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AMD XC6VLX75T-1FFG484C
- Part No.:
- XC6VLX75T-1FFG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6VLX75T-1FFG484C.pdf
- Description:
- IC FPGA 240 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,083
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Product details
Overview
XC6VLX75T-1FFG484C from AMD is a Virtex-6 FPGA featuring 74,496 logic cells, 12.8 Gb/s transceiver capability, and 1.2 V core voltage in a 484-pin FCBGA package; used in high-speed serial interface bridging and reconfigurable signal processing systems.
For engineers reviewing the XC6VLX75T-1FFG484C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage flexibility, CLB density, and thermal performance under sustained 200 MHz system clock operation.
Technical Context
The XC6VLX75T-1FFG484C implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and integrated DSP48E1 slices supporting 25×18-bit multiply-accumulate operations. It includes 12 GTX transceivers compliant with PCIe Gen2, SATA, and SRIO standards.
Configuration is performed via Master SelectMAP or JTAG, with support for dual-boot from two external SPI flash devices. The device uses 40 nm process technology and supports -1 speed grade (1.2 V core, 600 Mbps DDR3 I/O).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,496 - determines maximum combinational/sequential logic capacity for custom datapaths |
| GTX Transceivers | 12 × 12.8 Gb/s - enables multi-lane PCIe Gen2 x8 or quad-SRIO v2.1 links |
| Block RAM | 3,328 kbits - supports large FIFOs, coefficient storage, or frame buffers without external memory |
| DSP Slices | 168 × DSP48E1 - delivers 168 parallel 25×18-bit MAC operations per clock cycle |
| I/O Pins | 240 user-configurable - supports mixed-voltage banks (1.2–3.3 V) for interfacing with legacy and modern peripherals |
| Speed Grade | -1 - guarantees timing closure at 600 Mbps DDR3 I/O and 200 MHz system clock under industrial temperature |
Pinout & Package
XC6VLX75T-1FFG484C is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 21×21 mm body size, 1.0 mm ball pitch, and Pb-free / RoHS-compliant construction. Thermal pad on underside requires solder paste stencil design per Xilinx UG373.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for logic fabric and CLBs; decoupling critical within 10 mm of each power ball |
| VCCAUX | Auxiliary power supply | 2.5 V for configuration logic, clock management, and transceiver reference circuits |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3 V per bank; sets output swing and input threshold for associated pins |
| M0–M2 | Mode configuration pins | Set boot mode (e.g., Master SelectMAP, JTAG, Slave Serial) at power-up |
| CLK_IN | Dedicated clock input | Accepts single-ended or differential clocks up to 800 MHz for MMCM/PLL clock synthesis |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express® Endpoint | Hard IP block supporting Gen2 x1/x2/x4/x8 with full DMA and TLP handling |
| Multi-Gigabit Transceivers (GTX) | 12 lanes with built-in 8B/10B encoder/decoder, comma detection, and elastic buffer |
| Advanced Clock Management (MMCM) | Two MMCMs per device provide fine-grained phase shift, frequency synthesis, and jitter filtering |
| Partial Reconfiguration Support | Enables dynamic module swapping without resetting entire logic fabric or I/O state |
| AXI4-Stream Interface Logic | Native support for AXI4-Stream protocol on internal interconnect for high-throughput data flow |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable datapath accelerator implementing FFT, CFAR, and digital down-conversion pipelines. Use Value: 12 GTX transceivers enable direct JESD204B interface to ADC/DAC arrays; 168 DSP slices sustain 2.4 GOPS at 200 MHz. | Use Scenario: High-resolution ultrasound image reconstruction and DICOM compression pipeline. IC Role / Device Role / Timing Role: Co-processor managing time-critical echo data alignment, beam summation, and JPEG2000 encoding. Use Value: 3,328 kbits block RAM buffers full-frame RF data; AXI4-Stream integration simplifies connection to ARM-based host processors. |
| Avionics Data Concentrator | Test & Measurement Instrumentation |
Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O aggregation in flight control computers. IC Role / Device Role / Timing Role: Protocol translation hub with deterministic latency and dual-redundant configuration support. Use Value: Partial reconfiguration allows hot-swap of bus controller firmware; -1 speed grade ensures timing margin across -55°C to +100°C. | Use Scenario: Modular oscilloscope front-end with real-time waveform analysis and PCIe Gen2 host streaming. IC Role / Device Role / Timing Role: High-speed acquisition engine synchronizing ADC sampling, triggering, and packetized data transfer. Use Value: 240 user I/O pins support simultaneous LVDS, HSTL, and SSTL interfaces; GTX lanes feed raw samples directly to host PC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture, 258K LUTs, 100+ GTY transceivers, 0.85 V core | Higher bandwidth, lower power per function, but requires new PCB layout and toolchain migration | Preferred for new designs targeting >25 Gb/s serial I/O or AI-accelerated inference |
| XC7VX690T-2FFG1927I | Virtex-7 architecture, 693K LUTs, 36 GTH transceivers, -2 speed grade | Greater logic density and transceiver count, but larger 1927-ball package and higher thermal envelope | Suitable when migrating legacy Virtex-6 designs needing headroom for future feature expansion |
Compared with XC6VLX75T-1FFG484C, the XCVU9P offers superior serial bandwidth and energy efficiency but demands full toolchain and layout revision; the XC7VX690T provides incremental scalability within the same design ecosystem while increasing board area and cooling requirements.
Availability
XC6VLX75T-1FFG484C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and test & measurement instrumentation requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX75T-1FFG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-6 family, including XC6VLX75T-1FFG484C, was originally designed for high-performance reconfigurable computing in wired infrastructure, aerospace, and defense systems demanding deterministic latency and multi-protocol serial connectivity.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6VLX75T-1FFG484C?
The XC6VLX75T-1FFG484C supports DDR3 interfaces up to 600 Mbps (300 MHz clock) in I/O banks configured for SSTL15. This speed is guaranteed under -1 speed grade conditions with proper termination and board layout per Xilinx UG373. The XC6VLX75T-1FFG484C does not support DDR4 or LPDDR3 protocols.
Does XC6VLX75T-1FFG484C include hard IP for PCI Express Gen2?
Yes, the XC6VLX75T-1FFG484C integrates a hard PCI Express Gen2 Endpoint block supporting x1, x2, x4, and x8 configurations with full Transaction Layer Packet handling and DMA engine. This IP is pre-verified and consumes no logic resources, enabling rapid PCIe integration without soft-core overhead. The XC6VLX75T-1FFG484C does not support Gen3 or Gen4.
What configuration modes are supported by XC6VLX75T-1FFG484C?
The XC6VLX75T-1FFG484C supports Master SelectMAP, Slave SelectMAP, JTAG, and Slave Serial configuration modes, selected via M0–M2 pins at power-up. Dual-boot capability allows fallback to secondary SPI flash if primary image fails CRC check. Configuration bitstream can be encrypted using AES-256 with key stored in eFUSE. The XC6VLX75T-1FFG484C does not support passive parallel or BPI configuration.
Can XC6VLX75T-1FFG484C operate in extended temperature ranges?
The XC6VLX75T-1FFG484C commercial grade (suffix C) is rated for 0°C to +85°C ambient operation. Industrial-grade variants (suffix I) support -40°C to +100°C and are available under separate orderable part numbers. Thermal design must account for 12.5 W typical power dissipation at full utilization; heatsink attachment is recommended above 5 W junction rise. The XC6VLX75T-1FFG484C does not qualify for automotive AEC-Q100 or military MIL-STD-883 testing.
Is partial reconfiguration supported on XC6VLX75T-1FFG484C?
Yes, the XC6VLX75T-1FFG484C supports partial reconfiguration through dedicated ICAP (Internal Configuration Access Port) and frame-based bitstream loading. This enables dynamic swapping of functional modules-such as protocol engines or filter coefficients-without resetting the entire device or disrupting active I/O. Implementation requires Vivado Design Suite 2018.3 or later. The XC6VLX75T-1FFG484C does not support run-time reconfiguration of transceiver or clock management blocks.
XC6VLX75T-1FFG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5820
- Number of Logic Elements/Cells:
- 74496
- Total RAM Bits:
- 5750784
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6VLX75T-1FFG484C FAQ
1.How can I place an order for XC6VLX75T-1FFG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX75T-1FFG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX75T-1FFG484C reliable?
The price and inventory of XC6VLX75T-1FFG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX75T-1FFG484C is usually 5 days.
3.What payment methods are accepted for XC6VLX75T-1FFG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX75T-1FFG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX75T-1FFG484C?
XC6VLX75T-1FFG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX75T-1FFG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX75T-1FFG484C?
For technical support, including XC6VLX75T-1FFG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX75T-1FFG484C requirements.
6.How does Aetrix verify that XC6VLX75T-1FFG484C is sourced from the original manufacturer or authorized distributors?
All XC6VLX75T-1FFG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX75T-1FFG484C meets industry standards.
7.What is the process for return or replacement of XC6VLX75T-1FFG484C?
All XC6VLX75T-1FFG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX75T-1FFG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX75T-1FFG484C part is unused and in its original packaging.
Return procedure for XC6VLX75T-1FFG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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