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AMD XC6VLX75T-1FF784C

Part No.:
XC6VLX75T-1FF784C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
784-BBGA, FCBGA
Datasheet:
AetrixXC6VLX75T-1FF784C.pdf
Description:
IC FPGA 360 I/O 784FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,499

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Product details

Overview

XC6VLX75T-1FF784C from AMD (formerly Xilinx) is a Virtex-6 FPGA with 74,496 logic cells, 12.8 Gb/s transceiver capability, and 1.2 V core voltage, configured in a 784-pin Flip-Chip Fine-Pitch BGA package for high-speed serial interface and DSP-intensive embedded systems.

For engineers reviewing the XC6VLX75T-1FF784C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, CLB count, I/O bank voltage support, and thermal performance in compact PCB layouts.

Technical Context

The XC6VLX75T-1FF784C implements a 40 nm FPGA architecture with integrated multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. It features dual-register 6-input LUTs, block RAM with byte-write enable, and clock management tiles with MMCM and PLL.

It supports SelectIO standards up to 1.8 V across 16 I/O banks, includes dedicated DSP48E1 slices for arithmetic-intensive tasks, and uses configuration via Master SPI or JTAG with AES bitstream encryption.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells74,496 CLBs - determines maximum combinational and sequential logic capacity for system-on-chip integration
Transceiver Speed12.8 Gb/s - enables single-lane PCIe Gen2 x4 or dual-lane SATA 3.0 links without external retimers
Block RAM4,032 kbits - supports large on-die FIFOs, coefficient storage, or frame buffers in video processing pipelines
DSP Slices240 DSP48E1 - delivers 240 parallel multiply-accumulate operations per clock for real-time filtering or FFT acceleration
I/O Banks16 banks - allows independent voltage assignment (1.2–1.8 V) per bank for mixed-voltage interface bridging
ConfigurationMaster SPI or JTAG - enables secure, field-upgradable bitstream loading with AES-256 encryption support

Pinout & Package

XC6VLX75T-1FF784C is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FF784) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputSynchronizes master SPI configuration data loading; requires stable 50 MHz max clock during bitstream load
DINSerial Configuration Data InputAccepts encrypted or unencrypted bitstream from SPI flash; latched on rising CCLK edge
INIT_BConfiguration Status OutputActive-low open-drain signal indicating configuration memory readiness or error condition
PROGRAM_BConfiguration Reset InputActive-low asynchronous reset that clears configuration memory and restarts startup sequence
GTX_CLK0_M2P/GTX_CLK0_M2NDifferential Transceiver Reference Clock InputProvides low-jitter reference for GTX transceivers; must be routed as controlled-impedance differential pair

Key Features

FeatureDesign Value
Integrated GTX TransceiversSupports 600 Mb/s to 12.8 Gb/s line rates with built-in 8B/10B encoding and elastic buffers for protocol alignment
MMCM + PLL Clock ManagementEnables jitter reduction, frequency synthesis, and phase shifting across multiple clock domains with sub-degree resolution
DSP48E1 Slice ArchitectureIncludes pre-adder, multiplier, accumulator, and pattern detector for pipelined math-intensive algorithms
SelectIO TechnologySupports LVDS, SSTL, HSTL, and differential signaling standards with programmable drive strength and slew rate control
AES Bitstream EncryptionPrevents unauthorized cloning or reverse engineering by encrypting configuration memory using 256-bit keys stored in eFUSE

Applications

Radar Signal ProcessingHigh-Speed Data Acquisition

Use Scenario: Real-time pulse-Doppler processing in phased-array radar systems with >100 MSPS ADC inputs and beamforming output.

IC Role / Device Role / Timing Role: FPGA fabric performs time-domain correlation, CFAR detection, and digital down-conversion using DSP48E1 slices and block RAM.

Use Value: XC6VLX75T-1FF784C delivers deterministic latency under 200 ns and supports 12.8 Gb/s JESD204B link aggregation for multi-channel ADC synchronization.

Use Scenario: Multi-channel oscilloscope front-end capturing 16-bit samples at 250 MS/s across 8 channels with real-time FFT and trigger analysis.

IC Role / Device Role / Timing Role: XC6VLX75T-1FF784C serves as the real-time processing engine, managing DDR3 memory buffering, decimation filters, and display-ready waveform rendering.

Use Value: XC6VLX75T-1FF784C provides 74,496 logic cells and 4,032 kbits of block RAM to sustain concurrent acquisition, processing, and UI update without pipeline stalls.

PCIe Gen2 Endpoint AccelerationAvionics Data Concentrator

Use Scenario: FPGA-based co-processor card accelerating image compression and metadata tagging in server-side vision analytics pipelines.

IC Role / Device Role / Timing Role: XC6VLX75T-1FF784C implements PCIe Gen2 x4 endpoint logic with DMA engines and AXI interconnect to host CPU and local DDR3.

Use Value: XC6VLX75T-1FF784C achieves sustained 1.6 GB/s bidirectional throughput with <500 ns transaction latency using native PCIe hard IP blocks.

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data concentrator in flight control subsystems requiring deterministic latency and dual-redundant I/O.

IC Role / Device Role / Timing Role: XC6VLX75T-1FF784C hosts dual AFDX end-system controllers, time-triggered scheduler, and 1553B bus controller with watchdog monitoring.

Use Value: XC6VLX75T-1FF784C meets DO-254 Level A requirements with dual-lockstep configuration and ECC-protected block RAM for fault-tolerant operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGB2104I16 nm process, 2.5× higher logic density (2,586K LUTs), 32.75 Gb/s GTY transceivers, no backward-compatible pinoutTargets next-gen radar and AI inference where XC6VLX75T-1FF784C lacks sufficient resources or bandwidthChoose only when migrating to newer architecture with full redesign; not drop-in compatible
XC7VX690T-2FFG1927I28 nm process, 690K logic cells, 13.1 Gb/s GTX transceivers, same 784-pin FFG package but different pin mapping and I/O bank layoutOffers higher resource count for complex SoC designs while retaining similar board footprint and thermal envelopeRequires PCB redesign due to non-identical pinout; suitable for upgrade path with layout revision

Compared with XC6VLX75T-1FF784C, the XC7VX690T-2FFG1927I provides greater logic capacity and marginally higher transceiver speed but demands board-level changes, whereas the XCVU9P-2FLGB2104I delivers generational bandwidth and density gains at the cost of full architectural requalification.

Availability

XC6VLX75T-1FF784C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and PCIe Gen2 endpoint acceleration requiring stable component supply across long-life industrial and defense programs.

Supply support for XC6VLX75T-1FF784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and ACAPs for high-performance and mission-critical applications.

The Virtex-6 family was originally designed by Xilinx for compute-intensive, high-bandwidth applications such as wired communications infrastructure, military radar, and scientific instrumentation.

FAQ

What is the maximum supported transceiver line rate for XC6VLX75T-1FF784C?

The XC6VLX75T-1FF784C supports a maximum transceiver line rate of 12.8 Gb/s using its GTX transceivers. This enables compliance with PCIe Gen2, SATA 3.0, and SRIO Gen2 protocols. The actual achievable rate depends on PCB layout quality, reference clock jitter, and termination matching. XC6VLX75T-1FF784C does not support GTY or GTH transceivers found in later Virtex-7 or UltraScale families.

Does XC6VLX75T-1FF784C support JTAG boundary-scan testing?

Yes, XC6VLX75T-1FF784C fully supports IEEE 1149.1 JTAG boundary-scan for device programming, debugging, and interconnect verification. The TDI, TDO, TMS, TCK, and TRST_B pins are dedicated and electrically compliant with standard JTAG voltage levels. XC6VLX75T-1FF784C also supports internal BSCAN primitives for accessing internal logic states during runtime diagnostics.

What configuration modes are supported by XC6VLX75T-1FF784C?

XC6VLX75T-1FF784C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI is most commonly used with external SPI flash memory, while JTAG is preferred for development and debug. XC6VLX75T-1FF784C requires proper initialization timing and power sequencing-specifically, VCCINT must be stable before configuration begins-and supports AES-256 bitstream encryption in all modes except JTAG-only unencrypted loads.

Is XC6VLX75T-1FF784C qualified for extended temperature operation?

The 'C' suffix in XC6VLX75T-1FF784C denotes commercial temperature grade (0 °C to +85 °C case temperature). It is not rated for industrial (–40 °C to +100 °C) or automotive grades. For extended temperature applications, designers should consider the 'I' or 'E' variants of the Virtex-6 family, though those use different part numbers and may have distinct pinouts or power characteristics. XC6VLX75T-1FF784C itself has no extended-temperature qualification.

Can XC6VLX75T-1FF784C implement PCI Express Gen2 endpoints without external PHYs?

Yes, XC6VLX75T-1FF784C integrates hardened PCIe Gen2 endpoint blocks that handle physical layer encoding, link training, and transaction layer protocol-eliminating the need for external PHYs. It supports x1, x2, x4, and x8 lane configurations with automatic speed negotiation and hot-plug detection. XC6VLX75T-1FF784C requires correct reference clock routing and PCIe-compliant board stackup but does not rely on discrete SerDes components for basic Gen2 functionality.

XC6VLX75T-1FF784C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 LXT
Package/Case:
784-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5820
Number of Logic Elements/Cells:
74496
Total RAM Bits:
5750784
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
784-FCBGA (29x29)

XC6VLX75T-1FF784C FAQ

1.How can I place an order for XC6VLX75T-1FF784C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VLX75T-1FF784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VLX75T-1FF784C reliable?

The price and inventory of XC6VLX75T-1FF784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX75T-1FF784C is usually 5 days.

3.What payment methods are accepted for XC6VLX75T-1FF784C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX75T-1FF784C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VLX75T-1FF784C?

XC6VLX75T-1FF784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VLX75T-1FF784C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VLX75T-1FF784C?

For technical support, including XC6VLX75T-1FF784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX75T-1FF784C requirements.

6.How does Aetrix verify that XC6VLX75T-1FF784C is sourced from the original manufacturer or authorized distributors?

All XC6VLX75T-1FF784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX75T-1FF784C meets industry standards.

7.What is the process for return or replacement of XC6VLX75T-1FF784C?

All XC6VLX75T-1FF784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX75T-1FF784C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VLX75T-1FF784C part is unused and in its original packaging.

Return procedure for XC6VLX75T-1FF784C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VLX75T-1FF784C Tags

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