb/s data rates with built-in CDR and equalization |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | DCM and PLL blocks enable precise clock synthesis, phase shifting, and jitter reduction for synchronous system design |
| PCIe Gen2 Endpoint Support | Native hard IP enables compliant endpoint operation without soft-core overhead or timing closure risk |
| Partial Reconfiguration | Allows dynamic module swapping in-system without full device reset or service interruption |
| Advanced Configuration Security | Bitstream encryption (AES-256) and HMAC authentication prevent unauthorized programming and cloning |
| Thermal Monitoring Diode | On-die sensor provides real-time junction temperature feedback for thermal throttling or fan control |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel filter banks and FFT engines; GTX transceivers interface with ADC/DAC modules and backhaul links. Use Value: 2,520 DSP48E1 slices deliver >2.5 TeraMAC/s compute density for adaptive filtering under deterministic latency. | Use Scenario: High-throughput image reconstruction in MRI and CT scanners using iterative algorithms. IC Role / Device Role / Timing Role: Configurable logic accelerates back-projection and denoising kernels; block RAM buffers raw projection data streams. Use Value: 24.5 Mb of block RAM eliminates external DDR bottleneck, reducing reconstruction latency by up to 40%. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 protocol bridging in flight control subsystems. IC Role / Device Role / Timing Role: Soft-core processor manages protocol stacks while GTX transceivers handle deterministic packet routing and timestamping. Use Value: -2 speed grade ensures sub-50 ns end-to-end latency for time-critical avionics messages. | Use Scenario: Bit-error-rate testing and protocol validation for 10G Ethernet and Fibre Channel interfaces. IC Role / Device Role / Timing Role: Generates and analyzes PRBS patterns at line rate; GTX transceivers operate in loopback and error injection modes. Use Value: 72 GTX transceivers allow concurrent multi-port test coverage without external muxing hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, higher logic density (2,586K LC), 100+ GTY transceivers (up to 32.75 Gb/s), 0.85 V core voltage | Targets next-generation 5G infrastructure and AI inference where bandwidth and compute density exceed Virtex-6 limits | Select when migrating from legacy Virtex-6 designs requiring higher throughput, lower power per function, or support for PAM4 signaling |
| XC7VX690T-2FFG1927I | Virtex-7 architecture, 693,120 logic cells, 4,860 DSP48E2 slices, 48 GTH transceivers (up to 13.1 Gb/s), 1.0 V core | Suitable for upgrades needing more DSP resources and transceiver bandwidth while retaining similar I/O voltage flexibility | Prefer for new designs requiring PCIe Gen3 or 10GBase-R MAC offload with minimal architectural rework |
Compared with XC6VLX550T-2FFG1759C, the XC7VX690T offers higher DSP count and faster transceivers for Gen3 serial protocols, while the XCVU9P delivers scalable bandwidth and advanced SerDes for emerging 400G/800G systems-neither is pin-compatible, requiring board redesign.
Availability
XC6VLX550T-2FFG1759C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX550T-2FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-6 family was engineered for high-performance logic, serial connectivity, and DSP-intensive applications in aerospace, defense, and wired communications infrastructure.
FAQ
What is the maximum data rate supported by the GTX transceivers in XC6VLX550T-2FFG1759C?
The GTX transceivers in XC6VLX550T-2FFG1759C support a maximum data rate of 6.6 Gb/s per lane. This enables compliance with PCIe Gen2, SRIO v2, and SATA II protocols. The transceiver architecture includes built-in clock data recovery, pre-emphasis, and receiver equalization to maintain signal integrity at this rate. XC6VLX550T-2FFG1759C achieves this performance within specified temperature and voltage ranges defined in the official Virtex-6 DC and switching characteristics documentation.
Does XC6VLX550T-2FFG1759C support partial reconfiguration?
Yes, XC6VLX550T-2FFG1759C supports partial reconfiguration through its FPGA fabric and configuration logic. This capability allows dynamic replacement of specific logic modules without resetting the entire device or interrupting active functions. Implementation requires use of Xilinx ISE Design Suite 14.7 or later with appropriate constraints and bitstream generation flow. XC6VLX550T-2FFG1759C leverages frame-based configuration memory access to enable secure, verified module swaps during runtime.
What I/O standards are supported by XC6VLX550T-2FFG1759C?
XC6VLX550T-2FFG1759C supports LVDS, Mini-LVDS, RSDS, BLVDS, SSTL, HSTL, and TMDS across its 24 configurable I/O banks. Each bank operates independently with selectable VCCO voltages from 1.2 V to 3.3 V. Differential standards support internal termination and programmable drive strength. XC6VLX550T-2FFG1759C does not support current-mode logic (CML) or PECL natively without external level-shifting circuitry.
What is the core voltage requirement for XC6VLX550T-2FFG1759C?
XC6VLX550T-2FFG1759C requires a nominal core supply voltage of 1.0 V with a tolerance of ±3%, as specified in the Virtex-6 DC and switching characteristics datasheet. This voltage must be delivered with low noise and tight regulation, especially under dynamic switching loads. XC6VLX550T-2FFG1759C includes dedicated VCCINT monitoring circuitry to trigger brown-out protection if voltage falls outside operational range.
Is XC6VLX550T-2FFG1759C still in active production?
XC6VLX550T-2FFG1759C is in long-term availability status with AMD/Xilinx, supported under the Virtex-6 product discontinuance notice (PDN) program. While no longer in high-volume production, it remains available through authorized distributors and Aetrix Electronics with controlled-lifecycle sourcing. XC6VLX550T-2FFG1759C continues to be qualified for aerospace and defense applications with extended temperature screening options.
XC6VLX550T-2FFG1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 42960
- Number of Logic Elements/Cells:
- 549888
- Total RAM Bits:
- 23298048
- Number of I/O:
- 840
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VLX550T-2FFG1759C FAQ
1.How can I place an order for XC6VLX550T-2FFG1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX550T-2FFG1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX550T-2FFG1759C reliable?
The price and inventory of XC6VLX550T-2FFG1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX550T-2FFG1759C is usually 5 days.
3.What payment methods are accepted for XC6VLX550T-2FFG1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX550T-2FFG1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX550T-2FFG1759C?
XC6VLX550T-2FFG1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX550T-2FFG1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX550T-2FFG1759C?
For technical support, including XC6VLX550T-2FFG1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX550T-2FFG1759C requirements.
6.How does Aetrix verify that XC6VLX550T-2FFG1759C is sourced from the original manufacturer or authorized distributors?
All XC6VLX550T-2FFG1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX550T-2FFG1759C meets industry standards.
7.What is the process for return or replacement of XC6VLX550T-2FFG1759C?
All XC6VLX550T-2FFG1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX550T-2FFG1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX550T-2FFG1759C part is unused and in its original packaging.
Return procedure for XC6VLX550T-2FFG1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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